Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

Abstract: A test method for a semiconductor device includes: loading a test tray having semiconductor devices of first and second lots arranged thereon into a test chamber; storing lot information of each of the semiconductor devices; performing a test program on each of the semiconductor devices; obtaining ID information of each of the semiconductor devices; matching the ID information with the lot information to generate lot sorting information; and sorting the semiconductor devices based on results of the test program and the lot sorting information.

Abstract: A test method for a semiconductor device includes: loading a test tray having semiconductor devices of first and second lots arranged thereon into a test chamber; storing lot information of each of the semiconductor devices; performing a test program on each of the semiconductor devices; obtaining ID information of each of the semiconductor devices; matching the ID information with the lot information to generate lot sorting information; and sorting the semiconductor devices based on results of the test program and the lot sorting information.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor memory device includes a memory cell array and a refresh control circuit. The refresh circuit is configured to: perform a second burst refresh operation on the memory cell rows after the memory cell rows exit from a self refresh operation, and not perform the second burst refresh operation on the memory cell rows after the memory cell rows exit from a self refresh operation. Whether the refresh control circuit performs or does not perform the second burst refresh operation is based on a comparison between an entering time for the self refresh operation of the memory cell rows and a reference time.

Abstract: A semiconductor memory device and a self-refresh method of the semiconductor memory device. The semiconductor memory device includes: a memory cell array including one or more memory cells; a sense amplifier connected to a sensing line and a complementary sensing line and sensing/amplifying data stored in the one or more memory cells; and a sense amplifier control circuit sequentially supplying a first voltage and a second voltage having different levels to the sense amplifier through the sensing line during a refresh operation.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor memory device includes a memory cell array and an error correction code (ECC) engine. The memory cell array stores bits of normal data and parity data therein. The ECC engine performs a masking operation in a masking mode, the ECC engine calculating the parity data using the normal data. The normal data includes a first section that is to be updated and a second section that is to be saved by the masking operation.

Abstract: Semiconductor memory devices having hierarchical word line structures are provided. A block of sub-word line driver circuits (SWDB) are disposed between a first block of memory and a second block of memory. A SWDB includes a plurality of sub-wordline driver (SWD) circuits arranged in a plurality of SWD columns each having four SWD circuits extending in a first direction between the first and second blocks of memory. Two adjacent SWD columns include a SWD group for driving a plurality of sub-word lines extending from the SWD group along the first direction into the first and second blocks of memory.

Abstract: A semiconductor memory device having internal circuits responsive to temperature data, in order to compensate an output characteristic change of the internal circuits and reduce power consumption depending on temperature change, and method thereof are disclosed. The semiconductor memory device may include a temperature sensing circuit and an internal circuit. The temperature sensing circuit may generate and output temperature data in response to ambient temperature of the semiconductor memory device. The internal circuit may adjust an output level of an output signal in response to the temperature data from the temperature sensing circuit.

Abstract: A semiconductor memory device includes a fuse box including a plurality of address antifuse circuits, each address antifuse circuit outputting an address fuse signal according to a program state of an antifuse included in the corresponding address antifuse circuit, an address comparator including a plurality of address comparison signal generators, each address comparison signal generator combining a first test signal for determining an initial defect of the antifuse and a corresponding bit of an externally applied address signal to generate a test address, and comparing the test address with the address fuse signal to generate an address comparison signal, and a redundant enable signal generator for enabling a redundancy enable signal in response to a plurality of address comparison signals.

Abstract: A semiconductor memory device includes a memory cell array and an error correction code (ECC) engine. The memory cell array stores bits of normal data and parity data therein. The ECC engine performs a masking operation in a masking mode, the ECC engine calculating the parity data using the normal data. The normal data includes a first section that is to be updated and a second section that is to be saved by the masking operation.

Abstract: Semiconductor memory devices having hierarchical word line structures are provided in which sub-word line driver circuitry is designed with layout patterns that enable increased integration density and high performance operation.

Abstract: An external high/low voltage compatible semiconductor memory device includes an internal voltage pad, an internal voltage generation circuit, and an internal voltage control signal generation circuit. The internal voltage pad connects a low external voltage with an internal voltage, and the internal voltage generation circuit generates an internal voltage in response to an internal voltage control signal and a high external voltage. The internal voltage control signal generation circuit generates an internal voltage control signal according to an high or low external voltage. Thus, a database of the semiconductor memory device can be managed without classifying the database into databases for the high voltage and databases for the low voltage because of the internal voltage control signal. In addition, the internal voltage level is stable because charges provided to the internal voltage are regulated according to a voltage level of the external voltage.

Abstract: A semiconductor memory device having internal circuits responsive to temperature data, in order to compensate an output characteristic change of the internal circuits and reduce power consumption depending on temperature change, and method thereof are disclosed. The semiconductor memory device may include a temperature sensing circuit and an internal circuit. The temperature sensing circuit may generate and output temperature data in response to ambient temperature of the semiconductor memory device. The internal circuit may adjust an output level of an output signal in response to the temperature data from the temperature sensing circuit.

Abstract: In this circuit, an external voltage source is supplied or down converted in response to a normal operating mode to provide the internal voltage source of a first level to the internal circuit. The external voltage source is converted to a voltage of a second level, lower than the first level, in response to a low consumption power mode having a complementary relation with the normal mode.