Patents by Inventor Sang Hoon Yoon

Sang Hoon Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12268104
    Abstract: An object of the present invention is to provide a composition, a memory structure suitable for the composition, a manufacturing method, and an operating method for stable operation in a memory element including a chalcogen compound. In order to achieve the object, in a memory array with a cross-point structure including a first electrode line and a second electrode line intersecting each other, and a selective memory element disposed at each intersection of the first electrode line and the second electrode line and being a chalcogen compound, the present invention may provide the memory array with a cross-point structure including the first electrode line formed on a substrate, a first functional electrode formed between the first electrode line and the selective memory element, and a second functional electrode formed between the second electrode line and the selective memory element, wherein the first functional electrode is formed as a line along the first electrode line.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 1, 2025
    Assignee: IHW INC.
    Inventors: Jun-sung Kim, Seung-hwan Lee, Sang-hoon Yoon
  • Publication number: 20240330598
    Abstract: Provided is an AI-based disaster safety knowledge integration management system enabling AI-driven question-and-answer services for specialized knowledge in the field of disaster safety and supports automatic reporting services for policy planning and report generation on specific topics by utilizing intelligent analysis services for sharing disaster safety data, and which consists of a disaster safety knowledge base integrated with a data network and an artificial intelligence section designed for high-dimensional information processing; the disaster safety knowledge base consisting of a data collection section for gathering and aggregating various information from external agencies; and a data transmission section for transmitting the aggregated information to the server; and big data for analyzing and accumulating the transmitted data, and in the AI section, the accumulated and analyzed data from the big data section being utilized to enable machine intelligence through rapid learning based on human cog
    Type: Application
    Filed: March 9, 2023
    Publication date: October 3, 2024
    Inventors: Dong Man LEE, Seon Hwa CHOI, Sang Hoon YOON, Jong Yeong SON, Mi Song KIM, Hee Won YOON, Shin Hye RYU
  • Publication number: 20220339744
    Abstract: A flux composition includes an aromatic resin including one benzene ring and one or two hydroxyl (—OH) groups, an activator selected from a group consisting of a dicarboxylic acid and a dicarboxylic anhydride, and a solvent.
    Type: Application
    Filed: September 14, 2021
    Publication date: October 27, 2022
    Applicants: SK hynix Inc., Evertech Enterprise Co., Ltd.
    Inventors: Hyun Suk LEE, Sang Hoon YOON, Gwang Hyeon GOH, Jang Rak CHOI, Yong Ju SEO, Chang Il YOO, Seung Hoon LEE, Da Been PARK
  • Patent number: 9752205
    Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: September 5, 2017
    Assignees: POSCO, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
    Inventors: Sang-Won Kim, Sang-Hoon Yoon, Seong Hoon Yi, Young-Geun Son, Eon-Byeong Park, Oh Joon Kwon, Sang-Wook Ha, Seung-Dueg Choi, Gab-Sik Byun
  • Patent number: 9532452
    Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: December 27, 2016
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jeong Won Park, Hee Beom An, Kyu Dong Kang, Gyu Ho Park, Su Jin Park, Sang Hoon Yoon
  • Patent number: D801920
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: November 7, 2017
    Inventor: Sang-Hoon Yoon
  • Patent number: D930298
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Jae-Ho Jang, Hyun-Woo Yoon
  • Patent number: D930299
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Jae-Ho Jang, Hyun-Woo Yoon
  • Patent number: D930300
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Jae-Ho Jang, Hyun-Woo Yoon
  • Patent number: D935118
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Jae-Ho Jang, Hyun-Woo Yoon
  • Patent number: D954925
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: June 14, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Hyun-Woo Yoon, Kang-Kyung Lee
  • Patent number: D955541
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Hyun-Woo Yoon, Kang-Kyung Lee
  • Patent number: D955542
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Hyun-Woo Yoon, Kang-Kyung Lee
  • Patent number: D955543
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwan-Dong Lee, Sang-Hoon Yoon, Jin-Sun Park, Hyun-Woo Yoon, Kang-Kyung Lee
  • Patent number: D1028201
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: May 21, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Yoon, Hwandong Lee, Junguk Shin, Erwan Bouroullec
  • Patent number: D1033777
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: July 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwandong Lee, Suyeon Park, Sang-Hoon Yoon
  • Patent number: D1035197
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: July 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwandong Lee, Suyeon Park, Sang-Hoon Yoon
  • Patent number: D1037585
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: July 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwandong Lee, Suyeon Park, Sang-Hoon Yoon
  • Patent number: D1044184
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: September 24, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwandong Lee, Suyeon Park, Sang-Hoon Yoon
  • Patent number: D1047307
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: October 15, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hoon Yoon, Hwandong Lee, Junguk Shin