Patents by Inventor Sang-in Lee

Sang-in Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079312
    Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: KwanJai LEE, Jae-Min JUNG, Jeong-Kyu HA, Sang-Uk HAN
  • Publication number: 20240078934
    Abstract: A display device and a method of manufacturing a support film are provided. The display device includes a display panel that slides in a first direction, a panel support that supports a bottom surface of the display panel, and a support film disposed between the display panel and the panel support, wherein the support film includes a base portion and buffer members each in a rod shape dispersed in the base portion.
    Type: Application
    Filed: May 9, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Jung Hun LEE, Sung Sang AHN
  • Publication number: 20240075496
    Abstract: A deposition apparatus includes a deposition member providing a deposition material, a stage including a first rear surface, a first front surface opposite to the first rear surface, and a first inner side surface extended to the first rear surface and the first front surface and defining a first opening, a mask frame including a second rear surface facing the first front surface, a second front surface opposite to the second rear surface, and a second inner side surface extended to the second front surface and the second rear surface and defining a second opening, masks disposed on the second front surface and each being provided with a plurality of deposition openings defined therethrough to correspond to the second opening, and a heat dissipation plate disposed between the deposition member and the stage and covering the first rear surface, the first inner side surface, and the second side inner surface.
    Type: Application
    Filed: July 7, 2023
    Publication date: March 7, 2024
    Inventors: JONGYOON LEE, SOKWON NOH, SANG MIN YI
  • Patent number: 11918531
    Abstract: Provided is a thermotherapy device, which includes a first housing (10), a second housing (20) disposed under the first housing (10), a transfer plate (30), at both sides of which transfer rollers (31) are provided, and a pair of guide rails (40) that is provided to the second housing (20) and on which the respective transfer rollers (31) of the transfer plate (30) are placed. The pair of guide rails (40) are integrally molded when the second housing (20) is injection-molded. Thus, since the guide rails on which the transfer rollers of the transfer plate travel are integrally molded when the second housing is injection-molded, inefficiency caused by mounting separate rails as in the related art is removed, and thereby assemblability, productivity, and economic efficiency of the thermotherapy device can be improved.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 5, 2024
    Assignee: Ceragem Co., Ltd.
    Inventors: Dong Myoung Lee, Sang Min Lee, Ho Sang Yu, Ji Hoon Park, Sang Ui Choi
  • Patent number: 11920707
    Abstract: A sealed sleeve installed at an insertion coupling portion in a state in which a first pipe and a second pipe are insertion coupled to each other in order to seal couple the first pipe having a first outer diameter and a first inner diameter and the second pipe having a second outer diameter and a second inner diameter larger than the first outer diameter includes: a pillar shaped-main body having a main body central shaft; a through-hole formed using the main body central shaft as a central shaft on the main body and having an inlet as a second pipe side opening in an installation state and an outlet as a first pipe side opening in an installation state, wherein in the through-hole, a pressing portion that applies a sealing pressure to the insertion coupling portion is formed in a portion of an inner wall, and an inner diameter of the pressing portion is smaller than the second outer diameter.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: March 5, 2024
    Assignees: HANATECH CO., LTD., AIM TECH CO., LTD.
    Inventors: Chang Hwan Bae, Hyo Sang Lee
  • Patent number: 11922031
    Abstract: Methods, apparatuses, and systems related to operations for controlling direct refresh management (DRFM) operations. A memory may process a DRFM sample command using bank logic located downstream from a command decoder. The bank logic may be configured to process the DRFM sample command according to an operating state of a targeted memory bank.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Joo-Sang Lee, Navya Sri Sreeram
  • Publication number: 20240067056
    Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.
    Type: Application
    Filed: March 6, 2023
    Publication date: February 29, 2024
    Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
  • Publication number: 20240071070
    Abstract: Provided is an image recognition method including the steps of: for a deep learning network that carries out object recognition on a random image, carrying out quantization corresponding to the number of a plurality of different bits to generate a plurality of quantization models respectively corresponding to the number of bits; receiving image data as an input for the deep learning network; determining the uncertainty of the input image data; selecting any one of the plurality of quantization models on the basis of the determined uncertainty; and recognizing an object from the image data by using the selected quantization model, and outputting, as the result of the object recognition, a label corresponding to the image data.
