Patents by Inventor Sang Kuk Choi

Sang Kuk Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8305221
    Abstract: Provided are an abrupt MIT device with variable MIT temperature or voltage, an MIT sensor using the abrupt MIT device, and an alarm apparatus and a secondary battery anti-explosion circuit including the MIT sensor. The MIT device includes an abrupt MIT layer undergoing an abrupt MIT at a transition temperature or a transition voltage and at least two electrode layers contacting the abrupt MIT layer. The transition temperature or the transition voltage varies with at least one of factors including a voltage applied to the electrode layers, a temperature, an electromagnetic wave, a pressure, and a gas concentration that affect the abrupt MIT layer. The MIT sensor is a temperature sensor, an infrared sensor, an image sensor, a pressure sensor, a gas-concentration sensor, or a switch. The alarm apparatus includes the MIT sensor and an alarm-signaling unit connected in series with the MIT sensor.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: November 6, 2012
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hyun-Tak Kim, Bong-Jun Kim, Byung-Gyu Chae, Sun-Jin Yun, Sung-Youl Choi, Yong-Wook Lee, JungWook Lim, Sang-Kuk Choi, Kwang-Yong Kang
  • Patent number: 8207750
    Abstract: Provided are a circuit for continuously measuring a discontinuous metal-insulator transition (MIT) of an MIT element and an MIT sensor using the circuit. The circuit comprises a to-be-measured object unit including the MIT element having a discontinuous MIT occurring at the transition voltage thereof, a power supply unit applying a predetermined pulse current or voltage signal to the to-be-measured object unit, a measurement unit measuring the discontinuous MIT of the MIT element, and a microprocessor controlling the power supply unit and the measurement unit. The discontinuous MIT measurement circuit continuously measures the discontinuous MIT of the MIT element, and thus it can be used as a sensor for sensing a variation in an external factor.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: June 26, 2012
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hyun-Tak Kim, Bong-Jun Kim, Yong-Wook Lee, Sun-Jin Yun, Sang-Kuk Choi
  • Patent number: 8053732
    Abstract: Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: November 8, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak, Seung Beom Kang
  • Patent number: 7944360
    Abstract: Provided are a temperature sensor using a metal-insulator transition (MIT) device subject to abrupt MIT at a specific temperature and an alarm including the temperature sensor. The abrupt MIT device includes an abrupt MIT thin film and at least two electrode thin films that contacts the abrupt MIT thin film. The abrupt MIT device generates abrupt metal-insulator transition at a specific transition temperature. The alarm includes a temperature sensor comprising an abrupt MIT device, and an alarm signaling device serially connected to the temperature sensor. Accordingly, the alarm can be manufactured to have a simple circuit and be of a small size by including the temperature sensor using an abrupt MIT device.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: May 17, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hyun-Tak Kim, Kwang-Yong Kang, Yong-Wook Lee, Byung-Gyu Chae, Bong-Jun Kim, Sang-Kuk Choi, Sun-Jin Yun
  • Patent number: 7929308
    Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: April 19, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Hyun Tak Kim, Byung Gyu Chae, Bong Jun Kim
  • Publication number: 20100182034
    Abstract: Provided are a circuit for continuously measuring a discontinuous metal-insulator transition (MIT) of an MIT element and an MIT sensor using the circuit. The circuit comprises a to-be-measured object unit including the MIT element having a discontinuous MIT occurring at the transition voltage thereof, a power supply unit applying a predetermined pulse current or voltage signal to the to-be-measured object unit, a measurement unit measuring the discontinuous MIT of the MIT element, and a microprocessor controlling the power supply unit and the measurement unit. The discontinuous MIT measurement circuit continuously measures the discontinuous MIT of the MIT element, and thus it can be used as a sensor for sensing a variation in an external factor.
    Type: Application
    Filed: July 5, 2007
    Publication date: July 22, 2010
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun-Tak Kim, Bong-Jun Kim, Yong-Wook Lee, Sun-Jin Yun, Sang-Kuk Choi
  • Patent number: 7755100
    Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: July 13, 2010
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak
  • Publication number: 20100155605
    Abstract: Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.
    Type: Application
    Filed: August 7, 2009
    Publication date: June 24, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sang Kuk CHOI, Kwang Yong KANG, Mun Cheol Paek, Min Hwan KWAK, Seung Beom KANG
  • Publication number: 20100157542
    Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.
    Type: Application
    Filed: August 5, 2009
    Publication date: June 24, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sang Kuk CHOI, Hyun Tak KIM, Byung Gyu CHAE, Bong Jun KIM
  • Publication number: 20100149640
    Abstract: Provided is a tunable diffraction grating apparatus including: a diffraction grating portion having a diffraction grating with an linearly variable grating interval, the diffraction grating being formed of an elastic member; a drive portion connected to the diffraction grating portion and applying a force to the diffraction grating portion to vary the grating interval; and a controller for controlling the drive portion to adjust the grating interval depending on a specific wavelength input from the exterior. Therefore, the tunable diffraction grating apparatus can vary a grating interval of a diffraction grating using an elastic material so that a signal of a frequency bandwidth of THz can also be used. In addition, it is possible to simplify structure of the apparatus to reduce the manufacturing cost thereof.
