Patents by Inventor Sang Kuk Choi
Sang Kuk Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8305221Abstract: Provided are an abrupt MIT device with variable MIT temperature or voltage, an MIT sensor using the abrupt MIT device, and an alarm apparatus and a secondary battery anti-explosion circuit including the MIT sensor. The MIT device includes an abrupt MIT layer undergoing an abrupt MIT at a transition temperature or a transition voltage and at least two electrode layers contacting the abrupt MIT layer. The transition temperature or the transition voltage varies with at least one of factors including a voltage applied to the electrode layers, a temperature, an electromagnetic wave, a pressure, and a gas concentration that affect the abrupt MIT layer. The MIT sensor is a temperature sensor, an infrared sensor, an image sensor, a pressure sensor, a gas-concentration sensor, or a switch. The alarm apparatus includes the MIT sensor and an alarm-signaling unit connected in series with the MIT sensor.Type: GrantFiled: May 30, 2007Date of Patent: November 6, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Hyun-Tak Kim, Bong-Jun Kim, Byung-Gyu Chae, Sun-Jin Yun, Sung-Youl Choi, Yong-Wook Lee, JungWook Lim, Sang-Kuk Choi, Kwang-Yong Kang
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Patent number: 8207750Abstract: Provided are a circuit for continuously measuring a discontinuous metal-insulator transition (MIT) of an MIT element and an MIT sensor using the circuit. The circuit comprises a to-be-measured object unit including the MIT element having a discontinuous MIT occurring at the transition voltage thereof, a power supply unit applying a predetermined pulse current or voltage signal to the to-be-measured object unit, a measurement unit measuring the discontinuous MIT of the MIT element, and a microprocessor controlling the power supply unit and the measurement unit. The discontinuous MIT measurement circuit continuously measures the discontinuous MIT of the MIT element, and thus it can be used as a sensor for sensing a variation in an external factor.Type: GrantFiled: July 5, 2007Date of Patent: June 26, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Hyun-Tak Kim, Bong-Jun Kim, Yong-Wook Lee, Sun-Jin Yun, Sang-Kuk Choi
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Patent number: 8053732Abstract: Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.Type: GrantFiled: August 7, 2009Date of Patent: November 8, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak, Seung Beom Kang
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Patent number: 7944360Abstract: Provided are a temperature sensor using a metal-insulator transition (MIT) device subject to abrupt MIT at a specific temperature and an alarm including the temperature sensor. The abrupt MIT device includes an abrupt MIT thin film and at least two electrode thin films that contacts the abrupt MIT thin film. The abrupt MIT device generates abrupt metal-insulator transition at a specific transition temperature. The alarm includes a temperature sensor comprising an abrupt MIT device, and an alarm signaling device serially connected to the temperature sensor. Accordingly, the alarm can be manufactured to have a simple circuit and be of a small size by including the temperature sensor using an abrupt MIT device.Type: GrantFiled: June 27, 2006Date of Patent: May 17, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Hyun-Tak Kim, Kwang-Yong Kang, Yong-Wook Lee, Byung-Gyu Chae, Bong-Jun Kim, Sang-Kuk Choi, Sun-Jin Yun
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Patent number: 7929308Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.Type: GrantFiled: August 5, 2009Date of Patent: April 19, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Hyun Tak Kim, Byung Gyu Chae, Bong Jun Kim
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Publication number: 20100182034Abstract: Provided are a circuit for continuously measuring a discontinuous metal-insulator transition (MIT) of an MIT element and an MIT sensor using the circuit. The circuit comprises a to-be-measured object unit including the MIT element having a discontinuous MIT occurring at the transition voltage thereof, a power supply unit applying a predetermined pulse current or voltage signal to the to-be-measured object unit, a measurement unit measuring the discontinuous MIT of the MIT element, and a microprocessor controlling the power supply unit and the measurement unit. The discontinuous MIT measurement circuit continuously measures the discontinuous MIT of the MIT element, and thus it can be used as a sensor for sensing a variation in an external factor.Type: ApplicationFiled: July 5, 2007Publication date: July 22, 2010Applicant: Electronics and Telecommunications Research InstituteInventors: Hyun-Tak Kim, Bong-Jun Kim, Yong-Wook Lee, Sun-Jin Yun, Sang-Kuk Choi
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Patent number: 7755100Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.Type: GrantFiled: July 21, 2008Date of Patent: July 13, 2010Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak
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Publication number: 20100155605Abstract: Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.Type: ApplicationFiled: August 7, 2009Publication date: June 24, 2010Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sang Kuk CHOI, Kwang Yong KANG, Mun Cheol Paek, Min Hwan KWAK, Seung Beom KANG
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Publication number: 20100157542Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.Type: ApplicationFiled: August 5, 2009Publication date: June 24, 2010Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sang Kuk CHOI, Hyun Tak KIM, Byung Gyu CHAE, Bong Jun KIM
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Publication number: 20100149640Abstract: Provided is a tunable diffraction grating apparatus including: a diffraction grating portion having a diffraction grating with an linearly variable grating interval, the diffraction grating being formed of an elastic member; a drive portion connected to the diffraction grating portion and applying a force to the diffraction grating portion to vary the grating interval; and a controller for controlling the drive portion to adjust the grating interval depending on a specific wavelength input from the exterior. Therefore, the tunable diffraction grating apparatus can vary a grating interval of a diffraction grating using an elastic material so that a signal of a frequency bandwidth of THz can also be used. In addition, it is possible to simplify structure of the apparatus to reduce the manufacturing cost thereof.Type: ApplicationFiled: July 7, 2009Publication date: June 17, 2010Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Mun Cheol Paek, Kwang Yong Kang, Sang Kuk Choi, Seung Hwan Lee, Se Young Jeong
