Abstract: Disclosed herein is an apparatus for synthesizing nano particles. The apparatus for synthesizing nano particles is configured to include: a plasma generator that generates plasma; a recovery device that recovers the synthesized nano particles; and a cooler that is disposed between the plasma generator and the recovery device and includes a cooling path where the nano particles are synthesized, while material supplied from the plasma generator is cooled, wherein the cooling path is set to have lower cooling temperatures for each section as going to the moving direction of the nano particles.

Abstract: There are provided a reduction-resistant dielectric composition and a ceramic electronic component including the same. The reduction-resistant dielectric composition may include a BaTiO3-based matrix powder, 0.1 to 1.0 moles of a transition metal oxide or transition metal carbonates, based on 100 moles of the matrix powder, and 0.1 to 3.0 moles of a sintering aid including silicon oxide (SiO2). The ceramic electronic component including the reduction-resistant dielectric composition may have a high capacitance and superior reliability.

Abstract: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T?t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7?Dc/Da?1.5 is satisfied.

Abstract: There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer.

Abstract: There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2?D99/D50?3 and 2?D50/D1?3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls?10 ?m is satisfied.

Abstract: There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.98 wt % of nickel (Ni), 0.01 to 10 wt % of copper (Cu), and 0.01 to 10 wt % of barium titanate (BaTiO3).

Abstract: There is provided a 1005-sized or smaller multilayer ceramic electronic part, including: a ceramic body having internal electrodes having a directivity perpendicular to a printed circuit board; and external electrodes formed on both end portions of the ceramic body and electrically connected to the internal electrodes each including an active area part and a lead part, the active area parts facing each other to contribute to forming capacitance, and the lead part having a width smaller than that of the active area part, and wherein when a width of the active area part is defined as WLa, a width of the lead part on one end portion of the ceramic body connected to the external electrodes is defined as WL1, and a bottleneck rate ? of the lead part is defined as 1?WL1/WLa, the bottleneck rate ? of the lead part satisfies a range of 0<??0.12.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.9 wt % of copper (Cu) and 0.1 to 20 wt % of nickel (Ni), and a frequency therefor is 1000 MHz or less.

Abstract: There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 ?m to 30 ?m, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

Abstract: There is provided a multi-layered ceramic electronic component. The multi-layered ceramic electronic component according to embodiments of the present invention includes: a ceramic element in which a plurality of dielectric layers are stacked; and a plurality of first and second internal electrodes formed on at least one surface of the dielectric layer and alternately disposed in a width direction, wherein, when a distance from one side of the ceramic element to a leading edge of the first internal electrode in a width direction is set to be B, and a distance from one side of the ceramic element to a leading edge in a width direction of the second internal electrode thereof is set to be A, a difference between A and B is 10 to 14% of a width of the first internal electrode or the second internal electrode.

Abstract: There is provided a dielectric composition including: a base powder including BaTiO3; a first accessory component including a content (x1) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 3.0 at % of oxide or carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a Ce element (content of z at %) and at least one rare earth element (content of w at %); and a fourth accessory component including a sintering aid, wherein 0.01?z?x1+4y and 0.01?z+w?x1+4y based on 100 moles of the base powder.

Abstract: There is provided a dielectric composition including: a base powder; a first accessory component including a content (x) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 5.0 at % of an oxide or a carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a donor element; and a fourth accessory component including a sintering aid.

Abstract: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20?a?60, 20?b?60, and 2?c?25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.

Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

Abstract: There is provided a conductive paste for an internal electrode of a multilayer ceramic electronic component and a multilayer ceramic electronic component using the same. One or more nitride powders containing a nitride selected from the group consisting of silicon nitride, boron nitride, aluminum nitride, a vanadium nitride are added to the conductive paste for an internal electrode to increase a shrinkage initiation temperature of the internal electrodes. Accordingly, the reliability of the multilayer ceramic electronic component can be improved by using the conductive paste for an internal electrode.

Abstract: A method for synthesizing nano particles, including: moving material in a plasma generating space in a first direction; and synthesizing nano particles by cooling the material moved along the first direction, wherein the synthesizing the nano particles may be performed by cooling the material at gradually lower temperatures during the moving thereof in the first direction.