Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: Provided is an electronic apparatus and a method thereof. The method includes identifying pickup item information, identifying at least one storage place corresponding to the pickup item information among a plurality of storage places in the item storage center based on information on or regarding an item group located at each of the plurality of storage places, and providing information on the identified storage place and the pickup item information to a manager terminal, wherein the item group comprises at least one same item corresponding to an item group, and at least a portion of a plurality of item groups comprising a same item are stored in different storage places in the item storage center.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: A semiconductor device including: a first transistor which include a first gate stack on a substrate; and a second transistor which includes a second gate stack on the substrate, wherein the first gate stack includes a first ferroelectric material layer disposed on the substrate, a first work function layer disposed on the first ferroelectric material layer and a first upper gate electrode disposed on the first work function layer, wherein the second gate stack includes a second ferroelectric material layer disposed on the substrate, a second work function layer disposed on the second ferroelectric material layer and a second upper gate electrode disposed on the second work function layer, wherein the first work function layer includes the same material as the second work function layer, and wherein an effective work function of the first gate stack is different from an effective work function of the second gate stack.

Abstract: A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.

Abstract: A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract: A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract: An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

Abstract: An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.

Abstract: The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed

Abstract: Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.

Abstract: A printed circuit board with embedded electronic components and fabrication method thereof are disclosed. The printed circuit board with embedded electronic components having outer electrodes comprising a substrate on which insertion holes are formed for containing the electronic components, a filler for filling the gap between the electronic component and the insertion hole to secure the electronic components, and attachment layers laminated onto the substrate in contact with the electrodes, with circuits formed on the attachment layers, may provide superior electrical reliability, as the outer electrodes of the electronic components are in contact with the attachment layers, and may reduce fabrication cost and time, as it is not necessary to form via holes.