Patents by Inventor Sang Ho Jeong
Sang Ho Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149768Abstract: An embodiment armrest assembly for a vehicle includes an armrest including a main body and a lid, an armrest board to which the armrest is rotatably coupled and in which the armrest is accommodated in an erect state, and a skirt coupled to a rear bezel housing of the lid and to the armrest board and correspondingly covering a rear space of the lid when the armrest is rotated forward, wherein the skirt has a panel shape and includes a hard material.Type: ApplicationFiled: May 12, 2023Publication date: May 9, 2024Inventors: Tae Hoon Lee, Ji Hwan Kim, Byeong Seon Son, Sang Ho Kim, Sang Hoon Park, Il Hwan Bae, Jeong Ho Kim, Bong Jae Jeong, Min Soo Kim
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Publication number: 20240149767Abstract: An embodiment armrest assembly for a vehicle includes an armrest rotatably coupled to an armrest board and configured to be extended from the armrest board by rotating forward or to be housed in the armrest board by rotating and standing and a speed-reduction damper mechanism connecting the armrest and the armrest board and configured to make a rotational speed of the armrest uniform by reducing the rotational speed when the armrest rotates to be extended.Type: ApplicationFiled: April 19, 2023Publication date: May 9, 2024Inventors: Tae Hoon Lee, Ji Hwan Kim, Byeong Seon Son, Sang Ho Kim, Sang Hoon Park, Il Hwan Bae, Jeong Ho Kim, Bong Jae Jeong, Min Soo Kim
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Patent number: 11978232Abstract: A method of displaying 3-dimensional (3D) augmented reality includes transmitting a first image generated by photographing a target object at a first time point, and storing first view data at the first time point; receiving first relative pose data of the target object; estimating pose data of the target object, based on the first view data and the first relative pose data of the target object; generating a second image by photographing the target object at a second time point, and generating second view data at the second time point; estimating second relative pose data of the target object, based on the pose data of the target object and the second view data; rendering a 3D image of a virtual object, based on the second relative pose data of the target object; and generating an augmented image by augmenting the 3D image of the virtual object on the second image.Type: GrantFiled: March 28, 2022Date of Patent: May 7, 2024Assignee: NAVER LABS CORPORATIONInventors: Yeong Ho Jeong, Dong Cheol Hur, Sang Wook Kim
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Publication number: 20240146229Abstract: A motor-driving apparatus for driving a motor having a plurality of windings respectively corresponding to a plurality of phases is provided. The motor-driving apparatus includes a first inverter having a plurality of first switching devices and connected to first ends of the plurality of windings and a second inverter having a plurality of second switching devices and connected to second ends of the plurality of windings. A third switching device is configured to selectively connect and disconnect points at which a number of turns of each of the windings is divided in a preset ratio. A controller is configured to adjust an on/off state of the first to third switching devices based on required output of the motor.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Inventors: Kang Ho Jeong, Jong Kyong Lim, Suk Hyun Lim, Ji Woong Jang, Beom Sik Kim, Sang Cheol Shin
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Publication number: 20240136276Abstract: A semiconductor device includes a bottom metal line and a bottom electrode disposed on a substrate, a thick inter-metal dielectric layer disposed on the bottom metal line and the bottom electrode, a first via disposed on the bottom metal line disposed in the thick inter-metal dielectric layer, a second via disposed on the first via, a top metal line disposed on the second via and overlapping the bottom metal line, a low bandgap dielectric layer disposed on the thick inter-metal dielectric layer, a hard mask layer disposed on the low bandgap dielectric layer, a top electrode disposed on the hard mask layer and overlapping the bottom electrode, and a passivation layer disposed on the top metal line and the top electrode.Type: ApplicationFiled: April 11, 2023Publication date: April 25, 2024Applicant: KEY FOUNDRY CO., LTD.Inventors: Jong Yeul JEONG, Sang Geun KOO, Jeong Ho SHEEN, Kang Sup SHIN
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Publication number: 20240122020Abstract: Provided is a display device comprising a substrate, a first data line and a second data line disposed on the substrate and extended in a first direction, an anode electrode disposed on the first data line and the second data line, a pixel-defining film disposed over the anode electrode and defining an emission area, an organic light-emitting layer disposed on the anode electrode, and a cathode electrode disposed on the organic light-emitting layer, wherein each of the first data line and the second data line has a curved shape when viewed from a top where the first anode electrode and the second anode electrode overlap the anode electrode.Type: ApplicationFiled: June 1, 2023Publication date: April 11, 2024Inventors: Young Tae KIM, Hyun Gue SONG, Hyun Ho JUNG, Hee Seong JEONG, Sun Jin JOO, Sang Min HONG
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Patent number: 11944987Abstract: A pressurizing centrifugal dehydrator for removing moisture according to the present disclosure includes: an inner basket into which slurry is introduced; an outer basket surrounding the inner basket; a blocking barrier disposed in the outer basket; and a gas supplying portion for supplying gas into the inner basket and/or the outer basket, wherein a dehydration product is positioned between an outer circumference of the blocking barrier and an inner side of the outer basket to maintain airtightness of the outer basket.Type: GrantFiled: July 13, 2020Date of Patent: April 2, 2024Assignee: LG Chem, Ltd.Inventors: Sang Ho Lee, Dae Young Shin, Sung Woo Jeong, Eun Jung Joo
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Patent number: 11945276Abstract: The present disclosure discloses a preview vehicle height control system and a method of controlling the same. The system includes a monitoring device configured to detect the road surface condition of a driving path of a vehicle, an active suspension configured to adjust a vehicle height, a memory configured to store a plurality of data maps distinguished based on a type of bump, each data map having a vehicle dynamic characteristic as an input and a tuning factor as an output, and a controller configured to derive the tuning factor based on a data map, among the plurality of data maps of the memory, corresponding to the bump detected by the monitoring device, derive a target vehicle height in a form of a Gaussian distribution by substituting the tuning factor, and control the active suspension to follow the derived target vehicle height.Type: GrantFiled: August 19, 2022Date of Patent: April 2, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, FOUNDATION FOR RESEARCH AND BUSINESS SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Youngil Sohn, Min Jun Kim, Sang Woo Hwang, Sehyun Chang, Jun Ho Seong, Yong Hwan Jeong, Seong Jin Yim