    Type: Application
    Filed: July 7, 2009
    Publication date: June 17, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Mun Cheol Paek, Kwang Yong Kang, Sang Kuk Choi, Seung Hwan Lee, Se Young Jeong
  • Patent number: 7732985
    Abstract: Provided is a micro stage comprising: a body having a vertically perforated through-hole passing through a central portion thereof; a bobbin including a tip portion with an electron emission tip embedded in the center thereof, and passing through the through-hole of the body to be moved in the through-hole along a first axis perpendicular to a vertical direction; a first piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in one direction along the first axis; a second piezoelectric element disposed on the body and lengthened when a voltage is applied thereto to push the bobbin in the other direction along the first axis; and an upper cover that is coupled to an upper portion of the body and has a through-hole, through which the bobbin passes and communicates with the through-hole of the body, wherein the bobbin can be positioned as desired along the first axis by adjusting the voltages applied to the first piezoelectric element and the second piezoel
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: June 8, 2010
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Dae Jun Kim, Jin Woo Jeong, Dae Yong Kim
  • Publication number: 20100092183
    Abstract: A frequency tunable terahertz continuous wave generator controls the number of feedbacks of an optical signal output from an optical intensity modulator by adding a feedback loop between input and output terminals of the optical intensity modulator, thereby simply tuning a frequency of a terahertz continuous wave.
    Type: Application
    Filed: June 30, 2009
    Publication date: April 15, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sungil Kim, Kwang Yong Kang, Mun Cheol Paek, Sang Kuk Choi, Min Hwan Kwak, Han Cheol Ryu
  • Publication number: 20090315724
    Abstract: Provided are an abrupt MIT device with variable MIT temperature or voltage, an MIT sensor using the abrupt MIT device, and an alarm apparatus and a secondary battery anti-explosion circuit including the MIT sensor The MIT device includes an abrupt MIT layer undergoing an abrupt MIT at a transition temperature or a transition voltage and at least two electrode layers contacting the abrupt MIT layer. The transition temperature or the transition voltage varies with at least one of factors including a voltage applied to the electrode layers, a temperature, an electromagnetic wave, a pressure, and a gas concentration that affect the abrupt MIT layer. The MIT sensor is a temperature sensor, an infrared sensor, an image sensor, a pressure sensor, a gas-concentration sensor, or a switch. The alarm apparatus includes the MIT sensor and an alarm-signaling unit connected in series with the MIT sensor.
    Type: Application
    Filed: May 30, 2007
    Publication date: December 24, 2009
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun-Tak Kim, Bong-Jun Kim, Byung-Gyu Chae, Sun-Jin Yun, Sung-Youl Choi, Yong-Wook Lee, JungWook Lim, Sang-Kuk Choi, Kwang-Yong Kang
  • Patent number: 7598594
    Abstract: Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: October 6, 2009
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Sunmoon University
    Inventors: Jin Woo Jeong, Dae Jun Kim, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
  • Publication number: 20090152699
    Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.
    Type: Application
    Filed: July 21, 2008
    Publication date: June 18, 2009
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk CHOI, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak
  • Publication number: 20080297358
    Abstract: Provided are a temperature sensor using a metal-insulator transition (MIT) device subject to abrupt MIT at a specific temperature and an alarm including the temperature sensor. The abrupt MIT device includes an abrupt MIT thin film and at least two electrode thin films that contacts the abrupt MIT thin film. The abrupt MIT device generates abrupt metal-insulator transition at a specific transition temperature. The alarm includes a temperature sensor comprising an abrupt MIT device, and an alarm signaling device serially connected to the temperature sensor. Accordingly, the alarm can be manufactured to have a simple circuit and be of a small size by including the temperature sensor using an abrupt MIT device.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 4, 2008
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun-Tak Kim, Kwang Yong Kang, Yong Wook Lee, Byung Gyu Chae, Bong Jun Kim, Sang Kuk Choi, Sun Jin Yun
  • Patent number: 7394071
    Abstract: A micro column electron beam apparatus having a reduced number of interconnections is provided. The micro column electron beam apparatus includes: a low temperature co-fired ceramic (LTCC) substrate; a plurality of deflector electrodes attached to a predetermined top portion of the LTCC substrate; a pad electrode placed at a top edge of the LTCC substrate and transmitting an external signal to the deflector electrodes; and a connection unit placed in the LTCC substrate and electrically connecting the deflector electrode and the pad electrode.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: July 1, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Dae Jun Kim, Jin Woo Jeong, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
  • Patent number: 7375351
    Abstract: Provided is a micro-column electron beam apparatus including: a base; an electron lens bracket on which an electron lens module can be fixed, mounted in a central portion of the base; an electron beam source tip module vertically disposed on the electron lens module; a pan spring plate stage module that is mounted over the base, supports the electron beam source tip module at a central portion thereof, and includes a three-coupling pan spring plate portion including first through third spring units that are coupled to the electron beam source tip module in three directions on a plane perpendicular to the vertical axis, which vertically passes the center of the electron beam source tip module, to elastically support the electron beam source tip module in three directions; a first piezoelectric actuator coupled to the pan spring plate stage module to move the electron beam source tip module along a first axis perpendicular to the vertical axis; and a second piezoelectric actuator coupled to the pan spring plate
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: May 20, 2008
    Assignee: Electronics and Telecommunications Research Instutute
    Inventors: Sang Kuk Choi, Dae Jun Kim, Jin Woo Jeong, Dae Yong Kim
  • Patent number: 7307260
    Abstract: Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: December 11, 2007
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Dae Yong Kim
  • Patent number: 7230251
    Abstract: Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: June 12, 2007
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Dae Yong Kim