Abstract: A solder ball attachment apparatus including an open ball box configured to accommodate a plurality of solder balls, the open ball box including, a pocket portion at a bottom thereof, the pocket portion configured to accommodate the solder balls, and an inclined portion extending from the pocket portion toward an outer surface of the open ball box, a solder ball attachment tool configured to apply suction pressure to a lower surface thereof, the lower surface configured to face the open ball box, the lower surface configured to adsorb the solder balls accommodated in the ball box by moving between a first position and a second position, the first position being a standby position, the second position being a position for adsorbing the solder balls, and a vibration member connected to the open ball box may be provided.