Patents by Inventor Sang-Rok Ha

Sang-Rok Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pads including slurry and chemicals thereon and methods of fabricating the same
    Patent number: 8062102
    Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: November 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-Yong Park, Jong-Won Lee, Sang-Rok Ha, Hong-Seong Son
  • Method of chemical mechanical polishing
    Patent number: 7048612
    Abstract: A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: May 23, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Bae Lee, Sang-Rok Ha, Hyo-Jong Lee
  • Polishing pads including slurry and chemicals thereon and methods of fabricating the same
    Publication number: 20050086869
    Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
    Type: Application
    Filed: August 20, 2004
    Publication date: April 28, 2005
    Inventors: Moo-Yong Park, Jong-Won Lee, Sang-Rok Ha, Hong-Seong Son
  • Method of chemical mechanical polishing
    Publication number: 20050070091
    Abstract: A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.
    Type: Application
    Filed: August 18, 2004
    Publication date: March 31, 2005
    Inventors: Sung-Bae Lee, Sang-Rok Ha, Hyo-Jong Lee