Patents by Inventor Sang Jae Shin

Sang Jae Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Patent number: 11962001
    Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Industry Academy Cooperation Foundation of Sejong University
    Inventors: Seung Min Oh, Jun Ki Rhee, Yoon Sung Lee, Ji Eun Lee, Sung Ho Ban, Ko Eun Kim, Woo Young Jin, Sang Mok Park, Sang Hun Lee, Seung Taek Myung, Hee Jae Kim, Min Young Shin
  • Publication number: 20240101803
    Abstract: Disclosed are a thermoplastic elastomeric composition for vehicle mounts which has improved surface energy and compression set while solving reduction in wear strength, by blending EPDM rubber, polypropylene, silicon, and poly(styrene-ethylene-butadiene-styrene) (SEBS) in appropriate amounts, and a molded article including the same.
    Type: Application
    Filed: May 2, 2023
    Publication date: March 28, 2024
    Inventors: Sang Hyun Lee, Young Chul Shin, Ji Hye Park, Ki Hyun Cho, Han Sang Lee, Kyoung Min Hong, Ki Jae Kim
  • Publication number: 20240074065
    Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
    Type: Application
    Filed: February 17, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Yong Gil NAMGUNG, Jong Hoon SHIN, Sang Soon CHOI, Young Chul AN
  • Patent number: 11505250
    Abstract: Provided is a vehicle sub-frame including a front cross member, a rear cross member, and left and right side members mounted to connect the front cross member and the rear cross member to each other. Each of the left and right side members has a protrusion that protrudes laterally at a corner portion of a rear end portion thereof, the corner portion being joined to a corner portion of the rear cross member. A weld joint is formed by welding to the rear cross member along a laterally extending portion of a trim line portion of the protrusion, in which the trim line portion of the protrusion is the perimeter of the protrusion.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 22, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Dong Hee Industrial Co., Ltd.
    Inventors: Gi Bong Jo, Hyun Min Jang, Sang Jae Shin, Chul Woo Kwak, Soo Cheol Lee, Se Hoon Kim
  • Publication number: 20210354758
    Abstract: Provided is a vehicle sub-frame including a front cross member, a rear cross member, and left and right side members mounted to connect the front cross member and the rear cross member to each other. Each of the left and right side members has a protrusion that protrudes laterally at a corner portion of a rear end portion thereof, the corner portion being joined to a corner portion of the rear cross member. A weld joint is formed by welding to the rear cross member along a laterally extending portion of a trim line portion of the protrusion, in which the trim line portion of the protrusion is the perimeter of the protrusion.
    Type: Application
    Filed: September 25, 2020
    Publication date: November 18, 2021
    Applicants: Hyundai Motor Company, Kia Motors Corporation, Dong Hee Industrial Co., Ltd.
    Inventors: Gi Bong Jo, Hyun Min Jang, Sang Jae Shin, Chul Woo Kwak, Soo Cheol Lee, Se Hoon Kim
  • Publication number: 20140212682
    Abstract: Provided is a method for manufacturing a metal structure in which an array of a plurality of pin arrangements is formed on a surface of a metal, in which the method includes: performing a laser processing along a route between pin regions in which the pins are to be formed on a metal base material to form a dross on the pin regions, and repeating the laser processing. As the dross formed in each pin region is repeatedly cast and recast during the repetitive laser processing, the recast layer is formed in a shape of the pin.
    Type: Application
    Filed: February 10, 2012
    Publication date: July 31, 2014
    Applicant: SNU R&DB FOUNDATION
    Inventors: Se Won Lee, Hong Shik Shin, Chong Nam Chu, Haan Kim, Sang Jae Shin