Patents by Inventor Sang Seon Ha

Sang Seon Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method for manufacturing the same
    Patent number: 10349519
    Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: July 9, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Su Kim, Nam Hee Kim, Hye Sun Yoon, Il Sang Maeng, Sang Seon Ha
  • Optical printed circuit board and method of manufacturing the same
    Patent number: 9612396
    Abstract: Provided is an optical printed circuit board, including: a first insulating layer on which at least one receiving groove with an inclined angle on at least one end is formed; an optical waveguide which is formed in the receiving groove of the first insulating layer; and a second insulating layer which is formed on the first insulating layer and buries the optical waveguide formed in the receiving groove.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 4, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sang Seon Ha
  • OPTICAL PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150003778
    Abstract: Provided is an optical printed circuit board, including: a first insulating layer on which at least one receiving groove with an inclined angle on at least one end is formed; an optical waveguide which is formed in the receiving groove of the first insulating layer; and a second insulating layer which is formed on the first insulating layer and buries the optical waveguide formed in the receiving groove.
    Type: Application
    Filed: November 29, 2012
    Publication date: January 1, 2015
    Inventor: Sang Seon Ha
  • Printed Circuit Board and Method for Manufacturing the Same
    Publication number: 20140078703
    Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.
    Type: Application
    Filed: May 2, 2012
    Publication date: March 20, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ji Su Kim, Nam Hee Kim, Hye Sun Yoon, Il Sang Maeng, Sang Seon Ha