Abstract: Provided is a portable apparatus for measuring a manipulation force. The apparatus includes a manipulation force measurement unit configured to measure a manipulation force applied on a manipulated part in a first direction of pushing forward or pulling backward and measure a manipulation force in a second direction of moving toward left or right, and a controller configured to process the measured manipulation force to generate manipulation force information over time.

Abstract: The present invention provides a composition for antifreezing including a gold (Au) nanostructure in which at least a portion thereof is concave, thereby it is possible to increase a survival rate of cells due to having excellent effect of inhibiting ice recrystallization when cryopreservation of the cells, and maintain a texture of food even when using in the freezing of food.

Abstract: A parking control apparatus and a parking control method are provided. According to at least one aspect, the present disclosure provides a parking control apparatus including a signal processor, a determinator, and a controller. the signal processor is configured to receive first to Nth radar signals reflected from first to Nth regions of a ground surface from one or more radars disposed in a vehicle and to calculate information about the first to Nth regions, wherein N is a natural number. the determinator is configured to determine whether the ground surface is a slope based on the information about the first to Nth regions and to determine whether parking the vehicle is possible. the controller is configured to generates control information for controlling parking of the vehicle according to a determination result of the determinator.

Abstract: The present invention relates to a technique for effectively processing a large amount of video data which are generated by cameras (e.g., CCTV cameras). Particularly, the present invention relates to a video processing technique of image quality compensation, in which a compensation of image quality is periodically performed by high-resolution image switching when video streams of a plurality of resolution (e.g., 4K, 1K (Full-HD)) are provided from a camera, thereby maintaining storage capacity for storing videos at the level of low-resolution video and maintaining an object identification effect in video search at the level of high-resolution video.

Abstract: Provided are a method of evaluating biogas power generation suitability performed by a biogas power generation suitability evaluation server including a processor and a memory, the method comprises extracting, from satellite image data of an evaluation target area, an area corresponding to the evaluation target area, calculating a size of biogas generation facilities included in the evaluation target area based on the extracted area, calculating a biogas concentration of the evaluation target area from the satellite image data and evaluating the biogas power generation suitability based on the size of the biogas generation facilities and the biogas concentration of the evaluation target area, wherein the calculating of the biogas concentration of the evaluation target area comprises calculating an average value of biogas concentrations of area corresponding to the evaluation target area, and the evaluating of the biogas power generation suitability comprises calculating, based on the size of the biogas genera

Abstract: Provided are a method of evaluating biogas power generation suitability performed by a biogas power generation suitability evaluation server including a processor and a memory, the method comprises extracting, from satellite image data of an evaluation target area, an area corresponding to the evaluation target area, calculating a size of biogas generation facilities included in the evaluation target area based on the extracted area, calculating a biogas concentration of the evaluation target area from the satellite image data and evaluating the biogas power generation suitability based on the size of the biogas generation facilities and the biogas concentration of the evaluation target area, wherein the calculating of the biogas concentration of the evaluation target area comprises calculating an average value of biogas concentrations of area corresponding to the evaluation target area, and the evaluating of the biogas power generation suitability comprises calculating, based on the size of the biogas genera

Abstract: A parking control apparatus and a parking control method are provided. According to at least one aspect, the present disclosure provides a parking control apparatus including a signal processor, a determinator, and a controller. the signal processor is configured to receive first to Nth radar signals reflected from first to Nth regions of a ground surface from one or more radars disposed in a vehicle and to calculate information about the first to Nth regions, wherein N is a natural number. the determinator is configured to determine whether the ground surface is a slope based on the information about the first to Nth regions and to determine whether parking the vehicle is possible. the controller is configured to generates control information for controlling parking of the vehicle according to a determination result of the determinator.