    Type: Application
    Filed: December 30, 2021
    Publication date: February 29, 2024
    Inventors: Ook Sang YOO, Ji Yea CHON, Hyuk Jae LEE, Kyeong Jong LIM
  • Publication number: 20240071262
    Abstract: An electronic price indicator according to an embodiment includes a display displaying product information, an NFC module configured to communicate with a user terminal, a Bluetooth module configured to communicate with the user terminal, and a processor configured to control the display to display the product information received from the user terminal through the Bluetooth module. The processor is further configured to release a sleep mode when receiving an interrupt from the user terminal through the NFC module, and perform Bluetooth communication with the user terminal by initiating a scan for a predetermined period of time to receive an advertising signal from the user terminal.
    Type: Application
    Filed: January 20, 2023
    Publication date: February 29, 2024
    Inventors: Jae Gun HEO, Chung Hee LEE, Do Sang KWON, Woo Seok HAN, Chan LEE, Ji Hoon KIM, Bo II SEO
  • Publication number: 20240074258
    Abstract: An electronic device includes a display device, which may be fabricated using a described method. The display device includes a glass substrate including a first surface, a second surface opposite the first surface, and a side surface between the first surface and the second surface, an outermost structure on the first surface of the glass substrate and located adjacent to an edge of one side of the glass substrate, and a display area including a plurality of light emitting areas on the first surface of the glass substrate and located farther from the edge of the one side of the glass substrate than the outermost structure is. A minimum distance from the side surface of the glass substrate to the outermost structure is equal to 130 ?m or less.
    Type: Application
    Filed: May 5, 2023
    Publication date: February 29, 2024
    Inventors: Wan Jung KIM, Dong Jo KIM, Sun Hwa KIM, Young Ji KIM, Chang Sik KIM, Kyung Ah NAM, Hyo Young MUN, Yong Seung PARK, Yi Seul UM, Dae Sang YUN, Kwan Hee LEE, So Young LEE, Young Hoon LEE, Young Seo CHOI, Sun Young KIM, Ji Won SOHN, Do Young LEE, Seung Hoon LEE
  • Patent number: 11913029
    Abstract: Disclosed herein are platforms, systems, and methods including a cell culture system that includes a cell culture container comprising a cell culture, the cell culture receiving input cells, a cell imaging subsystem configured to acquire images of the cell culture, a computing subsystem configured to perform a cell culture process on the cell culture according to the images acquired by the cell imaging subsystem, and a cell editing subsystem configured to edit the cell culture to produce output cell products according to the cell culture process.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: February 27, 2024
    Assignee: CELLINO BIOTECH, INC.
    Inventors: Matthias Wagner, Suvi Aivio, Mariangela Amenduni, Catherine Pilsmaker, Arnaldo Pereira, Ananya Zutshi, Anthia Toure, Steven Nagle, Ozge Whiting, George Harb, Matthew Sullivan, Maya Berlin-Udi, Stefanie Morgan, Nick Seay, Sang Lee, Scott Luro
  • Patent number: 11916207
    Abstract: A battery cell having an electrode main body, in which a positive electrode and a negative electrode, each having an electrode mixture is coated on at least one surface of a metallic current collector, and a separation film interposed between the positive electrode and the negative electrode are wound together, a metal can, which accommodates the electrode main body together with an electrolyte solution; and a sealing tape attached to an exterior surface of the electrode main body so as to fix a distal end portion of the electrode main body, the sealing tape including a heat conductive material to provide heat conduction between the electrode main body and the metal can is provided.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: February 27, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Wook Hee Jang, Sang Sok Jung, Sangjoon Park, Roun Kim, Gilyoung Lee
  • Patent number: 11911153
    Abstract: The present invention provides a device for measuring biological information including a sensor array, wherein the sensor array includes a plurality of sensors that are either sensors for amplifying photoreactivity or sensors forming an island network connected by a plurality of multi-channels and, in the device, the average value of biological information about the skin tissues is measured based on values output from the sensor array, and a method of measuring biological information using the device.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignees: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY, Korea Electronics Technology Institute
    Inventors: Sun Kook Kim, Sung Ho Lee, Min Goo Lee, Hyuk Sang Jung, Min Jung Kim, Young Ki Hong, Won Geun Song
  • Patent number: 11916309
    Abstract: An apparatus and method for transmitting and receiving magnetic field signals in a magnetic field communication system are provided. The apparatus includes a controller configured to generate a communication signal, matching units that are configured to receive the communication signal and that respectively correspond to different matching frequencies, and loop antennas that are connected to the matching units, respectively, and that are configured to convert communication signals according to the different matching frequencies into magnetic transmission signals in the form of magnetic field energy and to transmit the magnetic transmission signals.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: February 27, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jaewoo Lee, In Kui Cho, Sang-Won Kim, Seong-Min Kim, Ho Jin Lee, Jang Yeol Kim, Jung Ick Moon, Woo Cheon Park, Je Hoon Yun, Hyunjoon Lee, Dong Won Jang
