Abstract: A method of providing a game service including providing a game program including a game module and a simulation module, the simulation module having same input and output functions as those of the game module, receiving, from a user terminal, a play result including output information of the game module with respect to input information and output information of the simulation module with respect to the input information, and determining whether play is fair based on the output information of the game module and the output information of the simulation module may be provided.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: Disclosed herein is a compact connector for transmitting super-high-frequency signals, which is adapted to connect a printed circuit board (PCB) to a single or multiple high-frequency signal lines transmitting super-high frequency signals therethrough. The compact connector includes: a male connector connected to the single or multiple super-high frequency signal lines and comprising a male connector housing receiving, securing, and protecting terminals of the single or multiple super-high frequency signal lines; and a connector socket mounted on the PCB and receiving the male connector housing fastened to the male connector, wherein the super high-frequency signal line terminals in the male connector are brought into direct contact with and connected to signal line terminal pads formed on the printed circuit board, respectively.

Abstract: Disclosed is a compact coaxial cable connector for transmitting super-high frequency signals, which is adapted to connect a PCB to a single or multiple super-high frequency coaxial cable signal lines transmitting super-high frequency signals therethrough. The compact coaxial cable connector includes: a single or multiple coaxial cables each including an inner conductor, an outer conductor, a dielectric, and a sheath, wherein the outer conductor, the dielectric, and the sheath are stripped to expose the inner conductor over a predetermined length and a terminal of the exposed inner conductor is brought into electrical contact with a circuit signal line terminal pad formed on the PCB; and a male connector including a shielding can receiving the exposed inner conductors of the single or multiple coaxial cables, securing and protecting ends of the exposed inner conductors, and blocking electromagnetic waves generated from the inner conductors of the single or multiple coaxial cables.

Abstract: The present application relates to an optical isolation element comprising a first optical path changing element, a second optical path changing element and a third optical path changing element, each of those comprises a light entrance surface and a light exit surface. The optical isolation element has an excellent optical isolation ratio, may not require separate external force when driven, and can be applied to various applications such as the field of optical communication or laser optics, the field of security or privacy protection, brightness enhancement of displays, or a use for hiding and covering.

Abstract: The present application relates to an optical isolation element which sequentially comprises a first optical path changing element, a light control film and a second optical path changing element. The optical isolation element has excellent forward transmittance, which may require no separate external force. The optical isolation element can be applied to various applications such as the field of optical communication or laser optics, the field of security or privacy protection, brightness enhancement of displays, or military hiding and covering.

Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.

Abstract: According to various embodiments of the present invention, a stylus pen can comprise: a pen body extended along an axial line; a touch tip provided on one end portion of the pen body; a cap arranged on the other end portion of the pen body; a first structure for changing the length of the stylus pen by moving the cap along the axial line; and a second structure coming in contact with at least a part of the first structure, and restricting the movement of the cap and/or the first structure.

Abstract: A crystal oscillator including a feedback circuit, and a reference clock generating circuit including the crystal oscillator. The crystal oscillator is configured to generate an oscillating signal based on a natural frequency of a crystal. The crystal oscillator may include: a current generating circuit connected to a first node having a first voltage and a second node having a second voltage, and configured to output a first current to the second node; a feedback circuit connected to the generating circuit via the first and second nodes and configured to adjust a level of the second voltage by controlling a level of the first voltage; and a crystal circuit connected to the second node and configured to generate the oscillating signal based on the second voltage.

Abstract: A close cut-in vehicle identification apparatus includes an information generator configured to generate sensor fusion information, estimated vehicle state information, and risk determination information based on surrounding vehicle information upon receiving the surrounding vehicle information, a feature combination generator configured to extract a plurality of features based on the sensor fusion information, the estimated vehicle state information, and the risk determination information and to combine the extracted features to generate a plurality of feature combinations, a classification learner configured to classify and learn the plurality of feature combinations depending on a weight factor, and a vehicle intention determination device configured to determine intention of a surrounding vehicle based on a classification learning result value to select an optimum feature combination corresponding to identification of the close cut-in vehicle and configured to determine a situation of the close cut-in veh

Abstract: A semiconductor device includes a first insulating interlayer on a first region of a substrate and a second insulating interlayer on a second region of the substrate, a plurality of first wiring structures on the first insulating interlayer, the first wiring structures being spaced apart from each other, a plurality of second wiring structures filling a plurality of trenches on the second insulating interlayer, respectively, an insulation capping structure selectively on a surface of the first insulating interlayer between the first wiring structures and on a sidewall and an upper surface of each of the first wiring structures, the insulation capping structure including an insulating material, a third insulating interlayer on the first and second wiring structures, and an air gap among the first wiring structures under the third insulating interlayer.

Abstract: According to an embodiment a wireless power transmitting device, includes a power transmission antenna including patch antennas to wirelessly transmit power, and communication antennas configured to receive a communication signal from an electronic device. The wireless power transmitting device also includes a processor configured to detect a direction in which the electronic device is positioned based on the communication signal received through the communication antennas and control the power transmission antenna to transmit the power in the detected direction.

Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.

Abstract: An image acquisition apparatus including a beam source, a beam expander, a beam splitter, an interferometer reference arm, a sample, a beam diffuser, a telecentric f-? lens, a beam scanner, and a beam detector uses a terahertz wave to acquire a surface image and a depth image of the sample.

Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

Abstract: The present invention relates to a Doherty combiner used in a Doherty power amplifier, the Doherty combiner comprising: a phase shift section connected to one end of a carrier amplifier so as to change a phase of an RF signal output from the carrier amplifier; a matching section connected to an output terminal of the Doherty power amplifier so as to impedance-match an output of the Doherty power amplifier; and a bandwidth improvement section connected to one end of a peaking amplifier so as to change at least one of a phase bandwidth and an amplitude bandwidth of the Doherty power amplifier.

Abstract: An electronic device includes: a switching regulator configured to generate a conversion voltage with respect to an input voltage, based on a switching signal of a first frequency, and output the conversion voltage; a stabilization circuit including a capacitor element connected to a load device via a first node and configured to generate a load voltage by stabilizing the conversion voltage by using the capacitor element and output the load voltage to the load device; a frequency sensing circuit configured to sense a frequency of the load voltage and output sensing information about the frequency of the load voltage; and a frequency booster circuit configured to form a first current path connected to the first node, based on the sensing information.

Abstract: Disclosed are an occupancy distance map (ODM) information reliability determination system and method and a vehicle using the same. The system includes a signal conversion unit configured to receive a plurality of sensing signals and to perform signal processing, a calculation unit configured to calculate state information of a nearby vehicle detected from processed signals, a sensor fusion track output unit configured to output sensor fusion track information based on the calculated state information of the nearby vehicle, an ODM output unit configured to output ODM information based on the calculated state information of the nearby vehicle, an ODM fusion unit configured to generate sensor fusion ODM information by performing sensor fusion with respect to the ODM information, and an ODM information reliability determination unit configured to determine reliability of the sensor fusion ODM information by confirming association between the sensor fusion track information and the sensor fusion ODM information.

Abstract: A suspension system for a vehicle may include a knuckle configured of rotatably supporting a wheel, and a lower control arm mounted along a vehicle's width direction and connecting the knuckle and a vehicle body, wherein the lower control arm may include a wheel-side end portion connected to a lower portion of the knuckle through a lower external joint, a vehicle body-side front end portion connected to the vehicle body through a front lower inner joint, and a vehicle body-side rear end portion connected to the vehicle body through a rear lower inner joint, wherein one of the vehicle body-side front and rear end portions is connected to a portion of the vehicle body through a compliance control arm.