Patents by Inventor Sang Hyun Yi
Sang Hyun Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11705884Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a protective layer disposed to cover at least the metal pad.Type: GrantFiled: July 30, 2020Date of Patent: July 18, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Hyun Lim, Sang Hyun Yi, Yong Suk Kim, Sung Jun Lee, Jae Hyoung Gil, Dong Hyun Park
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Patent number: 11430617Abstract: An example portable electronic device includes a front glass cover; a rear cover; a bezel surrounding a space defined by the front cover and the rear cover, the bezel including a portion including an opening; a display device built in the space; and a plate including a plane parallel to the front cover within the space. The example electronic device includes a key movably inserted in the opening; a support structure mounted on the plate or a portion of the bezel and including a hole through which the key passes; a dome button mounted on the support structure and arranged to face the first surface of the key and the hole so that the key can be pressed; and a waterproof structure including a flexible material.Type: GrantFiled: January 19, 2021Date of Patent: August 30, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong-Min Choi, Hyuk-Jae Jang, Woong-Chan Kim, Jung-Tae Kim, Dae-Hyeong Park, Sang-Hyun Yi, Jae-Ryang Lee, Jeong-Goo Jeon, Sung-Gun Cho, Sung-Joo Cho, Young-Sik Choi, Soon-Woong Yang, Min-Sung Lee
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Publication number: 20220149806Abstract: A bulk acoustic wave resonator includes: a substrate; a resonant portion including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on the substrate; and a protective layer disposed on an upper surface of the resonant portion. The protective layer includes: a first protective layer formed of a diamond thin film; and a second protective layer stacked on the first protective layer, and formed of a dielectric material.Type: ApplicationFiled: April 9, 2021Publication date: May 12, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Kyung LEE, Sang Heon HAN, Sung Joon PARK, Sang Kee YOON, Sang Hyun YI, Jae Goon AUM
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Publication number: 20220085791Abstract: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a cavity disposed between the substrate and the first electrode; a piezoelectric layer covering at least a portion of the first electrode; a second electrode covering at least a portion of the piezoelectric layer; an insertion layer disposed between the first electrode and the piezoelectric layer; and a lower frame disposed in the cavity. At least a portion of the lower frame overlaps the insertion layer.Type: ApplicationFiled: April 15, 2021Publication date: March 17, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Yoon KIM, Won HAN, Sang Hyun YI, Jae Hyoung GIL, Sang Kee YOON, Moon Chul LEE
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Publication number: 20210313955Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a protective layer disposed to cover at least the metal pad.Type: ApplicationFiled: July 30, 2020Publication date: October 7, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Hyun LIM, Sang Hyun YI, Yong Suk KIM, Sung Jun LEE, Jae Hyoung GIL, Dong Hyun PARK
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Publication number: 20210142962Abstract: An example portable electronic device includes a front glass cover; a rear cover; a bezel surrounding a space defined by the front cover and the rear cover, the bezel including a portion including an opening; a display device built in the space; and a plate including a plane parallel to the front cover within the space. The example electronic device includes a key movably inserted in the opening; a support structure mounted on the plate or a portion of the bezel and including a hole through which the key passes; a dome button mounted on the support structure and arranged to face the first surface of the key and the hole so that the key can be pressed; and a waterproof structure including a flexible material.Type: ApplicationFiled: January 19, 2021Publication date: May 13, 2021Inventors: Jong-Min CHOI, Hyuk-Jae JANG, Woong-Chan KIM, Jung-Tae KIM, Dae-Hyeong PARK, Sang-Hyun YI, Jae-Ryang LEE, Jeong-Goo JEON, Sung-Gun CHO, Sung-Joo CHO, Young-Sik CHOI, Soon-Woong YANG, Min-Sung LEE
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Patent number: 10992281Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.Type: GrantFiled: May 1, 2019Date of Patent: April 27, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Suk Kim, Moon Chul Lee, Sung Jun Lee, Chang Hyun Lim, Jae Hyoung Gil, Sang Hyun Yi
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Patent number: 10910170Abstract: Various embodiments relating to an electronic device including a key module are disclosed, and according to one embodiment, a portable electronic device comprises: a front glass cover defining the front surface of the electronic device; a rear cover defining the rear surface of the electronic device; a bezel surrounding a space defined by the front cover and the rear cover, the bezel being integrally formed with or separately formed from the rear cover, the bezel including a portion including an opening; a display device built in the space and including a screen area exposed through the front cover; and a plate including a plane parallel to the front cover within the space, wherein the opening penetrates from the outside of the bezel toward the space in a first direction.Type: GrantFiled: August 1, 2016Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong-Min Choi, Hyuk-Jae Jang, Woong-Chan Kim, Jung-Tae Kim, Dae-Hyeong Park, Sang-Hyun Yi, Jae-Ryang Lee, Jeong-Goo Jeon, Sung-Gun Cho, Sung-Joo Cho, Young-Sik Choi, Soon-Woong Yang, Min-Sung Lee
