Abstract: Provided is a soldering apparatus for a printed circuit board (PCB) for soldering the PCB and one or more electronic components populated on the PCB, the PCB having an upper side and a bottom side that is opposite the upper side, including a PCB INVERTING UNIT for rotatably supporting the PCB; a soldering cream PRINTING UNIT for printing on the lower side of the PCB a soldering cream substantially on a plurality of lead holes formed in the PCB in an inverted state, wherein in the inverted state a position of the PCB is inverted by the PCB INVERTING UNIT such that the lower side of the PCB faces in an upward direction; and a hardener for hardening the printed soldering cream while the one or more electronic components are inserted into the lead holes in a reverted state, wherein in the reverted state a position of the PCB is reverted by the PCB inverter such that the upper side of the PCB faces in a upward direction.