Patents by Inventor Sang-Hwa Cho

Sang-Hwa Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125706
    Abstract: A surface plasmon resonance imaging apparatus is provided. The surface plasmon resonance imaging apparatus includes a light irradiation unit configured to irradiate polarized light onto a metal coating film provided on one surface of a prism, a light modulator configured to spatially pattern-encode light reflected by the metal coating film and the prism, a light detector configured to detect a pattern-encoded light signal, obtained through pattern-encoding by the light modulator, as a spectral signal, a signal processor configured to spatially decode the spectral signal and analyze a decoded spectral signal to generate characteristic data of a sample provided on the metal coating film, and an output unit configured to output the characteristic data of the sample as a two-dimensional (2D) image.
    Type: Application
    Filed: December 29, 2022
    Publication date: April 18, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: SOOCHEOL KIM, JeongKyun KIM, Hyunseok KIM, Jin Hwa RYU, SO YUNG PARK, Hoe-Sung YANG, KANG BOK LEE, Sun-Hwa LIM, Kwang-Soo CHO, Kyu Won HAN, Sang Gi HONG
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20070177279
    Abstract: The present invention provides a camera device which can be applied to communication devices such as a mobile phone. The camera device of the present invention has divided movement regions of a movable lens group. The movable lens group is actuated at a large width in any one movement regions to perform a zoom operation. The movable lens group is actuated at a small width in the other movement region to perform a focusing operation. Accordingly, the camera device of the present invention allows miniaturization, and can provide a zoom and a focusing function.
    Type: Application
    Filed: September 20, 2004
    Publication date: August 2, 2007
    Applicant: CT ELECTRONICS CO., LTD.
    Inventors: Sang-Hwa Cho, Dae-Sung Kim, Hwa-Sup Yoon