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Patent number: 10790798Abstract: An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.Type: GrantFiled: September 27, 2016Date of Patent: September 29, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Suong Yang, Sang Hyun Yi, Ho Joon Park, Yeong Gyu Lee
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Patent number: 10715099Abstract: A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.Type: GrantFiled: September 14, 2017Date of Patent: July 14, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Je Hong Kyoung, Jin Suk Son, Hwa Sun Lee, Sang Hyun Yi
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Publication number: 20190356293Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.Type: ApplicationFiled: May 1, 2019Publication date: November 21, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Suk KIM, Moon Chul LEE, Sung Jun LEE, Chang Hyun LIM, Jae Hyoung GIL, Sang Hyun YI
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Patent number: 10340882Abstract: A bulk acoustic wave filter includes a substrate, a first electrode and a second electrode disposed on the substrate, a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes, and a passive element disposed on one surface of a housing. The housing is coupled to the substrate to accommodate the piezoelectric layer, the first electrode and the second electrode.Type: GrantFiled: June 6, 2017Date of Patent: July 2, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Sang Hyun Yi
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Publication number: 20190080860Abstract: Various embodiments relating to an electronic device including a key module are disclosed, and according to one embodiment, a portable electronic device comprises: a front glass cover defining the front surface of the electronic device; a rear cover defining the rear surface of the electronic device; a bezel surrounding a space defined by the front cover and the rear cover, the bezel being integrally formed with or separately formed from the rear cover, the bezel including a portion including an opening; a display device built in the space and including a screen area exposed through the front cover; and a plate including a plane parallel to the front cover within the space, wherein the opening penetrates from the outside of the bezel toward the space in a first direction.Type: ApplicationFiled: August 1, 2016Publication date: March 14, 2019Inventors: Jong-Min CHOI, Hyuk-Jae JANG, Woong-Chan KIM, Jung-Tae KIM, Dae-Hyeong PARK, Sang-Hyun YI, Jae-Ryang LEE, Jeong-Goo JEON, Sung-Gun CHO, Sung-Joo CHO, Young-Sik CHOI, Soon-Woong YANG, Min-Sung LEE
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Publication number: 20180123554Abstract: A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.Type: ApplicationFiled: September 14, 2017Publication date: May 3, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Hong KYOUNG, Jin Suk SON, Hwa Sun LEE, Sang Hyun YI
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Publication number: 20180006632Abstract: A bulk acoustic wave filter includes a substrate, a first electrode and a second electrode disposed on the substrate, a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes, and a passive element disposed on one surface of a housing. The housing is coupled to the substrate to accommodate the piezoelectric layer, the first electrode and the second electrode.Type: ApplicationFiled: June 6, 2017Publication date: January 4, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Sang Hyun YI
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Publication number: 20170244379Abstract: An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.Type: ApplicationFiled: September 27, 2016Publication date: August 24, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Suong YANG, Sang Hyun YI, Ho Joon PARK, Yeong Gyu LEE
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Publication number: 20160077043Abstract: There is provided a biochip including: a first substrate having a first surface in which a plurality of grooves are provided to accommodate at least one type of culture medium therein, and including a first electrode which is connected to the plurality of grooves; and a second substrate having a first surface in which a plurality of biomaterial fixing parts are provided to attach at least one type of biomaterial thereto, and including a second electrode which is connected to the plurality of biomaterial fixing parts. The biochip can rapidly and precisely measure a reaction of the biomaterial.Type: ApplicationFiled: March 20, 2015Publication date: March 17, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventor: Sang Hyun YI
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Patent number: 9232680Abstract: An electronic device is provided. The electronic device includes a main frame, an opening portion formed in the main frame, a recess portion formed along a frame of the opening portion lower than a surface of the main frame, and a plate having frames seated on the recess portion, wherein at least one of the frames of the plate is formed of a curved portion that is curved inwardly. Accordingly, it is possible to absorb an external impact and prevent deformation just by a simple structure change of the plate.Type: GrantFiled: December 12, 2013Date of Patent: January 5, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Hyun Yi, Byoung-Uk Yoon, Ho-Eun Hwang, Jae-Woo Lee
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Publication number: 20150187706Abstract: A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.Type: ApplicationFiled: January 8, 2015Publication date: July 2, 2015Applicant: Conversant Intellectual Property Management Inc.Inventors: Sang-Hyun YI, Young-Nam KIM
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Patent number: 8946897Abstract: A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.Type: GrantFiled: March 14, 2013Date of Patent: February 3, 2015Assignee: Conversant Intellectual Property Management Inc.Inventors: Sang-Hyun Yi, Young-Nam Kim