  • Patent number: 11916523
    Abstract: An amplification apparatus includes an amplifier having an inverting terminal, and a non-inverting terminal connected to a reset voltage node, a first capacitor connected to the inverting terminal, an input voltage being applied to the first capacitor, a second capacitor connected to the inverting terminal and an output terminal of the amplifier, and a duty-cycled resistor, connected in parallel to the second capacitor, including a first resistor. The duty-cycled resistor is configured to connect the first resistor and the inverting terminal and to disconnect the first resistor and the reset voltage node during a first time interval included in a period to complete an on-and-off cycle of the duty-cycled resistor, and disconnect the first resistor and the inverting terminal and to connect the first resistor and the reset voltage node during a second time interval included in the period.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 27, 2024
    Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Wonseok Lee, Kent Edrian Lozada, Seung Tak Ryu, Sang Joon Kim
  • Patent number: 11915684
    Abstract: A method and an electronic device for translating a speech signal between a first language and a second language with minimized translation delay by translating fewer than all words of the speech signal according to a level of understanding of the second language by a user that receives the translation.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-sang Yu, Sang-ha Kim, Jong-youb Ryu, Yoon-jung Choi, Eun-kyoung Kim, Jae-won Lee
  • Publication number: 20240062801
    Abstract: Memory devices, systems, and associated methods with per die temperature-compensated refresh control, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory cells and a sensor configured to measure a temperature of the memory device. The memory device determines a frequency at which it is receiving refresh commands. The memory device is further configured to skip refresh operations of the memory cells based, at least in part, on the determination and on the temperature of the memory device.
    Type: Application
    Filed: September 1, 2023
    Publication date: February 22, 2024
    Inventors: James S. Rehmeyer, Jason M. Johnson, Joo-Sang Lee
  • Patent number: 11905431
    Abstract: The present invention is a polyimide varnish for conductor coating, which provides a polyimide varnish comprising: a polyamic acid solution prepared through polymerization of at least one dianhydride monomer and at least one diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; an alkoxy silane coupling agent; and an antioxidant, wherein the polyimide varnish has a solid content of 15 to 38 wt % on the basis of the total weight thereof, and a viscosity at 23° C. of 500 to 9,000 cP, and the coated material prepared from the polyimide varnish has a degree of softening resistance of 520° C. or higher, and a breakdown voltage (BDV) of 8 kV/mm or higher.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: February 20, 2024
    Assignee: PI ADVANCED MATERIALS CO., LTD.
    Inventors: In Hwan Hwang, Ik Sang Lee, Jeong Yeul Choi
  • Patent number: 11901417
    Abstract: Wafers including a diamond layer and a semiconductor layer having III-Nitride compounds and methods for fabricating the wafers are provided. A nucleation layer, at least one semiconductor layer having III-Nitride compound and a protection layer are formed on a silicon substrate. Then, a silicon carrier wafer is glass bonded to the protection layer. Subsequently the silicon substrate, nucleation layer and a portion of the semiconductor layer are removed. Then, an intermediate layer, a seed layer and a diamond layer are sequentially deposited on the III-Nitride layer. Next, a substrate wafer that includes a glass substrate (or a silicon substrate covered by a protection layer) is glass bonded to the diamond layer. Then, the silicon carrier wafer and the protection layer are removed.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: February 13, 2024
    Assignee: RFHIC Corporation
    Inventor: Won Sang Lee
  • Patent number: 11901418
    Abstract: Wafers including a diamond layer and a semiconductor layer having III-Nitride compounds and methods for fabricating the wafers are provided. A nucleation layer, at least one semiconductor layer having III-Nitride compound and a protection layer are formed on a silicon substrate. Then, a silicon carrier wafer is glass bonded to the protection layer. Subsequently the silicon substrate, nucleation layer and a portion of the semiconductor layer are removed. Then, an intermediate layer, a seed layer and a diamond layer are sequentially deposited on the III-Nitride layer. Next, a support wafer that includes a GaN layer (or a silicon layer covered by a protection layer) is deposited on the diamond layer. Then, the silicon carrier wafer and the protection layer are removed.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: February 13, 2024
    Assignee: RFHIC Corporation
    Inventor: Won Sang Lee