Abstract: A gasifying apparatus including a variable gasifier and used as both a power generator and a combustion boiler and a method of driving the same are disclosed. A combustion boiler and a generator engine, driven with synthesis gas, are associated with a single gasifier, and the gasifying apparatus produces synthesis gas proper to a technical field of the gasifier by selectively applying an upflow gasifier and a downflow gasifier according to the technical field of the gasifier.

Abstract: There is provided an electrically controllable birefringence liquid crystal display (ECB-LCD) device, including: a liquid crystal panel including a first substrate, a second substrate, and a liquid crystal cell interposed between the first substrate and the second substrate and including a liquid crystal having positive dielectric anisotropy, the liquid crystal cell having a cell gap of 1 to 5 ?m and operating in an ECB mode; a first polarizer disposed on an upper portion of the first substrate and having a first absorption axis; a second polarizer disposed on a lower portion of the second substrate and having a second absorption axis; a first liquid crystal film interposed between the first substrate and the first polarizer; and a second liquid crystal film interposed between the second substrate and the second polarizer; wherein the first liquid crystal film includes a first base substrate; and a first liquid crystal layer formed on a surface of the first base substrate and including a nematic liquid crysta

Abstract: Provided are a liquid crystal film, a method of manufacturing a liquid crystal film, a method of controlling an average tilt angle of the liquid crystal film, a polarizing plate, and a liquid crystal display device. A liquid crystal film that has excellent properties including durability and an optical property and is capable of being effectively used for various uses may be provided. In addition, the physical properties of the liquid crystal film may be easily controlled according to a desired use.

Abstract: The present invention relates to an optical film, a method for manufacturing the same, and a liquid crystal display device including the same. In detail, the optical film according to the present invention includes an acryl-based substrate, a liquid crystal alignment film, and a liquid crystal film, the liquid crystal alignment film can maintain strong adhesion strength between the acryl-based substrate and the liquid crystal alignment film and between the liquid crystal alignment film and the liquid crystal film by further introducing a monomer having a functional group capable of performing crosslinking reaction to the photoreactive polymer.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed is a heat radiation substrate, which includes a hybrid layer made of a thermoplastic resin, in particular, a liquid crystal polymer, and thus is lightweight and small thanks to the inherent properties of plastic and also is able to be mass produced, thus reducing the material and process costs.

Abstract: The present invention relates to an optical film, a method for manufacturing the same, and a liquid crystal display device including the same. In detail, the optical film according to the present invention includes an acryl-based substrate, a liquid crystal alignment film, and a liquid crystal film, the liquid crystal alignment film can maintain strong adhesion strength between the acryl-based substrate and the liquid crystal alignment film and between the liquid crystal alignment film and the liquid crystal film by further introducing a monomer having a functional group capable of performing crosslinking reaction to the photoreactive polymer.

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Abstract: A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices.

Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Abstract: Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.

Abstract: Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group.

Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.