Patents by Inventor Sang-Jo Yun

Sang-Jo Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125908
    Abstract: A method for manufacturing a LiDAR device is proposed. The method may include providing a LiDAR module including a laser emitting module and a laser detecting module to a target region. The method may also include adjusting, on the basis of first detecting data obtained from the laser detecting module, a relative position of a detecting optic module with respect to the laser detecting module. The method may further include adjusting, on the basis of image data obtained from at least one image sensor, a relative position of an emitting optic module with respect to the laser emitting module.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: Chan M LIM, Dong Kyu KIM, Chang Mo JEONG, Hoon Il JEONG, Eunsung KWON, Junhyun JO, Bumsik WON, Suwoo NOH, Sang Shin BAE, Seong Min YUN, Jong Hyun YIM
  • Patent number: 9496266
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes sequentially forming a mold layer and a preliminary support layer on a substrate, forming a plurality of lower electrodes through the preliminary support layer and the mold layer, removing a portion of the preliminary support layer between the plurality of lower electrodes to form a preliminary support layer pattern having an open area exposing a top surface of the mold layer, removing the mold layer to form a void between the substrate and the preliminary support layer pattern, filling the open area and the void with a sacrificial layer, and replacing the preliminary support layer pattern with a support pattern.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: November 15, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-Eun Kim, Young-Seung Cho, So-Hyun Park, Sang-Jo Yun
  • Publication number: 20160020212
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes sequentially forming a mold layer and a preliminary support layer on a substrate, forming a plurality of lower electrodes through the preliminary support layer and the mold layer, removing a portion of the preliminary support layer between the plurality of lower electrodes to form a preliminary support layer pattern having an open area exposing a top surface of the mold layer, removing the mold layer to form a void between the substrate and the preliminary support layer pattern, filling the open area and the void with a sacrificial layer, and replacing the preliminary support layer pattern with a support pattern.
    Type: Application
    Filed: January 13, 2015
    Publication date: January 21, 2016
    Inventors: Kyung-Eun Kim, Young-Seung Cho, So-Hyun Park, Sang-Jo Yun