Abstract: The present disclosure relates to an illuminating apparatus which is received at the back of an outer surface and which includes: a lighting part having a front surface, through which the light is irradiated, and a rear surface, which is the back side of the front surface; an electric connector electrically connected to the lighting part and coupled to a power supply at the back of the outer surface; and a length-adjustable shaft provided between the lighting part and the electric connector and bringing the rear surface of the lighting part into contact with the outer surface.

Abstract: The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

Abstract: An apparatus and method for providing a streaming service in a portable terminal are provided. The apparatus includes a communication unit, a memory unit, a display unit, a header analyzer, a state identifying unit, and a controller. The communication unit communicates with a streaming server and receives tracks constituting data. The memory unit stores the received tracks. The display unit reproduces and outputs the received tracks. The header analyzer identifies an array state of the tracks. The state identifying unit identifies a storage state of the stored tracks. The controller determines a change or non-change of a reception scheme of data, and receives the data in the determined data reception scheme. The data request unit sends a request for tracks to the streaming server.

Abstract: Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.

Abstract: A method and apparatus for waking up a remote main system. The method includes: certifying whether a user of a terminal which transmits a packet for waking up a main system that is in a sleeping state is a legitimate user of the main system; and transmitting a wake-up signal to the main system if it is certified that the user is legitimate. Access of uncertified users can be prevented by certifying a user who is in the process of logging on or logging into the main system before the main system wakes up.

Abstract: Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

Abstract: A touch screen device and an operating method thereof are provided. The touch screen device is operated by touching a touch screen and moving a touch while the touch is maintained on the screen. A detector detects a touch point and a moving trajectory, and a controller selects a user command based on the detected touch point and moving trajectory. Then, when the user releases the touch, the controller executes the user command. User commands are classified and stored in a storage device and then executed by the controller based on operation modes associated with the device. A variety of user commands may be executed even though not all the menus are not displayed on the screen at once. Further, a user may cancel an erroneously entered user command quickly and easily.

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract: Disclosed are a light emitting module and a method of manufacturing the light emitting module.

Abstract: Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Abstract: The present disclosure provides a lighting apparatus using a light-emitting diode (LED), which includes: LEDs; a power transfer substrate with the LEDs thereon; a radiating member radiating heat generated in the LEDs; a driver electrically connected to the power transfer substrate and integrally coupled to the power transfer substrate and the radiating member; and a heat insulation layer reducing the amount of heat transferred from the radiating member to the driver. In addition, the present disclosure provides a lighting apparatus using an LED, which further includes a cradle fixed to a given object and detachably fixing a lighting body in which a power transfer substrate with LEDs thereon, a radiating member and a driver have been integrally coupled.

Abstract: Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers.

Abstract: An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.

Abstract: A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Abstract: A touch screen device and a method of operation are provided. The device and method allow for scrolling and selection of files from a file list, and for skipping or reversing an execution order of the selected files simply by performing a drag on a touch screen. The method of selecting files on the touch screen device includes detecting a diagonal drag on a screen, selecting file(s) included within a corresponding range, and skipping file(s) within the range. The method may also include changing an execution order of the selected file(s) when a drag with a return trajectory is detected. The method may also include scrolling through the file list in accordance with a direction and speed of the drag. The device and method allows a plurality of files to be selected and skipped at a time, and a desired file to be rapidly and easily located.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.