Patents by Inventor Sang Hyeon RYU

Sang Hyeon RYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093768
    Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.
    Type: Application
    Filed: July 11, 2024
    Publication date: March 20, 2025
    Applicants: SEMES CO., LTD., SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Jin Yeong SUNG, Ki Hoon CHOI, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Jang Jin LEE, Hyun YOON, Sang Gun LEE, Yu Jin CHO, Ho Jong HWANG, Jong Ju PARK, Jong Keun OH, Yong Woo KIM
  • Publication number: 20250073742
    Abstract: Provided is a control device and a substrate processing apparatus including the same. The substrate processing apparatus includes a support unit configured to support and rotate a first substrate, the support unit including a spin chuck, a spray unit configured to spray a processing fluid on the first substrate, a correction unit on a swing arm and configured to irradiate a beam onto the first substrate when the processing fluid is provided on the first substrate, wherein the swing arm is adjacent to the spin chuck and is configured to move the correction unit to a target point on the first substrate, and a controller configured to control the spin chuck and the swing arm, and correct a position error of the swing arm using a second substrate, wherein a plurality of anchor patterns are on the second substrate.
    Type: Application
    Filed: July 10, 2024
    Publication date: March 6, 2025
    Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
  • Publication number: 20250065360
    Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.
    Type: Application
    Filed: July 10, 2024
    Publication date: February 27, 2025
    Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
  • Publication number: 20240153791
    Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 9, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Jin Yeong SUNG, Ki Hoon CHOI, Hyun YOON, Sang Hyeon RYU, Young Ho PARK
  • Publication number: 20240118607
    Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.
    Type: Application
    Filed: March 14, 2023
    Publication date: April 11, 2024
    Applicant: SEMES CO.,LTD.
    Inventors: Hyun YOON, Ki Hoon CHOI, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Tae Hee KIM, Sang Gun LEE
  • Publication number: 20230203669
    Abstract: Disclosed is a method for treating a substrate, on which a plurality of reference marks and a pattern are formed. The method includes a process preparing operation, a location information acquiring operation of acquiring information on an actual location of the pattern, and a process executing operation of supplying a treatment liquid to the substrate, and heating the substrate by irradiating laser light to the pattern on the substrate, to which the treatment liquid is applied, the location information acquiring operation includes acquiring information on actual locations of, among the plurality of reference marks, at least three reference marks, and acquiring information of the actual location of the pattern through the information of the actual locations of the reference marks.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 29, 2023
    Inventors: Shin Hwa KANG, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Kwang Sup KIM
  • Publication number: 20230207349
    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 29, 2023
    Inventors: Kwang Sup KIM, Seung Un OH, Shin Hwa KANG, Sang Hyeon RYU, Young Ho PARK
  • Publication number: 20230207351
    Abstract: Provided is an apparatus for treating a substrate, which includes: a support unit supporting a substrate; a liquid supply unit supplying a treatment liquid to the substrate supported on the support unit; a heating unit heating a specific location of the substrate by irradiating a laser to the specific location on the substrate supported on the support unit, and swingably moved between the specific location of the substrate, and a waiting location of deviating from the substrate; a coordinate unit disposed below an irradiation end portion to which the laser is irradiated from the heating unit when the heating unit is positioned at the waiting location; and an image module monitoring the laser irradiated from the heating unit, in which the image module calculates a movement distance in which the heating unit is swingably moved on the coordinate unit to measure a first length in a longitudinal direction of the heating unit.
    Type: Application
    Filed: December 28, 2022
    Publication date: June 29, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Seung Un OH, In Ki JUNG, Shin Hwa KANG, Sang Hyeon RYU, Young Ho PARK
  • Publication number: 20230168586
    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support and rotate a substrate at the treating space; a liquid supply unit configured to supply a liquid to a substrate supported on the support unit; a post-treating unit configured to perform a post-treatment on the substrate supported on the support unit; and a monitoring unit configured to inspect a state of a liquid film formed of the liquid supplied onto the substrate.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 1, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Ki Hoon CHOI, In Ki JUNG, Hyo Won YANG, Sang Hyeon RYU, Young Ho PARK, Tae Hee KIM