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Patent number: 7732985Abstract: Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoelType: GrantFiled: September 20, 2005Date of Patent: June 8, 2010Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Dae Jun Kim, Jin Woo Jeong, Dae Yong Kim
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Publication number: 20100092183Abstract: A frequency tunable terahertz continuous wave generator controls the number of feedbacks of an optical signal output from an optical intensity modulator by adding a feedback loop between input and output terminals of the optical intensity modulator, thereby simply tuning a frequency of a terahertz continuous wave.Type: ApplicationFiled: June 30, 2009Publication date: April 15, 2010Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sungil Kim, Kwang Yong Kang, Mun Cheol Paek, Sang Kuk Choi, Min Hwan Kwak, Han Cheol Ryu
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Publication number: 20090315724Abstract: Provided are an abrupt MIT device with variable MIT temperature or voltage, an MIT sensor using the abrupt MIT device, and an alarm apparatus and a secondary battery anti-explosion circuit including the MIT sensor The MIT device includes an abrupt MIT layer undergoing an abrupt MIT at a transition temperature or a transition voltage and at least two electrode layers contacting the abrupt MIT layer. The transition temperature or the transition voltage varies with at least one of factors including a voltage applied to the electrode layers, a temperature, an electromagnetic wave, a pressure, and a gas concentration that affect the abrupt MIT layer. The MIT sensor is a temperature sensor, an infrared sensor, an image sensor, a pressure sensor, a gas-concentration sensor, or a switch. The alarm apparatus includes the MIT sensor and an alarm-signaling unit connected in series with the MIT sensor.Type: ApplicationFiled: May 30, 2007Publication date: December 24, 2009Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Hyun-Tak Kim, Bong-Jun Kim, Byung-Gyu Chae, Sun-Jin Yun, Sung-Youl Choi, Yong-Wook Lee, JungWook Lim, Sang-Kuk Choi, Kwang-Yong Kang
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Patent number: 7598594Abstract: Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.Type: GrantFiled: October 24, 2005Date of Patent: October 6, 2009Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Sunmoon UniversityInventors: Jin Woo Jeong, Dae Jun Kim, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
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Publication number: 20090152699Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.Type: ApplicationFiled: July 21, 2008Publication date: June 18, 2009Applicant: Electronics and Telecommunications Research InstituteInventors: Sang Kuk CHOI, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak
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Publication number: 20080297358Abstract: Provided are a temperature sensor using a metal-insulator transition (MIT) device subject to abrupt MIT at a specific temperature and an alarm including the temperature sensor. The abrupt MIT device includes an abrupt MIT thin film and at least two electrode thin films that contacts the abrupt MIT thin film. The abrupt MIT device generates abrupt metal-insulator transition at a specific transition temperature. The alarm includes a temperature sensor comprising an abrupt MIT device, and an alarm signaling device serially connected to the temperature sensor. Accordingly, the alarm can be manufactured to have a simple circuit and be of a small size by including the temperature sensor using an abrupt MIT device.Type: ApplicationFiled: June 27, 2006Publication date: December 4, 2008Applicant: Electronics and Telecommunications Research InstituteInventors: Hyun-Tak Kim, Kwang Yong Kang, Yong Wook Lee, Byung Gyu Chae, Bong Jun Kim, Sang Kuk Choi, Sun Jin Yun
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Patent number: 7394071Abstract: A micro column electron beam apparatus having a reduced number of interconnections is provided. The micro column electron beam apparatus includes: a low temperature co-fired ceramic (LTCC) substrate; a plurality of deflector electrodes attached to a predetermined top portion of the LTCC substrate; a pad electrode placed at a top edge of the LTCC substrate and transmitting an external signal to the deflector electrodes; and a connection unit placed in the LTCC substrate and electrically connecting the deflector electrode and the pad electrode.Type: GrantFiled: October 24, 2005Date of Patent: July 1, 2008Assignee: Electronics and Telecommunications Research InstituteInventors: Dae Jun Kim, Jin Woo Jeong, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
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Patent number: 7375351Abstract: Provided is a micro-column electron beam apparatus including: a base; an electron lens bracket on which an electron lens module can be fixed, mounted in a central portion of the base; an electron beam source tip module vertically disposed on the electron lens module; a pan spring plate stage module that is mounted over the base, supports the electron beam source tip module at a central portion thereof, and includes a three-coupling pan spring plate portion including first through third spring units that are coupled to the electron beam source tip module in three directions on a plane perpendicular to the vertical axis, which vertically passes the center of the electron beam source tip module, to elastically support the electron beam source tip module in three directions; a first piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a first axis perpendicular to the vertical axis; and a second piezoelectric actuator coupled to the pan spring plateType: GrantFiled: October 24, 2005Date of Patent: May 20, 2008Assignee: Electronics and Telecommunications Research InstututeInventors: Sang Kuk Choi, Dae Jun Kim, Jin Woo Jeong, Dae Yong Kim
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Patent number: 7307260Abstract: Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.Type: GrantFiled: July 1, 2005Date of Patent: December 11, 2007Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Dae Yong Kim
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Patent number: 7230251Abstract: Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.Type: GrantFiled: July 1, 2005Date of Patent: June 12, 2007Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Dae Yong Kim