Patents by Inventor Sang Hyun Ryu

Sang Hyun Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6888242
    Abstract: The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: May 3, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Sang Hyun Ryu, Chan Yeok Park, Ji Young Chung
  • Patent number: 6825062
    Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: November 30, 2004
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku, Jae Sung Kwak, Sang Hyun Ryu
  • Publication number: 20040199853
    Abstract: An optical information recording medium, a data recording apparatus, a data recording method used by the recording apparatus, and a data reproducing apparatus are provided, in which the optical information recording medium includes data provided in one or more recording blocks. A recording block of the optical information recording medium is generated by alternately arranging identifiers from ones of error correction code (ECC) blocks in the recording block, wherein each ECC block comprises a plurality of sectors having corresponding identifiers.
    Type: Application
    Filed: April 21, 2004
    Publication date: October 7, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-hee Hwang, Yoon-woo Lee, Sung-hyu Han, Sang-hyun Ryu
  • Publication number: 20040199852
    Abstract: An optical information recording medium, a data recording apparatus, a data recording method used by the recording apparatus, and a data reproducing apparatus are provided, in which the optical information recording medium includes data provided in one or more recording blocks. A recording block of the optical information recording medium is generated by alternately arranging identifiers from ones of error correction code (ECC) blocks in the recording block, wherein each ECC block comprises a plurality of sectors having corresponding identifiers.
    Type: Application
    Filed: April 21, 2004
    Publication date: October 7, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-hee Hwang, Yoon-woo Lee, Sung-hyu Han, Sang-hyun Ryu
  • Publication number: 20040187065
    Abstract: An error flag generation apparatus and method for error correction, wherein the apparatus includes: a frame-sync error memory which stores frame-sync error information for each data block; a BIS (Burst Indicator Subcode) error flag memory which stores a BIS error flag for each data block; and an error flag generator, which generates an error flag indicating error existence/absence for ECC (Error-Correction Coding) data with reference to the frame-sync error information stored in the frame-sync error memory and the BIS error flag stored in the BIS error flag memory. Therefore, the error flag generation apparatus and method for error correction can be easily implemented with improved error-correction performance and be advantageous in cost.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Hee Hwang, Hyun-Jeong Park, Joo-Seon Kim, Sang-Hyun Ryu
  • Patent number: 6774826
    Abstract: A circuit which recovers a synchronization code, and a method thereof. Where a synchronization code is not detected from an incoming bitstream, a plurality of synchronization code recovery candidate patterns are compared with an original synchronization pattern, and location data to produce an optimal synchronization pattern is determined and generated on the basis of a result of the comparison. The synchronization code is recovered to a location corresponding to the location data. Alternatively, where a synchronization code is not detected from an incoming bitstream, a plurality of synchronization code recovery candidate patterns are error-corrected, and location data to produce an optimal synchronization pattern is determined and generated on the basis of a result of the error correction. The synchronization code is recovered to a location corresponding to the location data.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: August 10, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-hyu Han, Yoon-woo Lee, Joong-eon Seo, Young-im Ju, Sang-hyun Ryu, Sung-hee Hwang
  • Publication number: 20040097016
    Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.
    Type: Application
    Filed: September 18, 2003
    Publication date: May 20, 2004
    Inventors: Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku, Jae Sung Kwak, Sang Hyun Ryu
  • Publication number: 20030219927
    Abstract: The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
    Type: Application
    Filed: May 14, 2003
    Publication date: November 27, 2003
    Inventors: Sang Hyun Ryu, Chan Yeok Park, Ji Young Chung
  • Publication number: 20030194036
    Abstract: A circuit which recovers a synchronization code, and a method thereof. Where a synchronization code is not detected from an incoming bitstream, a plurality of synchronization code recovery candidate patterns are compared with an original synchronization pattern, and location data to produce an optimal synchronization pattern is determined and generated on the basis of a result of the comparison. The synchronization code is recovered to a location corresponding to the location data. Alternatively, where a synchronization code is not detected from an incoming bitstream, a plurality of synchronization code recovery candidate patterns are error-corrected, and location data to produce an optimal synchronization pattern is determined and generated on the basis of a result of the error correction. The synchronization code is recovered to a location corresponding to the location data.
