Patents by Inventor Sang Hoon BONG

Sang Hoon BONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11903312
    Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 13, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Un Hak Lee, Sang Hoon Bong, Young Kil Song, Yun Sang Song, Jung Ho Kim, Seong Jae Jeon, Young Sam Yoo, Sung Chul Kim
  • Patent number: 11884511
    Abstract: An embodiment discloses a sterilization module comprising: a frame including a support part that includes one surface and one end, and a fastening part connected to the one end; a first circuit board disposed in the fastening part; and an ultraviolet irradiation device disposed on the first circuit board, wherein the support part comprises: the other end facing the one end; and a side end facing the other end. The frame comprises: a protrusion connected to the side end of the support part; and a guide part connected to the other end of the support part. The fastening part and the guide part extend in a first direction perpendicular to one surface of the support part, and the protrusion extends in a direction opposite to the first direction. The guide part comprises: a first guide part and a second guide part that are spaced apart from each other in a second direction parallel to the one end.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: January 30, 2024
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Sang Hoon Bong, Sung June Park, Sang Hun An, Dae Hun Kim
  • Publication number: 20230345834
    Abstract: Disclosed according to an embodiment of the present invention is a thermoelectric device comprising: a fluid flow part; a thermoelectric module disposed on the fluid flow part; a guide part disposed on the fluid flow part and spaced apart from the thermoelectric module; and a shield member disposed on the thermoelectric module, wherein a part of the guide part overlaps the shield member in the vertical direction.
    Type: Application
    Filed: September 17, 2021
    Publication date: October 26, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang Hoon BONG, Un Hak LEE
  • Publication number: 20230329112
    Abstract: Disclosed is a thermoelectric device, according to one embodiment of the present invention, comprising: a fluid movement part including a groove part extending in a first direction on one surface; a thermoelectric module arranged on the one surface; and a shield member arranged on the thermoelectric module, wherein the shield member includes: a first part overlapping with the thermoelectric module in the vertical direction; a second part deviated from the thermoelectric module in the vertical direction; and a stepped part for connecting the first part to the second part, and the second part is closer than the first part to one surface of the fluid movement part, and the groove part of the fluid movement part overlaps with the second part and/or the stepped part in the vertical direction.
    Type: Application
    Filed: September 13, 2021
    Publication date: October 12, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Un Hak LEE, Sang Hoon BONG
  • Publication number: 20230255113
    Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a fluid flow part including one surface and the reverse surface spaced apart from the one surface in a first direction; a first thermoelectric element disposed on the one surface of the fluid flow part; a second thermoelectric element disposed on the reverse surface of the fluid flow part; a first shield member disposed on the first thermoelectric element; and a second shield member disposed on the second thermoelectric element, wherein the first shield member and the second shield member each include coupling holes, and the coupling holes of the first shield member and the coupling holes of the second shield member are arranged offset from each other in the first direction.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 10, 2023
    Inventors: Un Hak LEE, Sang Hoon BONG
  • Publication number: 20230232718
    Abstract: A thermoelectric module, according to an embodiment of the present invention, comprises: a substrate; a thermoelectric element arranged on the substrate to be spaced apart from each other; and a cover member arranged on the substrate and arranged on one side of the thermoelectric element, wherein the cover member includes a first side surface closest to one side of the thermoelectric element and a second side surface facing the first side surface, the first side surface includes a first groove concave toward the second side surface, the second side surface includes a second groove concave toward the first side surface, and the width of the first groove is greater than the width of the second groove.
    Type: Application
    Filed: June 15, 2021
    Publication date: July 20, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang Hoon BONG, Un Hak LEE
  • Publication number: 20230189649
    Abstract: A power generation apparatus according to the present invention comprises: a thermoelectric conversion part including a duct and multiple thermoelectric modules arranged on a surface of the duct; a chamber having a hole formed through a lateral surface thereof to allow the thermoelectric conversion part to be inserted therethrough; a wire connected to the multiple thermoelectric modules; and a guide member having a reception space formed therein for receiving the wire, wherein the guide member comprises: a case disposed adjacent to the side surface of the chamber and including a through-hole and a wire hole through which the wire passes; a pipe disposed outside the reception space of the case to correspond to the through-hole; a molding member disposed in the reception space; and a cover disposed at the upper end of the case, and the molding member is disposed to surround the wire.
