Patents by Inventor Sang-Hoo Song

Sang-Hoo Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor memory device and method for manufacturing the same
    Patent number: 7462523
    Abstract: A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower conductive layer, and provided in a second interlayer insulating layer. This portion is divided into at least one plug and a pad. At least one plug is formed in a first interlayer insulating layer and the lower part of a second interlayer insulating layer. The second interlayer insulating layer is divided into a plurality of interlayer insulating layers so that upper and lower widths of the divided plugs formed in the divided portion of the second interlayer insulating layer are not greatly different from each other. The pad formed on the upper portion of the second interlayer insulating layer has an upper width such that the upper conductive layer connected to the pad is not undesirably connected to an adjacent upper conductive layer via the pad.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: December 9, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won-Suk Yang, Sang-Hoo Song, Ki-Nam Kim, Hong-Sik Jeong
  • Semiconductor memory device and method for manufacturing the same
    Publication number: 20050167717
    Abstract: A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower conductive layer, and provided in a second interlayer insulating layer. This portion is divided into at least one plug and a pad. At least one plug is formed in a first interlayer insulating layer and the lower part of a second interlayer insulating layer. The second interlayer insulating layer is divided into a plurality of interlayer insulating layers so that upper and lower widths of the divided plugs formed in the divided portion of the second interlayer insulating layer are not greatly different from each other. The pad formed on the upper portion of the second interlayer insulating layer has an upper width such that the upper conductive layer connected to the pad is not undesirably connected to an adjacent upper conductive layer via the pad.
    Type: Application
    Filed: March 14, 2005
    Publication date: August 4, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-Suk Yang, Sang-Hoo Song, Ki-Nam Kim, Hong-Sik Jeong
  • Semiconductor memory device and method for manufacturing the same
    Patent number: 6900546
    Abstract: A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower conductive layer, and provided in a second interlayer insulating layer. This portion is divided into at least one plug and a pad. At least one plug is formed in a first interlayer insulating layer and the lower part of a second interlayer insulating layer. The second interlayer insulating layer is divided into a plurality of interlayer insulating layers so that upper and lower widths of the divided plugs formed in the divided portion of the second interlayer insulating layer are not greatly different from each other. The pad formed on the upper portion of the second interlayer insulating layer has an upper width such that the upper conductive layer connected to the pad is not undesirably connected to an adjacent upper conductive layer via the pad.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: May 31, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won-Suk Yang, Sang-Hoo Song, Ki-Nam Kim, Hong-Sik Jeong
  • Semiconductor memory device and method for manufacturing the same
    Publication number: 20020123193
    Abstract: A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower conductive layer, and provided in a second interlayer insulating layer. This portion is divided into at least one plug and a pad. At least one plug is formed in a first interlayer insulating layer and the lower part of a second interlayer insulating layer. The second interlayer insulating layer is divided into a plurality of interlayer insulating layers so that upper and lower widths of the divided plugs formed in the divided portion of the second interlayer insulating layer are not greatly different from each other. The pad formed on the upper portion of the second interlayer insulating layer has an upper width such that the upper conductive layer connected to the pad is not undesirably connected to an adjacent upper conductive layer via the pad.
    Type: Application
    Filed: March 4, 2002
    Publication date: September 5, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-Suk Yang, Sang-Hoo Song, Ki-Nam Kim, Hong-Sik Jeong