Abstract: A waterproof paint state determining method of a building using a satellite imagery according to an exemplary embodiment of the present disclosure includes receiving search information including information about a location in which a waterproof paint application state of a rooftop of a building is to be measured from a user; searching a search satellite imagery which is at least one satellite imagery corresponding to the search information from a satellite imagery DB including a plurality of satellite imagery data; detecting a rooftop area which is a waterproof paint application area of at least one building corresponding to the search information from the search satellite imagery, using a convolutional neural network (CNN) technique; and calculating a state index which is an index indicating a waterproof paint application state of at least one building, based on reference color information and color information of the rooftop area.

Abstract: An exterior cap of transfer set for peritoneal dialysis, including: a cylindrical cap unit to which the end connector of the peritoneal transfer set is coupled; a guide unit that is coupled to the cap unit, extends to the peritoneal transfer set to provide an expanding internal space, and guides the end connector of the peritoneal transfer set into the cap unit; and a coupling-separating unit that combines the cap unit and the guide unit with each other and separates the cap unit and the guide unit in accordance with selection of a user.

Abstract: An exterior cap of transfer set for peritoneal dialysis, including: a cylindrical cap unit to which the end connector of the peritoneal transfer set is coupled; a guide unit that is coupled to the cap unit, extends to the peritoneal transfer set to provide an expanding internal space, and guides the end connector of the peritoneal transfer set into the cap unit; and a coupling-separating unit that combines the cap unit and the guide unit with each other and separates the cap unit and the guide unit in accordance with selection of a user.

Abstract: The electric smart meter enabling demand response and method for the demand response are disclosed capable of acquiring an option and response information from a subscriber for enabling an active demand control, and to this end, the electric smart meter is embedded therewithin at least one or more integrated monitoring modules and includes microprocessors for transmitting a power control command to a relevant integrated monitoring module in response to a power control program based on the rate system, and controllably transmitting the measured and monitored data stored in the memory to the master server side via the communication module as well.

Abstract: The electric smart meter enabling demand response and method for the demand response are disclosed capable of acquiring an option and response information from a subscriber for enabling an active demand control, and to this end, the electric smart meter is embedded therewithin at least one or more integrated monitoring modules and includes microprocessors for transmitting a power control command to a relevant integrated monitoring module in response to a power control program based on the rate system, and controllably transmitting the measured and monitored data stored in the memory to the master server side via the communication module as well.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30-50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.

Abstract: An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality of interconnecting wire bonds attaching a plurality of contact pads on the IC to an associated plurality of solder-covered external contact terminals that are integrated in the lead frame. By integrally processing the external contact terminals, bonding wires may be affixed using a single wire bonding process. A method for manufacturing the BCC package preferably includes a dual photoresist patterning process accompanied by a dual wet etching process to create a plurality of highly reliable external contact terminals having improved bonding between the contact terminals and the encapsulating resin mold.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30-50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: A structure of a TFT substrate for a high resolution digital x-ray detector, in which two TFT substrates are arranged to be a double substrate by overlapping each other such that an upper plate is moved ½ pixel distance with respect to a lower plate in a direction along one axis. Thus, a difference in movement between the upper and lower plates is a ½ pixel distance. Also, two virtual pixels are obtained from one pixel. Three TFT substrates are arranged to be a triple substrate by overlapping one another such that a middle plate is moved a ½ pixel distance with respect to a lower plate in a direction along an X axis and an uppermost plate is arranged by being moved a ½ pixel distance with respect to the lower plate in a direction along a Y axis. Thus, resolution is increased as data of one pixel is divided into four data to be analyzed and an measured value of a pixel of each overlapping substrate is compared.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30–50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: Semiconductor chip stack structure and method are provided. A first chip has a first metal bump formed on a first electrode pad. The first chip is attached to and electrically connected to a substrate. The electrical connection is made by a bump reverse bonding method in which one end of a bonding wire is ball-bonded to the substrate and the other end is stitch-bonded to the metal bump. The second chip is stacked on the first chip. The bonding wire is substantially parallel with a top surface of the first chip. Accordingly, the chip stack structure and method minimize a space between the first chip and the second chip, thereby reducing the total height of semiconductor chip stack.

Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.