Patents by Inventor Sang Ho Noh

Sang Ho Noh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974901
    Abstract: Disclosed is a small animal intraventricular injection compensator for injecting a drug into a desired location through a syringe, the compensator including: a guide part provided with a guide hole into which a needle of a syringe is inserted; a body comprising an upper cavity provided inside thereof and a cradle provided to seat the guide part on an upper side thereof; and a fixation part integrally provided with the body or separately provided, and comprising a lower cavity provided to allow a head accommodation space, which a head of a small animal may enter into or exit from, to be provided inside thereof by corresponding to the upper cavity.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: May 7, 2024
    Assignees: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sung Gurl Park, Kang Hyun Han, Chang Mook Lim, So Ra Park, Hong Su Lee, Jae Bong Lee, Jung Ho Noh, Sang Seop Han
  • Publication number: 20240096954
    Abstract: A semiconductor device includes an active pattern including: a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction; a gate structure on the lower pattern and including a gate electrode and a gate insulating film including an interfacial insulating film including a first vertical portion and a horizontal portion. A dimension in a third direction of the first vertical portion is greater than a dimension in the second direction of the horizontal portion. The first vertical portion includes: a first area contacting a source/drain pattern; and a second area provided between the first area and the gate electrode. The interfacial insulating film includes a first element other than silicon, wherein a concentration of the first element in the first area is greater than a concentration of the first element in the second area.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Il Gyou SHIN, Hyun Ho NOH, Sang Yong KIM, You Bin KIM
  • Patent number: 10602076
    Abstract: According to various examples, a method for providing, in an electronic device, an image can comprise the steps of: obtaining a first image of a subject by using a camera functionally connected to the electronic device; generating at least one image comprising a second image to be related to the first image; and concurrently displaying the first image on a first region of a display functionally connected to the electronic device, and the second image on a second region of the display.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo-Yong Lee, Dong-Hyun Kim, Dong-Hoon Kim, Sang-Ho Noh, Kyung-Yul Seo, Jong-Hun Won
  • Publication number: 20180227506
    Abstract: According to various examples, a method for providing, in an electronic device, an image can comprise the steps of: obtaining a first image of a subject by using a camera functionally connected to the electronic device; generating at least one image comprising a second image to be related to the first image; and concurrently displaying the first image on a first region of a display functionally connected to the electronic device, and the second image on a second region of the display.
    Type: Application
    Filed: August 10, 2016
    Publication date: August 9, 2018
    Inventors: Woo-Yong LEE, Dong-Hyun KIM, Dong-Hoon KIM, Sang-Ho NOH, Kyung-Yul SEO, Jong-Hun WON
  • Publication number: 20120020829
    Abstract: Disclosed is a heat-resistant aluminum alloy including aluminum and two types of alloy elements which are combined while forming a homogeneous solid solution reinforcing phase. The disclosed heat-resistant aluminum alloy includes the alloy elements that form a homogeneous solid solution and do not have a solvus line with respect to aluminum as a matrix metal and, therefore, the formed homogeneous solid solution reinforcing phase does not react with aluminum even at a temperature up to 300° C., thus not becoming coarse or undergoing phase decomposition. Consequently, the disclosed aluminum alloy may have remarkably enhanced heat resistance.
    Type: Application
    Filed: January 25, 2010
    Publication date: January 26, 2012
    Applicant: KOREA AUTOMOTIVE TECHNOLOGY INSTITUTE
    Inventors: Si Young Sung, Beom Suck Han, Young Jig Kim, Bong Jae Choi, Yung Mun Ryu, Dong Ok Kim, Sang Ho Noh, Chang Su Hahn