Abstract: Disclosed herein is a method and apparatus for providing traffic information of public transportation means, such as a bus, and utilizing the provided information. A method of encoding public traffic information according to the present invention creates, for an arbitrary bus stop, a first component including the number of buses to arrive at the bus stop and as many pieces of bus information as the created number of buses, and incorporates the first component along with an identifier allocated to the bus stop into a second component. The second component is then incorporated into a transfer message. A sequence of messages, each being constructed as described above, is wirelessly transmitted.

Abstract: A method of using additional information at a DMB (Digital Multimedia Broadcasting) receiver is provided. The method includes the steps of: extracting and displaying additional information from a DMB signal; selecting and storing a desired one of the displayed additional information; displaying a list of the stored additional information depending on a user's request command; and outputting additional information selected at the list of the additional information.

Abstract: The present invention relates to a method of providing and utilizing information for vehicle travel, such as information about traffic flow on roads, and about parking lots. In an encoding method according to the present invention, at least one component including information for vehicle travel is generated. Information about a time point is included in the generated component. The information about the time point includes a selector, having a bit element indicating whether to use the present date and time and indicating the type of loaded information, and at least one of information elements indicating a year, month, day, hour, minute, and second, depending on the value of the selector.

Abstract: A digital broadcasting system and a data processing method are disclosed. The receiving system of the digital broadcasting system includes a receiving unit, a main service data processor, a mobile service data processor, a controller, and an output controller. The receiving unit receives mobile service data and main service data including the same A/V broadcast signal and receives retransmission channel information. The main service data processor demodulates and error-corrects the received main service data and temporarily stores the processed data. The mobile service data processor demodulates and error-corrects the received mobile service data and temporarily stores the processed data. The controller generates and outputs a control signal based upon the received retransmission channel information and a receiving environment of the receiving system.

Abstract: A digital broadcasting system and a data processing method are disclosed. A receiving system of the digital broadcast system includes a mobile service data processor, a main service data processor, a controller, and a display module. The mobile service data processor receives mobile service data through a mobile service data path. Herein, the mobile service data configures an RS frame, and the RS frame includes mobile service data including a mobile A/V broadcast signal and at least one channel configuration information on the mobile service data. The main service data processor receives main service data through a main service data path. Herein, the main service data includes a main A/V broadcast signal and a program guide information of the main A/V broadcast.

Abstract: Disclosed is a sub picture control apparatus and method for a TV that can achieve an effective viewing of the sub picture. The apparatus includes a region data extracting section (52) for extracting region data included in a broadcasting signal tuned by a second tuner (43), a second luminance/chrominance (Y/C) separating section (45) for separating a chrominance signal and a luminance signal from the broadcasting signal selected by the second tuner (43), a region extracting section/scaler (46) for extracting a video signal of a region corresponding to a specified region information and performing a picture size adjustment with respect to the extracted video signal, and a control section (53) for controlling a region extracting section/scaler (46) to extract the video signal corresponding to a region information extracted from the region extracting section/scaler (46) and controlling a video processing section (48) to process an output signal of the region extracting section/scaler (46).

Abstract: Disclosed is a sub picture control apparatus and method for a TV that can achieve an effective viewing of the sub picture. The apparatus includes a region data extracting section (52) for extracting region data included in a broadcasting signal tuned by a second tuner (43), a second luminance/chrominance (Y/C) separating section (45) for separating a chrominance signal and a luminance signal from the broadcasting signal selected by the second tuner (43), a region extracting section/scaler (46) for extracting a video signal of a region corresponding to a specified region information and performing a picture size adjustment with respect to the extracted video signal, and a control section (53) for controlling a region extracting section/scaler (46) to extract the video signal corresponding to a region information extracted from the region extracting section/scaler (46) and controlling a video processing section (48) to process an output signal of the region extracting section/scaler (46).

Abstract: The present invention relates to a fine tuning method for a digital television set. In an automatic fine tuning method, when a channel switching command is inputted to a microprocessor on user's demand, the microprocessor writes the PLL of a corresponding channel and then detects a segment synchronization signal. In a synchronization signal is detected, the microprocessor repeats the process of setting a flag that has acquired synchronization, storing the SNR and detecting a segment synchronization signal by moving the frequency. Then, if a synchronization signal is not detected, the microprocessor detects whether or not there is a synchronization acquired. If there is no synchronization acquired, the microprocessor repeats the above process by moving the frequency, or if there is a synchronization acquired, it tunes the frequency to the maximum value of SNRs.

Abstract: A method of manufacturing semiconductor devices is provided for forming a tungsten plug or polysilicon plug and minimizing the step-height of the intermediate insulating layer. An etching composition for this process is also provided as are semiconductor devices manufactured by this process. The method of manufacturing semiconductor devices includes the steps of forming a tungsten film having a certain thickness on an insulating layer and burying contact holes formed in the insulating layer constituting a specific semiconductor structure, and spin-etching the tungsten film using a certain etching composition such that the tungsten film is present only inside the contact holes not existing on the insulating film.

Abstract: An apparatus and method for displaying broadcast information of a television is disclosed, which easily and swiftly provides information corresponding to a video image of a presently airing broadcast television program. The apparatus and method includes a broadcast service provider transmitting broadcast signals of each broadcast program including region information (information indicating a region whereby specific information exists) and specific information for each region, and a television receiver for receiving broadcast signals transmitted from the broadcast service provider, video processing the received broadcast signals and displaying them through a screen, and displaying specific information of a corresponding region when a user selects a certain region on the screen, thus increasing the convenience of the user.

