Patents by Inventor Sang Il EUN

Sang Il EUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRIP LEVEL SUBSTRATE INCLUDING WARPAGE PREVENTING MEMBER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150156877
    Abstract: Disclosed herein is a strip level substrate having a plurality of unit level substrate regions partitioned by unit saw lines, including: a plurality of wiring layers and a plurality of insulating layers that are alternately stacked; and warpage preventing members disposed in unit saw line regions of an insulating layer bonded to a carrier member among the plurality of insulating layers, in order to improve warpage characteristics of the strip level substrate.
    Type: Application
    Filed: April 15, 2014
    Publication date: June 4, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Shik KANG, Jong Tae PARK, Sang Il EUN