Abstract: A backlight unit includes a light source unit which has a curved shape, a light guide plate including a curved light incident surface on which light emitted from the light source unit is incident, and a light source cover which has a curved shape corresponding to the curved light incident surface and is configured to surround one side of the light guide plate to dispose the light source unit and the light incident surface inside thereof. A groove is defined in the light source cover and extends toward the inside of the light source cover from an edge portion thereof.

Abstract: A display device includes a display panel and a driving circuit substrate disposed on the display panel. At least one flexible printed circuit board is coupled to the display panel and the driving circuit substrate. A driving chip is disposed on a first surface of the flexible printed circuit board. A bottom chassis is configured to accommodate the display panel. A flange is coupled to an edge portion of a rear surface of the bottom chassis. The flange includes a first fixing unit, a side surface portion extended from an end portion of the first fixing unit and having a vertically bent shape, and a second fixing unit extended from an end portion of the side surface portion and having a shape bent toward the outside of the bottom chassis. A heat dissipating chassis is coupled to the second fixing unit.

Abstract: A liquid crystal display device includes a backlight assembly, a liquid crystal display panel, a capacitive type touch function key, a cover film and a receiving container. The backlight assembly is configured to generate light. The liquid crystal display panel is disposed on the backlight assembly. The liquid crystal display panel includes an array substrate and an opposing substrate facing the array substrate. The capacitive type touch function key is disposed adjacent to a side surface of one of the array substrate and the opposing substrate. The cover film overlaps the liquid crystal display panel and the capacitive type touch function key. The receiving container receives the backlight assembly, the liquid crystal display panel and the capacitive type touch function key.

Abstract: A liquid crystal display includes: a bottom chassis, a backlight assembly received in the bottom chassis, a liquid crystal display panel including a thin film transistor substrate and a counter substrate disposed opposite the thin film transistor substrate, with the liquid crystal display panel being disposed so that the counter substrate faces the backlight assembly. The liquid crystal display further includes a mold structure disposed between the bottom chassis and the liquid crystal display panel, and configured to fasten the liquid crystal display panel to the bottom chassis, a driving connection line connected to the thin film transistor substrate and a shield case configured to cover the driving connection line to protect the driving connection line, and including a lateral side disposed corresponding to an edge of the liquid crystal display panel or disposed inside the edge of the liquid crystal panel.

Abstract: A display device includes a touch panel, a display panel, a backlight assembly, a bottom chassis, and a rear cover. The display panel is coupled to the touch panel. The backlight assembly includes a light source to supply light to the display panel, and an optical sheet including a protrusion. The display panel is disposed between the touch panel and the backlight assembly. The bottom chassis includes extensions protruding from walls defining a cavity region to receive the display panel. The extensions support the touch panel. The rear cover is configured to receive the bottom chassis. The bottom chassis is disposed between the rear cover and the touch panel. One of the walls of the bottom chassis includes an opening. The protrusion is configured to engage the opening to couple the optical sheet to the bottom chassis.

Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a first display panel and a second display panel which are opposite to each other, a driving unit connection line which is formed in the first display panel, a driving circuit portion which is connected to the driving unit connection line, a backlight unit which is disposed so as to be adjacent to the first display panel, a polarizer which is disposed on a surface of the second display panel and overlaps the driving unit connection line and the driving circuit portion, and a reinforcement unit that overlaps the driving unit connection line, and the polarizer may be disposed on the reinforcement unit.

Abstract: A liquid crystal display having a support structure for a touch panel is disclosed. In one aspect of the described technology the LCD display includes a liquid crystal panel; a touch panel formed on the liquid crystal panel, and a backlight assembly formed under the liquid crystal panel and including a light emitting diode. In addition, a mold frame is configured to support the liquid display panel while surrounding the backlight assembly, a bottom chassis is configured to seat and support the backlight assembly and the mold frame, and a support structure is located under the touch panel and provides support for the touch panel.

Abstract: The present invention relates to a circuit protection device and a method of manufacturing the same. The circuit protection device includes a common mode noise filter having a plurality of sheets, each of the sheets being formed to optionally include a coil pattern, an internal electrode, a hole filled with a conductive material, and a hole filled with a magnetic material; and an electrostatic discharge (ESD) protection device having a plurality of sheets, each of the sheets being formed to optionally include an internal electrode and a hole filled with an ESD protection material.

Abstract: The present invention relates to a circuit protection device and a method of manufacturing the same. The circuit protection device includes a common mode noise filter having a plurality of sheets, each of the sheets being formed to optionally include a coil pattern, an internal electrode, a hole filled with a conductive material, and a hole filled with a magnetic material; and an electrostatic discharge (ESD) protection device having a plurality of sheets, each of the sheets being formed to optionally include an internal electrode and a hole filled with an ESD protection material.

Abstract: A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.

