Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Abstract: Substrate test probing equipment having a force-receiving pattern for a probe card and a forcing part for a test head, and methods of using the same, in which with the force-receiving pattern for the probe card and the forcing part for the test head, thermal expansion and contraction of the probe card can be suppressed when the semiconductor substrate is being tested at high and low temperatures. To this end, to substrate test probing equipment having a substrate mover, a probe card, and a test head is prepared, in which the test head has a forcing part and the probe card has a force-receiving plate. A semiconductor substrate is placed on the substrate mover to be electrically connected with the probe card. The semiconductor substrate is electrically tested by the probe card and the test head. When the semiconductor substrate is being tested, the forcing part of the test head is brought into contact with the force-receiving pattern of the probe card.

Abstract: A probe card, an apparatus and a method of inspecting an object. In the example method, a first inspection current may be divided into a plurality of first divided inspection currents. Each of the first divided inspection currents may be supplied to a different one of a plurality of first chips. A second inspection current may be selectively applied to a second chip other than the first plurality of chips. In an example, the second inspection current may be substantially equal to at least one of the plurality of first divided inspection currents. In a further example, the example probe card and/or the apparatus may perform the example method.

Abstract: Substrate test probing equipment having a force-receiving pattern for a probe card and a forcing part for a test head, and methods of using the same, in which with the force-receiving pattern for the probe card and the forcing part for the test head, thermal expansion and contraction of the probe card can be suppressed when the semiconductor substrate is being tested at high and low temperatures. To this end, to substrate test probing equipment having a substrate mover, a probe card, and a test head is prepared, in which the test head has a forcing part and the probe card has a force-receiving plate. A semiconductor substrate is placed on the substrate mover to be electrically connected with the probe card. The semiconductor substrate is electrically tested by the probe card and the test head. When the semiconductor substrate is being tested, the forcing part of the test head is brought into contact with the force-receiving pattern of the probe card.

Abstract: A probe card, an apparatus and a method of inspecting an object. In the example method, a first inspection current may be divided into a plurality of first divided inspection currents. Each of the first divided inspection currents may be supplied to a different one of a plurality of first chips. A second inspection current may be selectively applied to a second chip other than the first plurality of chips. In an example, the second inspection current may be substantially equal to at least one of the plurality of first divided inspection currents. In a further example, the example probe card and/or the apparatus may perform the example method.

Abstract: A donut-type parallel probe card comprises a main substrate and a plurality of probing blocks installed on a surface of the main substrate, wherein each probe block comprises a plurality of probes. The probing blocks are arranged to fill a first region having an oval shape and surrounding a second region, and no probing blocks are arranged within the second region.

Abstract: A probe card for that may be used to test a plurality of semiconductor chips formed on a wafer. The probe card may include a substrate; a plurality of probe blocks that form a pattern corresponding to the pattern formed by the plurality of semiconductor chips formed on the wafer; and a plurality of probe needles formed in the probe blocks and arranged in a pattern corresponding to a plurality of pads formed in the plurality of semiconductor chips. The use of the probe card may decrease the testing time for the wafer.