Abstract: A semiconductor package includes: a package board; a first semiconductor chip disposed on the package board, and having a first recess portion adjacent to a first front surface of the first semiconductor chip facing the package board; a second semiconductor chip disposed side by side with the first semiconductor chip on the package board, and having a second recess portion adjacent to a second front surface of the second semiconductor chip facing the package board; and an interconnect bridge disposed on the first and second front surfaces, and at least partially disposed in each of the first and second recess portions.

Abstract: Disclosed is a portable communication device including a housing; a first PCB; a wireless communication circuitry disposed on the first PCB; and a second PCB having a plurality of layers including a first PCB portion; a second PCB portion extended from the first PCB portion and more flexible than the first PCB portion; a third PCB portion extended from the second PCB portion and less flexible than the second PCB portion; a fourth PCB portion extended from the third PCB portion and more flexible than the third PCB portion; and a plurality of lines formed at a same layer of the plurality of layers as extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line, and a first signal line between the first and second ground lines.

Abstract: The present disclosure relates to a polyurethane logo label manufacturing method that includes: a first step of preparing a polyurethane image film printed with a logo; a second step of preparing a wing film laminated by combining a polyurethane film and a PET film; a third step of forming an injection hole for injection into a log groove of the wing film; a fourth step of film molding option of preparing a mold composed of a top plate, a mid-plate, and a bottom plate; and a fifth step of injection molding of injecting polyurethane resin into the logo groove through the injection inlet of the top plate of the fourth step.

Abstract: An embodiment apparatus for detecting a material of a vehicle body part includes a light source configured to emit an emission light toward the vehicle body part, an optical sensor configured to detect a reflection light generated by reflection of the emission light at the vehicle body part and to generate a detection current according to an intensity of the reflection light, a case enclosing the light source and the optical sensor, and a control circuit configured to convert the detection current to a detection voltage, to determine a material of the vehicle body part as a first material in response to the detection voltage being greater than or equal to a reference voltage, and to determine the material of the vehicle body part as a second material in response to the detection voltage being less than the reference voltage.

Abstract: A shared vehicle dispatch system dispatches shared vehicles based on driver grades classified by learning user driving patterns, and a shared vehicle dispatch method uses the shared vehicle dispatch system. The shared vehicle dispatch system includes a shared vehicle having a vehicle controller configured to learn driving pattern information of a user, a user terminal, operated by the user, equipped with a dedicated application installed for requesting the dispatch of the shared vehicle, and an operation server communicating with the shared vehicle to receive the learned driving pattern information, where the operation server may determine a driver grade for the user who operated the shared vehicle based on the received driving pattern information.

Abstract: A capacitor component includes a substrate having first and second surfaces opposing each other, a first interlayer disposed on the first surface of the substrate, the first interlayer including a first trench, a first trench capacitor disposed in the first trench, a second interlayer disposed on the second surface of the substrate, the second interlayer including a second trench, a second trench capacitor disposed in the second trench, and a through-via passing through the substrate to connect the first trench capacitor and the second trench capacitor to each other.

Abstract: A circuit board includes a first glass layer, a first wiring layer embedded in an upper portion of the first glass layer, and a second wiring layer embedded in a lower portion of the first glass layer. At least one of the first and second wiring layers includes a plurality of embedded patterns having different thicknesses.

Abstract: A circuit board includes a first glass layer, a first wiring layer and a second wiring layer embedded in upper and lower portions of the first glass layer, respectively, a first via layer penetrating through the first glass layer and connected to the first and second wiring layers, a second glass layer disposed on an upper surface of the first glass layer, a third wiring layer embedded in an upper portion of the second glass layer, and a second via layer penetrating through the second glass layer and connected to the first and third wiring layers.

Abstract: A printed circuit board includes a substrate portion including a first insulating layer, a first wiring layer disposed on or within the first insulating layer, and a cavity penetrating through at least a portion of the first insulating layer; a connection structure disposed within the cavity of the substrate portion, and including a second insulating layer, a second wiring layer disposed on or within the second insulating layer, and a metal layer disposed on a lower surface and a side surface of the second insulating layer, wherein the metal layer is disposed on an outermost side of the connection structure.

Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.

Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

Abstract: A package structure includes a first package including a first substrate and a first molded portion disposed on the first substrate; and a rigid-flexible substrate disposed on at least a portion of the first package and having a rigid region and a flexible region. The first molded portion is disposed between the first substrate and the rigid-flexible substrate.

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

Abstract: A package structure includes a first package including a first substrate and a first molded portion disposed on the first substrate; and a rigid-flexible substrate disposed on at least a portion of the first package and having a rigid region and a flexible region. The first molded portion is disposed between the first substrate and the rigid-flexible substrate.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.