Abstract: The present invention relates to a display device using a separate light source, and the display device includes: a light guide including a plurality of corners and a plurality of edges connecting the corners to each other; a printed circuit board (PCB) disposed at at least one of the plurality of corners of the light guide; at least one light source disposed on the PCB; a display panel overlapping the light guide; and an auxiliary function module disposed proximate to an edge of the light guide connected to the corner where the light source is disposed, wherein the edge of the light guide connected to the corner where the light source is disposed has a depressed portion, and the auxiliary function module is disposed in correspondence with the depressed portion.

Abstract: The present invention relates to a circuit protection device and a method of manufacturing the same. The circuit protection device includes a common mode noise filter having a plurality of sheets, each of the sheets being formed to optionally include a coil pattern, an internal electrode, a hole filled with a conductive material, and a hole filled with a magnetic material; and an electrostatic discharge (ESD) protection device having a plurality of sheets, each of the sheets being formed to optionally include an internal electrode and a hole filled with an ESD protection material. According to the present invention, a solenoid-type common mode noise filter and an ESD protection device are laminated as a single device, and thereby common mode noises and ESD of the electronic device can be simultaneously prevented.

Abstract: In one embodiment, a circuit protection device includes a common mode noise filter having a plurality of sheets, each of the sheets being formed to optionally include a coil pattern, an internal electrode, a hole filled with a conductive material, and a hole filled with a magnetic material; and an electrostatic discharge (ESD) protection device having a plurality of sheets, each of the sheets being formed to optionally include an internal electrode and a hole filled with an ESD protection material.

Abstract: A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.

Abstract: A method for manufacturing a hetero-bonded wafer having a large mismatch of thermal expansion coefficient comprises forming a wafer bonding means and an electrical interconnection means on at least one bonding surface of two wafers to be bonded with each other, forming grooves in the bonding surface of one wafer along dicing lines with an interval between the grooves being equal to or an even multiple of a die width, bonding the two wafers at a temperature less than 200° C., thinning a back side of the grooved wafer such that at least a portion of the grooves is exposed, and rebonding the bonded wafer pair at an elevated temperature higher than the first bonding temperature. The method for manufacturing a hetero-bonded wafer can avoid wafer level bow/warp and also reduce debonding and cracking in individual segments induced by thermal stress due to a mismatch of thermal expansion coefficient.

Abstract: A method for manufacturing a hetero-bonded wafer having a large mismatch of thermal expansion coefficient comprises forming a wafer bonding means and an electrical interconnection means on at least one bonding surface of two wafers to be bonded with each other, forming grooves in the bonding surface of one wafer along dicing lines with an interval between the grooves being equal to or an even multiple of a die width, bonding the two wafers at a temperature less than 200° C. thinning a back side of the grooved wafer such that at least a portion of the grooves is exposed, and rebonding the bonded wafer pair at an elevated temperature higher than the first bonding temperature. The method for manufacturing a hetero-bonded wafer can avoid wafer level bow/warp and also reduce debonding and cracking in individual segments induced by thermal stress due to a mismatch of thermal expansion coefficient.

Abstract: The present invention relates to a circuit protection device and a method of manufacturing the same. The circuit protection device includes a common mode noise filter having a plurality of sheets, each of the sheets being formed to optionally include a coil pattern, an internal electrode, a hole filled with a conductive material, and a hole filled with a magnetic material; and an electrostatic discharge (ESD) protection device having a plurality of sheets, each of the sheets being formed to optionally include an internal electrode and a hole filled with an ESD protection material. According to the present invention, a solenoid-type common mode noise filter and an ESD protection device are laminated as a single device, and thereby common mode noises and ESD of the electronic device can be simultaneously prevented.

Abstract: The present invention relates to semiconductor device manufacturing techniques, and specifically to a field of device packaging techniques at wafer level. More specifically, it relates to a cap wafer for wafer bonding application that is bonded to top part of a device wafer. The method of the present invention excludes the use of deep reactive ion etching of silicon to form a through silicon via. The present invention provides a method for the preparation of cap wafer for wafer bonding application with a simple process of through silicon via interconnection and a wafer level packaging method using the same.

Abstract: This invention provides a biodegradable resin composition and a biodegradable molding using the same and in particular, it not only have satisfactory biodegradability, processability and properties required for biodegradable resins by comprising cellulose diacetate as a main component but also can lower manufacturing costs and prevent environmental contamination by preparing the biodegradable resins by reusing a cause factor of environmental contamination.

Abstract: The present invention relates to an optical transmittance device including an optical fiber having a tilted incident plane and a silicon optical bench (SiOB) with a mirror plane. In accordance with the present invention, there provided an optical device, including: a substrate having a groove with a tilted surface, wherein the groove has a mirror plane on the tilted surface; a light emitting means aligned to the substrate; and an optical fiber including a tilted incident plane, wherein a reflected light from the mirror plane is incident to the tilted incident plane.