Patents by Inventor Sang-Myung Lee

Sang-Myung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10435587
    Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: October 8, 2019
    Assignees: Samsung Electronics Co., Ltd., K.C. Tech Co., Ltd.
    Inventors: Seung-Ho Park, Ki-Hwa Jung, Sang-Kyun Kim, Jun-Ha Hwang, Chang-Gil Kwon, Seung-Yeop Baek, Jae-Woo Lee, Ji-Sung Lee, Jae-Kwang Choi, Jin-Myung Hwang
  • Patent number: 10428242
    Abstract: A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: October 1, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., K.C. TECH Co., Ltd.
    Inventors: Doo-sik Moon, Sang-hyun Park, Bo-un Yoon, Ho-young Kim, Se-jung Park, Jae-hak Lee, Jin-myung Hwang
  • Patent number: 10408680
    Abstract: Provided is an apparatus for optical emission spectroscopy. The apparatus for the optical emission spectroscopy includes a light collection unit configured to collect light within a plasma process chamber in which plasma is generated to process a substrate, a light transmission unit configured to transmit the collected light, and an analysis unit configured to analyze the light provided through the light transmission unit, thereby analyzing a plasma state. The light collection unit includes a light collection part configured to concentrate the light generated in the plasma process chamber and provide the concentrated light to the light transmission unit.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: September 10, 2019
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Ilgu Yun, Sang Myung Lee
  • Patent number: 10316831
    Abstract: Disclosed herein is a valve assembly for a variable swash plate compressor. Since an opening hole of a suction reed is enlarged toward a suction port of a valve plate and refrigerant is also introduced into a cylinder bore through the opening hole when the suction port is opened, performance of a compressor may be enhanced by an increase in flow rate.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: June 11, 2019
    Assignee: HANON SYSTEMS
    Inventors: Sang Woo Bae, Eun Gi Son, Je Su Yun, Se Young Song, Young Seop Yoon, Sung Myung Lee, Hew Nam Ahn, Seung Taek Lim
  • Patent number: 10015885
    Abstract: Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: July 3, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Won Suk Jung, Yun Ho An, Sang Myung Lee, Joon Wook Han
  • Patent number: 9907164
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: February 27, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
  • Patent number: 9888569
    Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: February 6, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
  • Patent number: 9661759
    Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: May 23, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Su Kim, Ki Do Chun, Kyu Won Lee, Sang Myung Lee
  • Patent number: 9642246
    Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 2, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myoung Hwa Nam, Byeong Ho Kim, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Sang Myung Lee
  • Patent number: 9585258
    Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: February 28, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yeong Uk Seo, Ki Do Chun, Chang Woo Yoo, Hyun Seok Seo, Byeong Ho Kim, Sang Myung Lee
  • Patent number: 9572250
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: February 14, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
  • Patent number: 9549465
    Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: January 17, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Woo Yoo, Yeong Uk Seo, Byeong Ho Kim, Hyun Seok Seo, Sang Myung Lee, Ki Do Chun
  • Patent number: 9532462
    Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: December 27, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yeong Uk Seo, Sung Woon Yoon, Jin Su Kim, Myoung Hwa Nam, Sang Myung Lee, Chi Hee Ahn
  • Patent number: 9497853
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: November 15, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
  • Patent number: 9491866
    Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: November 8, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jin Su Kim, Myoung Hwa Nam, Yeong Uk Seo, Sung Woon Yoon
  • Patent number: 9433107
    Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: August 30, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hyun Seok Seo, Ki Do Chun, Sang Myung Lee, Yeong Uk Seo, Chang Woo Yoo, Byeong Ho Kim
  • Publication number: 20160216155
    Abstract: Provided is an apparatus for optical emission spectroscopy. The apparatus for the optical emission spectroscopy includes a light collection unit configured to collect light within a plasma process chamber in which plasma is generated to process a substrate, a light transmission unit configured to transmit the collected light, and an analysis unit configured to analyze the light provided through the light transmission unit, thereby analyzing a plasma state. The light collection unit includes a light collection part configured to concentrate the light generated in the plasma process chamber and provide the concentrated light to the light transmission unit.
    Type: Application
    Filed: January 28, 2016
    Publication date: July 28, 2016
    Inventors: Ilgu YUN, Sang Myung LEE
  • Patent number: 9265161
    Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: February 16, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chi Hee Ahn, Sang Myung Lee, Yeong Uk Seo, Jin Su Kim, Sung Woon Yoon, Myoung Hwa Nam
  • Publication number: 20150334843
    Abstract: Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.
    Type: Application
    Filed: December 20, 2013
    Publication date: November 19, 2015
    Inventors: Won Suk JUNG, Yun Ho AN, Sang Myung LEE, Joon Wook HAN
  • Publication number: 20150296624
    Abstract: A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.
    Type: Application
    Filed: May 9, 2013
    Publication date: October 15, 2015
    Inventors: Yun Ho An, Won Suk Jung, Ran Kim, Sung Soo Park, Young Joon Son, Sang Myung Lee, Woo Young Lee, Joon Wook Han