Abstract: A flexible display apparatus includes a display panel, a case and a plurality of driving circuits. The display panel is configured to display an image. The display panel includes a first display part, a second display part and a hinge display part. The hinge display part is interposed between the first and second display parts. The hinge display part is configured to be foldable. The case is configured to cover the display panel. The case forms a hinge thickness with the hinge display part and it also forms a peripheral thickness at an end of the case facing away from the hinge display part. The peripheral thickness is greater than the hinge thickness. The driving circuits are disposed between a rear surface of the first display part and the case. Therefore, thickness of the display panel is decreased and its portability is improved.

Abstract: A method for manufacturing a known good die array("KGD" array ), which includes the steps of: (a) forming a plurality of circuit patterns, and bonding pads to match solder bumps on a wafer; (b) providing solder bumps on the bonding pads; (c) forming metal layers for wire-bonding on the solder bumps; (d) dividing the wafer having metal layers into respective individual circuit pattern unit dies; (e) holding at least one die in a die holder for testing; (f) wire-bonding circuit contacts of the die holder with the metal layers using wires; (g) testing the die which is electrically interconnected with the die holder; and (h) removing simultaneously the metal layer on the solder bumps for wire bonding and the wires from the die to give a known good die array having solder bumps.