Patents by Inventor Sang In YOON

Sang In YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180212132
    Abstract: The thermoelement according to one embodiment of the present invention includes: a first substrate; multiple p-type thermoelectric legs and multiple n-type thermoelectric legs, which are alternately disposed on the first substrate; a second substrate disposed on the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs; and multiple electrodes for serially connecting the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs, wherein the peak number of the n-type thermoelectric legs and that of the p-type thermoelectric legs differ in X-ray diffraction (XRD) analysis in the range of 2?=20-60°.
    Type: Application
    Filed: July 20, 2016
    Publication date: July 26, 2018
    Inventors: Sang In YOON, Sung Chul KIM, Myoung Lae ROH
  • Patent number: 9923123
    Abstract: A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: March 20, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jeong Han Kim, Jeung Ook Park, Sang In Yoon, Hyun Gu Im
  • Patent number: 9812618
    Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: November 7, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jaehun Jeong, Sung Bae Moon, Sang In Yoon, Mi Jin Lee, Yuwon Lee
  • Patent number: 9681532
    Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: June 13, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang In Yoon, Eun Jin Kim, Jeung Ook Park, Hyun Gu Im
  • Publication number: 20170069798
    Abstract: The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.
    Type: Application
    Filed: March 27, 2015
    Publication date: March 9, 2017
    Inventors: Jeong Han KIM, Jeung Ook PARK, Sang In YOON, Hyun Gu IM
  • Publication number: 20160381782
    Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.
    Type: Application
    Filed: May 8, 2014
    Publication date: December 29, 2016
    Inventors: Sang In YOON, Eun Jin KIM, Jeung Ook PARK, Hyun Gu IM
  • Patent number: 9241399
    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 19, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang In Yoon, Jeong Han Kim, Jeung Ook Park, Hyun Gu Im
  • Publication number: 20160005937
    Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.
    Type: Application
    Filed: February 10, 2014
    Publication date: January 7, 2016
    Inventors: Jaehun Jeong, Sung Bae Moon, Sang In Yoon, Mi Jin Lee, Yuwon Lee
  • Publication number: 20150181691
    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 25, 2015
    Inventors: Sang In YOON, Jeong Han Kim, Jeung Ook Park, Hyun Gu IM
  • Patent number: 9048402
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and a silicon-containing alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: June 2, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Sang In Yoon, Jae Hun Jeong, Min Young Kim
  • Patent number: 9024347
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: May 5, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Bae Moon, Jae Hun Jeong, Sang In Yoon
  • Publication number: 20130320379
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Sung Bae MOON, Jae Hun JEONG, Sang In YOON
  • Publication number: 20130320393
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Sung Bae MOON, Sang In YOON, Jae Hun JEONG, Min Young KIM