Abstract: A method of manufacturing semiconductor devices is provided, including the formation of a conductive plug and the minimizing of the step-height of an interlayer dielectric layer. An etching composition is also provided for such a manufacturing method. The method of manufacturing semiconductor devices includes the steps of forming an insulating layer over a semiconductor substrate, forming contact holes in the insulating layer, forming a conductive layer over the insulating layer to burying the contact holes, rotating the semiconductor substrate, and etching the conductive layer by supplying an etching composition on the rotating semiconductor substrate, and spin-etching the tungsten layer using an etching composition such that the conductive layer remains only inside the contact holes and does not remain over the insulating layer.

Abstract: A method of manufacturing semiconductor devices is provided, including the formation of a conductive plug and the minimizing of the step-height of an interlayer dielectric layer. An etching composition is also provided for such a manufacturing method. The method of manufacturing semiconductor devices includes the steps of forming an insulating layer over a semiconductor substrate, forming contact holes in the insulating layer, forming a conductive layer over the insulating layer to burying the contact holes, rotating the semiconductor substrate, and etching the conductive layer by supplying an etching composition on the rotating semiconductor substrate, and spin-etching the tungsten layer using an etching composition such that the conductive layer remains only inside the contact holes and does not remain over the insulating layer.

Abstract: A method for removing impurities and deposits formed in a contact hole of a semiconductor device. The method comprises the step of bathing the semiconductor device in a solution having concentrations of between about 25 to 35 weight percent of Isopropyl Alcohol (IPA), 2 to 4 weight percent of H2O2, 0.05 to 0.25 weight percent of HF, and the remaining percent of deionized water. Such bathing is preferably carried out with the solution maintained at a constant temperature of between about 20 to 25° C. for about 1 to 5 minutes.

Abstract: A method of manufacturing semiconductor devices is provided for forming a tungsten plug or polysilicon plug and minimizing the step-height of the intermediate insulating layer. An etching composition for this process is also provided as are semiconductor devices manufactured by this process. The method of manufacturing semiconductor devices includes the steps of forming a tungsten film having a certain thickness on an insulating layer and burying contact holes formed in the insulating layer constituting a specific semiconductor structure, and spin-etching the tungsten film using a certain etching composition such that the tungsten film is present only inside the contact holes not existing on the insulating film. The etching composition includes at least one oxidant selected from the group comprising H.sub.2 O.sub.2, O.sub.2, IO.sub.4.sup.-, BrO.sub.3, ClO.sub.3, S.sub.2 O.sub.8.sup.-, KlO.sub.3, H.sub.5 IO.sub.6, KOH, and HNO.sub.3, at least one enhancer selected from the group comprising HF, NH.sub.4 OH, H.

Abstract: A method for manufacturing semiconductor devices including removing a photoresist and cleaning the substrate after removing the photoresist. The method for manufacturing semiconductor devices comprises removing the photoresist remaining on a semiconductor substrate using a dry etching process. The substrate is subsequently cleaned using a cleaning composition comprising a mixture of 25 to 35 weight percent of Isopropyl Alcohol (IPA), 2.0 to 4.0 weight percent of hydrogen peroxide (H.sub.2 O.sub.2), 0.05 to 0.25 weight percent of hydrofluoric acid (HF), and the remaining weight percent of deionized water.

Abstract: Aqueous compositions for etching silicon nitride films present on wafers used in microelectronic devices comprise hydrogen fluoride and phosphate. Methods for etching silicon nitride films present in wafers to be used in microelectronic devices comprise exposing the wafers to the aqueous compositions.

Abstract: An apparatus and a method of measuring contamination particles generated during manufacturing of semiconductor devices and an analysis method therefor are described. The apparatus for measuring contamination particles has a regulator for controlling the flow of source gas, a first junction, a first filter, a first air valve, a test component, a second junction, a flow pressure reducer, a third junction, a particle counter, a second pump, a computer system, a third air valve, a flow meter, a second filter, a second air valve, a fourth junction, a third filter, an impactor, and a first pump. It is possible to analyze structures and elements of the contamination particles generated from a gas delivery system (GDS) and from at least one utility component constituting the system. Further, it is possible to set up a reference for controlling the contamination particles generated from the GDS and from at least one of the utility components.

Abstract: An aqueous cleaning composition comprises from about 0.1 to about 2 percent of hydrogen fluoride based on the volume of the composition, from about 9 to about 15 percent of hydrogen peroxide based on the volume of the composition, and from about 41 to about 47 percent of C.sub.1 to C.sub.6 alcohol based on the volume of the composition. The aqueous cleaning composition may be advantageous in that it offers increased cleaning efficiency and less corrosion in comparison to conventional cleaning solutions.

Abstract: An apparatus and a method of measuring contamination particles generated during manufacturing of semiconductor devices and an analysis method therefor are described. The apparatus for measuring contamination particles has a regulator for controlling the flow of source gas, a first junction, a first filter, a first air valve, a test component, a second junction, a flow pressure reducer, a third junction, a particle counter, a second pump, a computer system, a third air valve, a flow meter, a second filter, a second air valve, a fourth junction, a third filter, an impactor, and a first pump. It is possible to analyze structures and elements of the contamination particles generated from a gas delivery system (GDS) and from at least one utility component constituting the system. Further, it is possible to set up a reference for controlling the contamination particles generated from the GDS and from at least one of the utility components.

Abstract: A method for cleaning an integrated circuit substrate comprises cleaning the integrated circuit substrate by contacting the integrated circuit substrate with an aqueous cleaning composition. The aqueous cleaning composition comprises from about 0.1 to about 2 percent of hydrogen fluoride based on the volume of the composition, from about 9 to about 15 percent of hydrogen peroxide based on the volume of the composition, and from about 41 to about 47 percent of a C.sub.1 to C.sub.6 alcohol based on the volume of the composition.