Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.

Abstract: The present disclosure relates to a plurality of host materials comprising a first host material comprising a compound represented by formula 1, and a second host material comprising a compound represented by formula 2, and an organic electroluminescent device comprising the same. By comprising a specific combination of compounds as host materials, it is possible to provide an organic electroluminescent device having lower driving voltage, higher luminous efficiency, higher power efficiency, and/or superior lifespan characteristics compared to conventional organic electroluminescent devices.

Abstract: The present invention relates to a fatty acid amide-based oleogel containing polymer and a method for preparing same and, more particularly, to a fatty acid amide-based oleogel containing polymer and a method for preparing same, the oleogel comprising: a substrate formed of a polymer of a fatty acid amide having a single double bond and a silicone polymer, or a composition comprising same; and an oleogel surface formed by impregnating the substrate with oil, wherein, in the silicone polymer, first silyl-terminated polydialkylsiloxane is crosslinked with second vinyl-terminated polydialkylsiloxane, and the fatty acid amide is linked to the first silyl-terminated polydialkylsiloxane. Also, the present invention can provide use of the fatty acid amide-based oleogel containing polymer according to the present invention.

Abstract: Disclosed herein are an apparatus and method for updating an Internet-based malware detection engine using virtual machine scaling. The method may include creating a scaling group and an update group set based on a first virtual machine image, creating a second virtual machine image for a running virtual machine in response to occurrence of a snapshot event in the virtual update group run based on the first virtual machine image, modifying the scale-out image of the scaling group to the second virtual machine image, updating the scaling group by triggering a scale-out event and a scale-in event in the scaling group in response to occurrence of an update event, and modifying the scale-in image of the scaling group to the second virtual machine image.

Abstract: A method of manufacturing a composite electrode for an all-solid-state battery includes: preparing a precursor solution by mixing at least one solid electrolyte precursor and at least one polar solvent; stirring the precursor solution; preparing an electrode slurry by adding an active material to the stirred precursor solution; and heat-treating the electrode slurry and obtaining the composite electrode for the all-solid-state battery, wherein the composite electrode for the all-solid-state battery includes: the active material; and a coating layer disposed on the active material and including a solid electrolyte.

Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: A semiconductor device includes an active pattern with a lower pattern and sheet patterns spaced apart from the lower pattern, a gate structure on the lower pattern and having a gate electrode and a gate insulating film that surround each of the sheet patterns, a gate capping pattern on the gate structure, a gate etching stop pattern between the gate capping pattern and the gate structure, a gate spacer along a sidewall of the gate capping pattern, a source/drain pattern on the gate structure, a gate contact through the gate capping pattern and connected to the gate electrode, upper surfaces of the gate contact and gate spacer being coplanar, and a source/drain contact on the source/drain pattern and connected to the source/drain pattern.

Abstract: The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate.

Abstract: A semiconductor device including a substrate; first and second active patterns on the substrate, extending in a first direction and spaced apart in a second direction; gate electrodes on the first and second active patterns and extending in the second direction; a first gate separation structure between the first and second active patterns, extending in the first direction, and separating the gate electrodes; and a first element separation structure between the gate electrodes, extending in the second direction, and separating the second active pattern, wherein a distance to a first side of a first portion of the first gate separation structure is smaller than a distance to the first side of a second portion of the first gate separation structure, and a distance to the second side of the first portion is smaller than a distance from the second active pattern to the second side of the second portion.

Abstract: An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.

Abstract: An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.

Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: A continuous casting and rolling apparatus according to one embodiment of the present invention provides: a continuous caster for generating a steel sheet; a first rolling unit associated with the continuous caster; and a second rolling unit which is spaced apart in the outlet of the first rolling unit and comprises: a rolling mill for pressing down the steel sheet; and a cutter for cutting a portion of the steel sheet, wherein the cutter is spaced from the second rolling unit by a length corresponding to the length of the steel sheet discharged in an at least discontinuous rolling mode, and may comprise a cut withdrawal unit provided between the first rolling unit and the second rolling unit.