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Publication number: 20240099104Abstract: A display device includes a light emitting element including a pixel electrode, a light emitting layer, and a common electrode. A capping layer is disposed on the common electrode. An auxiliary layer is disposed on the capping layer. A thin film encapsulation layer includes a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The first encapsulation layer includes a first inorganic insulating layer including silicon nitride; a second inorganic insulating layer including silicon oxide; and a third inorganic insulating layer including silicon oxynitride. The auxiliary layer has a thickness of 200 ? to 1400 ?, the first inorganic insulating layer has a thickness of 400 ? to 3500 ?, the second inorganic insulating layer has a thickness of 200 ? to 2400 ?, and the third inorganic insulating layer has a thickness of 4000 ? or more.Type: ApplicationFiled: May 8, 2023Publication date: March 21, 2024Inventors: Hyun Ho Jung, Young Tae Kim, Hyun Gue Song, Hee Seong Jeong, Sun Jin Joo, Sang Min Hong
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Patent number: 11935814Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.Type: GrantFiled: August 20, 2021Date of Patent: March 19, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Hyun Koo Lee, Jun Hee Park, Sang Cheol Shin, Kang Ho Jeong
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Publication number: 20240085282Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.Type: ApplicationFiled: August 23, 2023Publication date: March 14, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Min Chul JO, Sang Hyun PARK, Su Jin SHIN, Gil Ho GU, Dae Gon YU, So Yeon LEE, Yun Bin JEONG
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Patent number: 11929495Abstract: In some implementations, the anode includes a current collector, a first anode mixture layer formed on at least one surface of the current collector, and a second anode mixture layer formed on the first anode mixture layer. The first anode mixture layer and the second anode mixture layer include a carbon-based active material, respectively. The first anode mixture layer includes a first binder, a first silicon-based active material, and a first conductive material. The second anode mixture layer includes a second binder, a second silicon-based active material, and a second conductive material. Contents of the first conductive material and the second conductive material are different from each other with respect to the total combined weight of the first anode mixture layer and the second anode mixture layer. Types of the first silicon-based active material and the second silicon-based active material are different from each other.Type: GrantFiled: May 18, 2023Date of Patent: March 12, 2024Assignee: SK ON CO., LTD.Inventors: Hyo Mi Kim, Moon Sung Kim, Sang Baek Ryu, Da Hye Park, Seung Hyun Yook, Hwan Ho Jang, Kwang Ho Jeong, Da Bin Chung, Jun Hee Han
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Publication number: 20230187830Abstract: An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.Type: ApplicationFiled: May 18, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je Lee, Je Sang Park, Chang Gun Oh, Sang Ho Jeong, Hyun Kyung Park
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Patent number: 11658417Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.Type: GrantFiled: March 22, 2021Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je Lee, Chang Gun Oh, Hyun Kyung Park, Je Sang Park, Sang Ho Jeong, Yong Duk Lee
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Patent number: 11640952Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.Type: GrantFiled: February 28, 2020Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
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Patent number: 11631643Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.Type: GrantFiled: March 10, 2020Date of Patent: April 18, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang, Yong Duk Lee, Jin Won Lee, Yeo Il Park
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Patent number: 11627659Abstract: A printed circuit board includes a first insulating layer; a first wiring layer having at least a portion buried in one surface side of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer; a metal post disposed on the exposed one surface of at least the portion of the first wiring layer; and a second wiring layer disposed on the other surface of the first insulating layer. A width of a first surface, connected to the exposed one surface of at least a portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.Type: GrantFiled: April 23, 2021Date of Patent: April 11, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Sang Park, Sang Ho Jeong, Yong Duk Lee
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Patent number: 11587878Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.Type: GrantFiled: January 6, 2022Date of Patent: February 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong Duk Lee, Jin Won Lee
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Patent number: 11495546Abstract: A substrate having an electronic component embedded therein includes a core substrate including first and second wiring layers disposed on different levels and one or more insulating layers disposed between the first and second wiring layers, having a cavity in which a stopper layer is disposed on a bottom surface of the cavity, and including a groove disposed around the stopper layer on the bottom surface; an electronic component disposed on the stopper layer in the cavity; an insulating material covering at least a portion of each of the core substrate and the electronic component and disposed in at least a portion of each of the cavity and the groove; and a third wiring layer disposed on the insulating material. The stopper layer protrudes on the bottom surface.Type: GrantFiled: February 26, 2020Date of Patent: November 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Sang Park, Chang Yul Oh, Sang Ho Jeong, Yong Duk Lee
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Publication number: 20220190479Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.Type: ApplicationFiled: March 22, 2021Publication date: June 16, 2022Inventors: Yang Je LEE, Chang Gun OH, Hyun Kyung PARK, Je Sang PARK, Sang Ho JEONG, Yong Duk LEE