Abstract: A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.

Abstract: A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.

Abstract: A semiconductor package according to an embodiment includes a first insulating layer including a through hole; an insulating member disposed in the through hole of the first insulating layer; a first electrode layer disposed on the insulating member; a second insulating layer disposed on the first electrode layer; and a first through electrode passing through the second insulating layer, wherein the first through electrode overlaps the first electrode layer and the insulating member in a vertical direction.

Abstract: A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.

Abstract: Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.

Abstract: A printed circuit board according to the present invention comprises: an insulating substrate; a plurality of pads formed on the upper surface of the insulating substrate; a protective layer which comprises an opening part for exposing the upper surfaces of the plurality of pads, and is formed on the insulating substrate; and a metal bump which is formed on the first pad and the second pad in the plurality of pads, and projects above the surface of the protective layer, and, here, the first pad is formed to the left of the central upper part of the insulating substrate, while the second pad is formed to the right of the central upper part of the insulating substrate.

Abstract: Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.

Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t

Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t