Abstract: A circuit board includes a first glass layer, a first wiring layer and a second wiring layer embedded in upper and lower portions of the first glass layer, respectively, a first via layer penetrating through the first glass layer and connected to the first and second wiring layers, a second glass layer disposed on an upper surface of the first glass layer, a third wiring layer embedded in an upper portion of the second glass layer, and a second via layer penetrating through the second glass layer and connected to the first and third wiring layers.

Abstract: A printed circuit board includes a substrate portion including a first insulating layer, a first wiring layer disposed on or within the first insulating layer, and a cavity penetrating through at least a portion of the first insulating layer; a connection structure disposed within the cavity of the substrate portion, and including a second insulating layer, a second wiring layer disposed on or within the second insulating layer, and a metal layer disposed on a lower surface and a side surface of the second insulating layer, wherein the metal layer is disposed on an outermost side of the connection structure.

Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.

Abstract: A photoelectric conversion device according to some example embodiments includes an upper electrode, a lower electrode, and an active layer including a donor material, an acceptor material, and a light-absorbing material and disposed between the upper electrode and the lower electrode, wherein the donor material includes a compound represented by Formula 1, and the light-absorbing material includes bis-(4-dimethylaminodithiobenzyl)-Ni(II) (BDN).

Abstract: Disclosed is an image sensor which includes a substrate including an active region that includes a plurality of photoelectric conversion pixels and a peripheral region that extends around the active region, a transparent window on the substrate, a wall structure that is on the peripheral region along a periphery of the substrate and seals a space between the substrate and the transparent window, a planarization insulting layer on the active region and a portion of the peripheral region of the substrate, and a plurality of lens patterns on the planarization insulating layer. The planarization insulting layer includes first to third lens regions, and the lens patterns have different shapes and/or are arranged at different intervals on the first to third lens regions.

Abstract: Provided is a positive electrode active material comprising at least one secondary particle comprising an agglomerate of a primary macro particle, a method for preparing the same and a lithium secondary battery comprising the same. By the simultaneous use of the secondary particle comprising a primary macro particle and a monolith, it is possible to provide a nickel-based positive electrode active material with reduced particle cracking in the positive electrode active material during a rolling process and improved charge/discharge cycling characteristics.

Abstract: The present disclosure provides mimic molecules that are capable of specifically targeting a FAM19A5 protein, and thereby, inhibiting, reducing, and/or dissociating the interaction between members of the LRRC4 protein family and the FAM19A5 protein. The present disclosure also provides methods for promoting neurite outgrowth, by administering a mimic molecule described herein.

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.

Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

Abstract: A package structure includes a first package including a first substrate and a first molded portion disposed on the first substrate; and a rigid-flexible substrate disposed on at least a portion of the first package and having a rigid region and a flexible region. The first molded portion is disposed between the first substrate and the rigid-flexible substrate.

Abstract: A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

Abstract: A package structure includes a first package including a first substrate and a first molded portion disposed on the first substrate; and a rigid-flexible substrate disposed on at least a portion of the first package and having a rigid region and a flexible region. The first molded portion is disposed between the first substrate and the rigid-flexible substrate.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.

Abstract: The method for inducing sleep by a sleep inducing system includes acquiring brain signals of a user as sleeping time passes; calculating a functional connectivity value between two channels for each frequency based on the acquired brain signals and performing brain network analysis; determining the stage of sleep of the user based on features of the analyzed brain network; determining a target frequency according to the determined stage of sleep and generating a binaural beat with which the brain signals of the user are induced to the target frequency; combining the generated binaural beat with ASMR information; providing the combined auditory stimulus information to the user; and determining whether the current stage of sleep of the user is maintained at an appropriate proportion with respect to total sleep time, determining whether or not to induce the next stage of sleep, and performing feedback according to the result of determination.

Abstract: An exemplary embodiment of the present disclosure provides a method of recognizing, by a controller, an intention of a user who wears a head mounted display to which electroencephalogram electrodes are attached.