Abstract: A device for adjusting a position of a vehicle seat has a structure in which two or more adjustment devices, such as lead screws for adjusting tilting, are connected to the opposite side portions of a seat cushion frame to allow the lead screws to rotate by two gearboxes connected to one motor, so that a seat cushion is stably tilted by the two or more lead screws and the opposite side portions of the seat cushion frame is stably supported by the two or more lead screws, in order to prevent shaking, vibration, and torsional deformation caused by a gap generated when tilting the seat cushion frame.

Abstract: A vehicle seat position adjustment device is configured to stably perform a tilting operation of a seat cushion by performing an operation of rotating a first tilting link hinged to a gear box in a standing direction of a first tilting link while the gear box is moved rearwards along a lead screw, an operation of pushing up a second tilting link hinged to the first tilting link while the first tilting link is rotated in a standing direction, and an operation of allowing the second tilting link to push up a front end of a seat cushion frame. The vehicle seat position adjustment device may achieve a relaxation comfort posture by tilting the seat cushion and simultaneously reclining a seatback connected to the seat cushion rearwards.

Abstract: The present invention relates to a lithium compound, a nickel-based cathode active material, a method for preparing lithium oxide, a method for preparing a nickel-based cathode active material, and a secondary battery using same. The lithium compound includes primary particles of Li2O having an average particle diameter (D50) of less than or equal to 5 ?m; and secondary particles composed of the primary particles.

Abstract: A shoe management apparatus includes a first management apparatus, including a first inner space and an electric compartment disposed below the first inner space for dehumidifying air introduced into the electric compartment, and removing foreign matter from the shoes stored in the first inner space; and a second management apparatus disposed above the first management apparatus, including a second inner space for storing a shoe, and for adjusting humidity of the second inner space using air discharged from the electric compartment.

Abstract: A shoe management apparatus includes a receiving portion defining a receiving space for receiving a shoe therein, a first supply portion including a duct for guiding flow of a fluid, and a second supply portion connected to the first supply portion, extending in a longitudinal direction of the first supply portion and angled towards the receiving portion, the second supply portion receiving the fluid from the first supply portion and directing the fluid to the shoe.

Abstract: A shoe management apparatus including a receiving portion defining a receiving space for receiving a shoe therein, a first supply portion for guiding a fluid flow and extending towards the receiving space, and a second supply portion at least partially disposed inside the first supply portion and protruding in a longitudinal direction of the first supply portion to supply a fluid into the shoe.

Abstract: A shoe management apparatus including a receiving portion defining a receiving space for receiving shoes therein, a first supply portion for guiding flow of a fluid towards the receiving portion, the first supply portion including a stationary duct disposed above the receiving space, a flexible duct connected to the stationary duct and able to rotate to change shape, a rotatable duct connected to the flexible duct and a first driver connected to the rotatable duct and for generating a rotational force to rotate the rotatable duct.

Abstract: A shoe treating apparatus includes an upper cabinet, a lower cabinet disposed below the upper cabinet, an electronic component part disposed below the lower cabinet, a sensor part, and a processor electrically connected to the electronic component part and the sensor part. The processor may identify at least one of a material, a type, and a condition of at least one shoe in the upper cabinet, and based on the identification, perform normal treatment on the at least one shoe in the upper cabinet through the electronic component part. The processor may identify at least one of a material, a type, and a condition of at least one shoe in the lower cabinet, and based on the identification, perform intensive treatment on the at least one shoe in the lower cabinet through the electronic component part. A method of operating the shoe treating apparatus is also provided.

Abstract: A circuit board according to an embodiment includes an insulating layer including a cavity; and a metal layer disposed on an inner wall of the cavity of the insulating layer, wherein at least one recess concave toward the inside of the insulating layer is formed on an inner wall of the cavity, wherein the metal layer includes: a first metal layer disposed on the inner wall of the cavity while filling the recess; and a second metal layer disposed on the first metal layer and disposed on the inner wall of the cavity.

Abstract: A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of second cavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed in the plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneath the first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.

Abstract: A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of second cavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed in the plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneath the first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.

Abstract: Provided is an apparatus for optical emission spectroscopy. The apparatus for the optical emission spectroscopy includes a light collection unit configured to collect light within a plasma process chamber in which plasma is generated to process a substrate, a light transmission unit configured to transmit the collected light, and an analysis unit configured to analyze the light provided through the light transmission unit, thereby analyzing a plasma state. The light collection unit includes a light collection part configured to concentrate the light generated in the plasma process chamber and provide the concentrated light to the light transmission unit.

Abstract: Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed.

Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.

Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.