    Type: Application
    Filed: June 8, 2021
    Publication date: June 15, 2023
    Inventors: Sang Hoon BONG, Un Hak LEE
  • Patent number: 11548765
    Abstract: Disclosed in an embodiment is a light source comprising: a housing; a coupling unit which fixes the housing on the target structure; a light source module for emitting light onto the target structure; and a power source module which supplies power to the light source module. The light source module comprises: a first circuit board; a second circuit board disposed on one side of the first circuit board; a third circuit board disposed on another side of the first circuit board; at least one first ultraviolet light emitting element disposed on one surface of the first circuit board; at least one second ultraviolet light emitting element disposed on one surface of the second circuit board; and at least one third ultraviolet light emitting element disposed on one surface of the third circuit board, wherein one surface of the second circuit board and one surface of the third circuit are disposed so as to face each other.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: January 10, 2023
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Dae Hun Kim, Sang Hoon Bong, Sang Hun An, Mi Sun Lee
  • Patent number: 11518656
    Abstract: Disclosed in an embodiment is a light source comprising: a housing; a coupling unit which fixes the housing on the target structure; a light source module for emitting light onto the target structure; and a power source module which supplies power to the light source module. The light source module comprises: a first circuit board; a second circuit board disposed on one side of the first circuit board; a third circuit board disposed on another side of the first circuit board; at least one first ultraviolet light emitting element disposed on one surface of the first circuit board; at least one second ultraviolet light emitting element disposed on one surface of the second circuit board; and at least one third ultraviolet light emitting element disposed on one surface of the third circuit board, wherein one surface of the second circuit board and one surface of the third circuit are disposed so as to face each other.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 6, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Dae Hun Kim, Sang Hoon Bong, Sang Hun An, Mi Sun Lee
  • Publication number: 20220093839
    Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p
    Type: Application
    Filed: November 24, 2021
    Publication date: March 24, 2022
    Inventors: Un Hak Lee, Sang Hoon Bong, Young Kil Song, Yun Sang Song, Jung Ho Kim, Seong Jae Jeon, Young Sam Yoo, Sung Chul Kim
  • Patent number: 11205746
    Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: December 21, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Un Hak Lee, Sang Hoon Bong, Young Kil Song, Yun Sang Song, Jung Ho Kim, Seong Jae Jeon, Young Sam Yoo, Sung Chul Kim
  • Publication number: 20210276834
    Abstract: An embodiment discloses a sterilization module comprising: a frame including a support part that includes one surface and one end, and a fastening part connected to the one end; a first circuit board disposed in the fastening part; and an ultraviolet irradiation device disposed on the first circuit board, wherein the support part comprises: the other end facing the one end; and a side end facing the other end. The frame comprises: a protrusion connected to the side end of the support part; and a guide part connected to the other end of the support part. The fastening part and the guide part extend in a first direction perpendicular to one surface of the support part, and the protrusion extends in a direction opposite to the first direction. The guide part comprises: a first guide part and a second guide part that are spaced apart from each other in a second direction parallel to the one end.
    Type: Application
    Filed: July 5, 2019
    Publication date: September 9, 2021
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Sang Hoon BONG, Sung June PARK, Sang Hun AN, Dae Hun KIM
  • Publication number: 20210167269
    Abstract: A power generating apparatus according to one embodiment of the present invention includes a duct through which a first fluid passes, a first thermoelectric module and a second thermoelectric module disposed on a first surface of the duct to be spaced apart from each other, a connector disposed between the first thermoelectric module and the second thermoelectric module on the first surface of the duct, and a shield member disposed on the connector on the first surface of the duct, wherein the shield member includes a first face and a second face having a height higher than a height of the first face.
    Type: Application
    Filed: November 19, 2020
    Publication date: June 3, 2021
    Inventors: Sang Hoon BONG, Un Hak LEE, Sung Chul KIM
  • Publication number: 20210163266
    Abstract: Disclosed in an embodiment is a light source comprising: a housing; a coupling unit which fixes the housing on the target structure; a light source module for emitting light onto the target structure; and a power source module which supplies power to the light source module. The light source module comprises: a first circuit board; a second circuit board disposed on one side of the first circuit board; a third circuit board disposed on another side of the first circuit board; at least one first ultraviolet light emitting element disposed on one surface of the first circuit board; at least one second ultraviolet light emitting element disposed on one surface of the second circuit board; and at least one third ultraviolet light emitting element disposed on one surface of the third circuit board, wherein one surface of the second circuit board and one surface of the third circuit are disposed so as to face each other.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 3, 2021
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Dae Hun KIM, Sang Hoon BONG, Sang Hun AN, Mi Sun LEE
  • Publication number: 20200119248
    Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p
    Type: Application
    Filed: June 7, 2018
    Publication date: April 16, 2020
    Inventors: Un Hak LEE, Sang Hoon BONG, Young Kil SONG, Yun Sang SONG, Jung Ho KIM, Seong Jae JEON, Young Sam YOO, Sung Chul KIM