Patents by Inventor Sang il Hong
Sang il Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240124404Abstract: The present invention relates to a composition for preventing, improving, or treating diseases related to advanced glycation end products, comprising an indole derivative or a pharmaceutically acceptable salt thereof. Specifically, the composition of the present invention possesses the effect of trapping methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
-
Publication number: 20240124399Abstract: The present invention relates to a novel indole derivative and a use thereof. The novel indole derivative according to the present invention traps methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.Type: ApplicationFiled: December 11, 2023Publication date: April 18, 2024Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
-
Patent number: 11927890Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.Type: GrantFiled: August 22, 2022Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seok Heo, Cha Won Koh, Sang Joon Hong, Hyun Woo Kim, Kyung-Won Kang, Dong-Wook Kim, Kyung Won Seo, Young Il Jang, Yong Suk Choi
-
Patent number: 9082016Abstract: A method of controlling a mobile apparatus includes acquiring a first original image and a second original image, extracting a first feature point of the first original image and a second feature point of the second original image, generating a first blurring image and a second blurring image by blurring the first original image and the second original image, respectively, calculating a similarity between at least two images of the first original image, the second original image, the first blurring image, and the second blurring image, determining a change in scale of the second original image based on the calculated similarity, and controlling at least one of an object recognition and a position recognition by matching the second feature point of the second original image to the first feature point of the first original image based on the change in scale.Type: GrantFiled: October 5, 2012Date of Patent: July 14, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Suk June Yoon, Kyung Shik Roh, Sang Il Hong, Seung Yong Hyung, Hyo Seok Hwang, Sung Hwan Ahn
-
Patent number: 8814241Abstract: A robot hand, which has an arbitrary object grasping function in the same manner as a human hand and a high precision and stable grasping function in the same manner as an industrial gripper and performs a pose similar to a human hand while having complete opposability without any increase in complexity or degree of freedom. The robot hand includes a base part, and a plurality of finger connection parts, and a plurality of finger modules connected to the plurality of finger connection parts. The finger connection parts connected to the base part are connected to adjacent finger connection parts by roll joints such that each pair the finger connection parts connected by the roll joints is driven together, and the finger connection parts adjacent to the finger connection parts connected to the base part are driven separately from the finger connection parts connected to the base part.Type: GrantFiled: September 12, 2011Date of Patent: August 26, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Yong Jae Kim, Duke Kimm, Sang Il Hong
-
Patent number: 8427712Abstract: A method to compress exposure data may include converting image data into a plurality of exposure data, generating new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and compressing the new exposure data. An exposure apparatus may include a conversion unit that converts image data into a plurality of exposure data, a control unit that generates new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and a compression unit that compresses the new exposure data.Type: GrantFiled: October 29, 2009Date of Patent: April 23, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Ho Seok Choi, Sang Don Jang, Dong Seok Baek, Sang Geun Park, Myung Ho Kim, Duke Kimm, Jung Hyeon Kim, Sang-il Hong
-
Patent number: 8327534Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.Type: GrantFiled: December 17, 2010Date of Patent: December 11, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Min Young Park, Young Jun Moon, Hyun Joo Han, Gyun Heo, Kyung Woon Jang, Sang il Hong, Dong Seok Baek
-
Publication number: 20120068486Abstract: A robot hand, which has an arbitrary object grasping function in the same manner as a human hand and a high precision and stable grasping function in the same manner as an industrial gripper and performs a pose similar to a human hand while having complete opposability without any increase in complexity or degree of freedom. The robot hand includes a base part, and a plurality of finger connection parts, and a plurality of finger modules connected to the plurality of finger connection parts. The finger connection parts connected to the base part are connected to adjacent finger connection parts by roll joints such that each pair the finger connection parts connected by the roll joints is driven together, and the finger connection parts adjacent to the finger connection parts connected to the base part are driven separately from the finger connection parts connected to the base part.Type: ApplicationFiled: September 12, 2011Publication date: March 22, 2012Applicant: Samsung Electronics Co., Ltd.Inventors: Yong Jae KIM, Duke Kimm, Sang Il Hong
-
Publication number: 20120018084Abstract: Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.Type: ApplicationFiled: July 6, 2011Publication date: January 26, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Woon Jang, Seungbae Park, Young Jun Moon, Soon Min Hong, Chang-kyu Chung, Dae Jung Kim, Sang il Hong
-
Publication number: 20110154661Abstract: Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.Type: ApplicationFiled: December 17, 2010Publication date: June 30, 2011Applicant: Samsung Electronics Co., Ltd.Inventors: Min Young Park, Young Jun Moon, Hyun Joo Han, Gyun Heo, Kyung Woon Jang, Sang il Hong, Dong Seok Baek
-
Publication number: 20100110214Abstract: A method to compress exposure data may include converting image data into a plurality of exposure data, generating new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and compressing the new exposure data. An exposure apparatus may include a conversion unit that converts image data into a plurality of exposure data, a control unit that generates new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and a compression unit that compresses the new exposure data.Type: ApplicationFiled: October 29, 2009Publication date: May 6, 2010Inventors: Ho Seok Choi, Sang Don Jang, Dong Seok Baek, Sang Geun Park, Myung Ho Kim, Duke Kimm, Jung Hyeon Kim, Sang-il Hong
-
Publication number: 20100071847Abstract: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.Type: ApplicationFiled: August 28, 2009Publication date: March 25, 2010Inventors: Jae Bong Shin, Byung Joon Lee, Seung Dae Seok, Seung Woo Choi, Jung Hyeon Kim, Sang il Hong
-
Publication number: 20080300351Abstract: Disclosed herein is a coloring binder, and method of preparing it, which is mixed with a colored asphalt concrete mixture for use in road pavement, thus ensuring clear color and excellent weather resistance and durability. The method includes loading rubber latex into a mixer; loading process oil heated to 140-180° C.Type: ApplicationFiled: August 12, 2008Publication date: December 4, 2008Applicant: ASPHALT ENHANCEMENTS, LLCInventors: SengWoo YOON, Choon Bae LEE, Sang-Il HONG
-
Publication number: 20060047059Abstract: Disclosed herein is a coloring binder, and method of preparing it, which is mixed with a colored asphalt concrete mixture for use in road pavement, thus ensuring clear color and excellent weather resistance and durability. The method includes loading rubber latex into a mixer; loading process oil heated to 140-180° C.Type: ApplicationFiled: August 15, 2005Publication date: March 2, 2006Inventors: SengWoo Yoon, Choon Lee, Sang-Il Hong