Abstract: A semiconductor device includes a line; a source structure on the line; a stack structure on the source structure; a first slit structure penetrating the stack structure; a second slit structure penetrating the stack structure; and a contact plug adjacent to the first slit structure in a first direction. The first slit structure and the second slit structure may be spaced apart from each other by a first distance in a second direction that is perpendicular to the first direction. The contact plug penetrates the source structure, the contact plug being electrically connected to the lower line. The first slit structure and the contact plug may be spaced apart from each other by a second distance in the first direction, and the second distance may be longer than the first distance.

Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: An input sensing unit includes a touch sensing unit, which includes a plurality of driving electrodes, a plurality of sensing electrodes, and a driving signal generating unit which provides driving signals to the driving electrodes. The sensing electrodes are insulated from and intersect the driving electrodes. The driving signal generating unit includes touch drivers connected to driving electrodes and a digital-to-analog converter configured to provide a first signal or a second signal, and each of the touch drivers is connected to a preset number of driving electrodes among the driving electrodes.

Abstract: A lens includes an optical portion; and a rib portion extending to an external side of the optical portion in a radial direction and including a light transmitting region and a light-shielding region, wherein the light-shielding region includes an ester-based compound and a hydrocarbon-based compound, and wherein the hydrocarbon-based compound includes a saturated hydrocarbon compound.

Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.

Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.

Abstract: A method of dyeing a lens, and a method of manufacturing a lens assembly is provided. The method includes an operation of dipping the lens in a dyeing solution containing a non-polar dye.

Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.

Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.

Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.

Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of semiconductor package includes using the photoresist developer composition.

Abstract: A cleaning composition contains: 0.5 to 5 wt % of an acid; 1 to 20 wt % of an amine-based compound; 0.2 to 5 wt % of a corrosion inhibitor including a silane-based compound; and a balance of pure water. A cleaning composition contains: 1 to 10 wt % of a quaternary alkyl ammonium compound; 0.5 to 5 wt % of a corrosion inhibitor including at least one selected from the group consisting of a silane-based compound, an ammonium nitrate compound, and an ammonium phosphate compound; and a balance of pure water.