Abstract: A machine behavior classification system may include an electronic data collection system and an electronic data analysis system. The electronic data collection system may have an image capture apparatus that is configured to monitor a machine and the image capture apparatus may produce an image data file of the machine. Moreover, the electronic data analysis system may receive the image data file and may perform a data analysis of the image data file.

Abstract: Disclosed are an adsorption type cooling apparatus using nanoporous aluminophosphate as a water vapor adsorbent, and an operation method thereof. Specifically, the adsorption type cooling apparatus uses nanoporous aluminophosphate exhibiting a high dynamic water vapor adsorption capacity as a water vapor adsorbent. The adsorption type cooling apparatus includes at least two adsorption towers containing a water vapor adsorbent, a condenser alternately connected to the adsorption towers, and an evaporator alternately connected to the adsorption towers, wherein the water vapor adsorbent is nanoporous aluminophosphate containing aluminum, phosphorous, and oxygen.

Abstract: A machine behavior classification system may include an electronic data collection system and an electronic data analysis system. The electronic data collection system may have an image capture apparatus that is configured to monitor a machine and the image capture apparatus may produce an image data file of the machine. Moreover, the electronic data analysis system may include a data analytics module that is configured to receive the image data file and the data analytics module may perform a data analysis of the image data file.

Abstract: Aspects of the present invention dynamically reduce a frequency at which IT infrastructure automatically generates alerts. Historical data across a plurality of data sources in the IT infrastructure is analyzed. An opportunity to reduce the frequency at which the IT infrastructure automatically generates the alerts is identified. A new alert policy addressing the opportunity to reduce alert frequency is generated. An impact of the new alert policy on a set of predefined service level objectives (SLOs) and service level agreements (SLAs) is evaluated. The new alert policy is deployed in the IT infrastructure.

Abstract: Aspects of the present invention dynamically reduce a frequency at which IT infrastructure automatically generates alerts. Historical data across a plurality of data sources in the IT infrastructure is analyzed. An opportunity to reduce the frequency at which the IT infrastructure automatically generates the alerts is identified. A new alert policy addressing the opportunity to reduce alert frequency is generated. An impact of the new alert policy on a set of predefined service level objectives (SLOs) and service level agreements (SLAs) is evaluated. The new alert policy is deployed in the IT infrastructure.

Abstract: Optimum compositional elements and contents (wt %) of an aluminum alloy conductor cable are newly established to enhance rigidity against vibration and electrical conductivity of the aluminum alloy conductor cable. Further, a process for the aluminum alloy conductor cable is presented to provide an aluminum alloy conductor cable having satisfactory tensile strength (mechanical strength) and electrical conductivity.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.

Abstract: A surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards is provided. The method includes nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon, and coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for printed circuit boards, comprises a barrier layer formed of ternary alloy of Zn—Co—As on the copper foil. According to another aspect of the invention a surface treatment method of an electrodeposited copper foil for printed circuit boards is performed comprises the steps of electrolytically treating the copper foil in the electrolytic solution containing pyrophosphoric acid potassium of 10˜200 g/l, Zn of 0.1˜20 g/l, Co of 0.1˜20 g/l and As of 0.05˜5 g/l. Further, the electrolytic solution remains at the temperature of 20˜50° C. and pH=9˜13, and the copper foil is electrolytically treated for 2˜20 seconds at the cathode current density of 0.5˜20 A/dm2.

Abstract: Disclosed is a surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards, which includes the steps of nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon and then coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.