    Type: Application
    Filed: November 1, 2002
    Publication date: October 16, 2003
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-hyu Han, Yoon-woo Lee, Joong-eon Seo, Young-im Ju, Sang-hyun Ryu, Sung-hee Hwang
  • Publication number: 20030145274
    Abstract: A decoding method and an apparatus operate by performing error correction on code words of an error correcting code block in one direction selected from a row direction and a column direction, indicating in error flags the remaining code words except at least some code words from code words having uncorrectable errors, and performing error correction on code words in the other direction based on the error flags. Accordingly, errors that have been conventionally considered as being uncorrectable may now be corrected.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 31, 2003
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-hee Hwang, Yoon-woo Lee, Sung-hyu Han, Sang-hyun Ryu, Young-im Ju
  • Publication number: 20030131309
    Abstract: Provided is a method of recording data on an optical recording medium having a plurality of addressable unit areas. 62 sync frames, each having a sync code and data, can be recorded in each of the addressable unit areas. Thus, user data can be recorded on a recordable optical disc at a higher density.
    Type: Application
    Filed: December 17, 2002
    Publication date: July 10, 2003
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-hee Hwang, Yoon-woo Lee, Sung-hyu Han, Sang-hyun Ryu, Young-im Ju
  • Publication number: 20030126537
    Abstract: An apparatus, method, and an optical storage medium to generate an error correction block include a data block generation unit processing digital data on a byte-by-byte basis and arranging the processed digital data from 0th to (N−1)th columns and from 0th to (M−1)th rows to form (M×N) data blocks. A matrix block generation unit arranges the (M×N) data blocks in K rows according to a data transmission sequence to form a matrix block. A first codeword generation unit adds a first error correction check word of 2×K bytes to each of N columns to form a first codeword of ((K×M)+2×K) bytes. A second codeword generation unit adds a second error correction check word of P bytes to each of ((K×M)+2×K) rows to form a second codeword of (N+P) bytes.
    Type: Application
    Filed: January 3, 2003
    Publication date: July 3, 2003
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Sung-hyu Han, Yoon-woo Lee, Sang-hyun Ryu, Young-im Ju, Sung-hee Hwang
  • Publication number: 20030020146
    Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.
    Type: Application
    Filed: May 22, 2002
    Publication date: January 30, 2003
    Inventors: Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku, Jae Sung Kwak, Sang Hyun Ryu
  • Publication number: 20020157057
    Abstract: An optical information recording medium, a data recording apparatus, a data recording method used by the recording apparatus, and a data reproducing apparatus are provided. The optical information recording medium contains data included in one or more recording blocks. Identifiers included in a plurality of sectors comprising a plurality of error correction code (ECC) blocks are sequentially extracted so that the ECC blocks are equally selected, and are alternately arranged at predetermined intervals. As a result, the optical information recording medium, the data recording apparatus, and the data recording method used by the apparatus, which have higher error correction rates, are provided.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 24, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Hee Hwang, Yoon-Woo Lee, Sung-Hyu Han, Sang-Hyun Ryu
  • Publication number: 20020157045
    Abstract: An optical recording medium, a data recording or reproducing apparatus, and a data recording or reproducing method used by the data recording or reproducing apparatus. In a method of recording data on an optical disc, each of a plurality of error correction code (ECC) blocks is divided into a plurality of partitions. Next, data from the partitions is interleaved so that each of the ECC blocks is alternately and equally selected to generate a recording block. The generated recording block is modulated and recorded on an optical disc. As a result, the optical recording medium, the data recording apparatus, and the data recording method used by the apparatus are compatible with the format of a conventional digital versatile disc (DVD) and have higher error correction rates. In a reproducing method, the recording block is deinterleaved.
    Type: Application
    Filed: December 20, 2001
    Publication date: October 24, 2002
    Inventors: Sung-hee Hwang, Yoon-woo Lee, Sung-hyu Han, Sang-hyun Ryu
  • Patent number: 6448633
    Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: September 10, 2002
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku, Jae Sung Kwak, Sang Hyun Ryu