Abstract: It is related to a positive active material for lithium secondary battery, a manufacturing method thereof, and a lithium secondary battery containing the same, provides that a positive active material for lithium secondary battery, wherein, it is a layered lithium metal compound comprises nickel, cobalt, and manganese, and aluminum, zirconium, and boron are doped.

Abstract: The present disclosure relates to a positive active material for a lithium rechargeable battery, a manufacturing method thereof, and a lithium rechargeable battery including the positive active material, and it provides a positive active material which is a lithium composite metal oxide including nickel, cobalt, and manganese, and either has orientation in a direction of with respect to an ND axis that is equal to or greater than 29% or has orientation in a direction of [120]+[210] with respect to an RD axis that is equal to or greater than 82% in the case of an EBSD analysis with a misorientation angle (?g) that is equal to or less than 30 degrees.

Abstract: A semiconductor device includes a substrate including a plurality of active regions divided by a plurality of trenches, a plurality of tunnel insulating layer patterns formed over the active regions, a plurality of conductive film patterns formed over the tunnel insulating film patterns, a plurality of first isolation layers formed on sidewalls and bottom surfaces of the trenches, and a plurality of second isolation layers formed between the conductive film patterns.

Abstract: A semiconductor device may include a substrate, conductive patterns stacked to be spaced apart from each other on the substrate, contact plugs coming in contact with the respective conductive patterns, and first and second slit insulating layers of a first group penetrating the conductive patterns. The substrate may include a cell area and a contact area extending along a first direction from the cell area. The conductive patterns may be form a step structure. The first slit insulating layers of the first group may be opposite to each other in a second direction with any one of the contact plugs, interposed therebetween. The second slit insulating layers of the first group, which extend along the first direction in the contact area, may be opposite to each other in the second direction with the first slit insulating layers of the first group and the contact plugs, interposed therebetween.

Abstract: A semiconductor device includes a substrate including a plurality of active regions divided by a plurality of trenches, a plurality of tunnel insulating layer patterns formed over the active regions, a plurality of conductive film patterns formed over the tunnel insulating film patterns, a plurality of first isolation layers formed on sidewalls and bottom surfaces of the trenches, and a plurality of second isolation layers formed between the conductive film patterns.

Abstract: A semiconductor device includes a substrate including a plurality of active regions divided by a plurality of trenches, a plurality of tunnel insulating layer patterns formed over the active regions, a plurality of conductive film patterns formed over the tunnel insulating film patterns, a plurality of first isolation layers formed on sidewalls and bottom surfaces of the trenches, and a plurality of second isolation layers formed between the conductive film patterns.

Abstract: A semiconductor device includes a substrate including a plurality of active regions divided by a plurality of trenches, a plurality of tunnel insulating layer patterns formed over the active regions, a plurality of conductive film patterns formed over the tunnel insulating film patterns, a plurality of first isolation layers formed on sidewalls and bottom surfaces of the trenches, and a plurality of second isolation layers formed between the conductive film patterns.