Abstract: A joint structure of a vehicle body includes a front body module connected to a front portion of an under body, a rear body module connected to a rear portion of the under body, and an engage unit that detachably engages the front body module and the rear body module.

Abstract: A display device includes a plurality of emission areas that emit light, a plurality of touch electrodes disposed in a light blocking area surrounding the plurality of emission areas, in which the touch electrodes sense a touch, a first insulating layer disposed on the plurality of touch electrodes, and a plurality of light blocking parts disposed on the first insulating layer and overlapping the plurality of touch electrodes. A part of the plurality of light blocking parts includes a code pattern formed by an insertion portion inserted into the first insulating layer and overlapping the plurality of touch electrodes, and another part of the plurality of light blocking parts includes a non-code pattern formed by not having the insertion portion.

Abstract: A display device includes subpixels on a substrate, position code patterns having a predetermined position code shape, when viewed in a plan view, each position code pattern being disposed at a region between at least two adjacent subpixels, and a pixel-defining layer defining a region where each subpixel is disposed and covering the position code patterns. The plurality of position code patterns are formed in a planar code shape and are configured to reflect light incident through the pixel-defining layer.

Abstract: A display device is disclosed that includes a plurality of pixels and a plurality of code pixels. The pixels include light-emitting elements, which display an image. The code pixels are disposed in the same layer as the pixels and are adjacent to a reference point disposed between the pixels. The code pixels include infrared light-emitting elements, which emit infrared light. At least one of the code pixels, disposed in a particular direction from the reference point, emit the infrared light to provide a code pattern having position information.

Abstract: A method includes receiving trace sensor data associated with a first manufacturing process of a manufacturing chamber. The method further includes processing the trace sensor data by a processing device to generate summary data associated with the trace sensor data. The method further includes generating a quality index score based on the summary data. The method further includes providing an alert to a user based on the quality index score. The alert includes an indication that the manufacturing chamber performance does not meet a first threshold.

Abstract: Disclosed is an intelligent display board capable of increasing visibility by responding to external environmental factors in real time. The intelligent display board aims to improve a displayed image by minimizing differences in the characteristics of a display element (LED) according to the influence of external sunlight and artificial lighting and temperature. The white color of the display board is moved to be closed to a reference if deviating the reference so that low-level colors that are ignored by sunlight, etc. are darkened and the variance of recognizable colors is increased to make it easy to distinguish, thereby increasing the visibility of the display board. In addition, luminance varying according to temperature is adjusted to compensate for and adjust an image while automatically being applicable to a surrounding environment even with respect to temperature, thereby increasing the quality of an image displayed on the display board.

Abstract: Disclosed herein is a method including: performing eddy current testing on a steam generator tube material by using a motorized rotating pancake coil (MRPC) probe, evaluating a test signal measured using the eddy current testing, and predicting the corrosion rate of the steam generator tube material from a noise value in the MRPC inspection signal of the steam generator tube obtained from the evaluating. When the prediction method of a corrosion rate of a steam generator tube according to the present invention is used, the steam generator tube material which has low corrosion rate can be selected at the material selecting step because the corrosion rate can be predicted and the criterions on the corrosion rate of the steam generator tube can be established as the requirements through an eddy current MRPC noise inspection of the steam generator tube material.

Abstract: Disclosed herein is a method including: performing eddy current testing on a steam generator tube material by using a motorized rotating pancake coil (MRPC) probe, evaluating a test signal measured using the eddy current testing, and predicting the corrosion rate of the steam generator tube material from a noise value in the MRPC inspection signal of the steam generator tube obtained from the evaluating. When the prediction method of a corrosion rate of a steam generator tube according to the present invention is used, the steam generator tube material which has low corrosion rate can be selected at the material selecting step because the corrosion rate can be predicted and the criterions on the corrosion rate of the steam generator tube can be established as the requirements through an eddy current MRPC noise inspection of the steam generator tube material.

Abstract: A method for recovering indium oxide from a indium-containing residue includes putting tin and an indium-containing residue into a melting furnace, melting the indium-containing residue, generating fume oxide through a reaction of indium and oxygen in the melting furnace, flowing the exhaust gas into a scrubber, spraying a scrubber-circulating liquid toward the exhaust gas in the scrubber, collecting indium oxide included in the exhaust gas with the scrubber-circulating liquid through a gas-liquid contact, performing a first collection of indium oxide through a separation of solid from liquid in a centrifuge, flowing the exhaust gas passed through the scrubber into a bag filter, performing a second collection of indium oxide included in the exhaust gas in the bag filter, flowing the exhaust gas passed through the bag filter into an absorption tower, and removing odors and toxic components generated in the exhaust gas in the absorption tower filled with an activated carbon.

Abstract: The present invention relates to a process control system which can measure the physical properties of a CIGS thin film in real-time in a continuous production line of a CIGS thin film solar cell, more specifically to a system for real-time analysis of material distribution of a CIGS thin film comprising: a header, which comprises a laser irradiation unit producing plasma from the CIGS thin film by irradiating a laser beam to a part of the CIGS thin film; and a spectrum detection optical unit detecting a spectrum generated from the plasma; a transfer unit, which transfers the header at the same rate and to the direction with the transfer rate and direction of the CIGS thin film; and a spectrum analysis unit, which analyzes the spectrum detected by the spectrum detection optical unit.

Abstract: A fabrication processing system is used to produce copper indium gallium selenide (CuIn1-xGaxSe2 or CIGS) thin film solar cells, more particularly to a fabrication processing system CIGS of thin film solar cells, equipped with real-time analysis facilities for profiling the elemental components of CIGS thin film using laser-induced breakdown spectroscopy. The system provides a process control system for determining whether abnormalities are present or not by measuring a physical and chemical properties on a continuous production process lines of CIGS thin film solar cell in real time, and performs a production and quality management at the same time by providing a feedback to CIGS fabrication process.

Abstract: A scribing apparatus having a function to analyze distribution of a material forming a semiconductor or solar cell in real-time in a process producing the semiconductor or solar cell of is disclosed. The scribing apparatus having the analysis function of material distribution comprises: a laser irradiation unit, which conducts scribing by irradiating laser to a position to be scribed of an analysis subject; a spectrum detection optical unit, which detects a spectrum generated from plasma, which is produced by the irradiated laser; a spectrum information storage, which stores spectrum state information of each material forming the analysis subject; and a spectrum analysis unit, which analyzes distribution state information of the material by comparing the spectrum state information and the detected spectrum.

Abstract: The present invention relates to a process control system which can measure the physical properties of a CIGS thin film in real-time in a continuous production line of a CIGS thin film solar cell, more specifically to a system for real-time analysis of material distribution of a CIGS thin film comprising: a header, which comprises a laser irradiation unit producing plasma from the CIGS thin film by irradiating a laser beam to a part of the CIGS thin film; and a spectrum detection optical unit detecting a spectrum generated from the plasma; a transfer unit, which transfers the header at the same rate and to the direction with the transfer rate and direction of the CIGS thin film; and a spectrum analysis unit, which analyzes the spectrum detected by the spectrum detection optical unit.

Abstract: The present invention relatives to a fabrication processing system of CIGS thin film solar cell, more particularly to a fabrication processing system CIGS of thin film solar cell equipped with real-time analysis facilities for profiling the elemental components of CIGS thin film using laser-induced breakdown spectroscopy. The system of the present invention is to provide a process control system for determining whether abnormalities are present or not by measuring a physical and chemical properties on a continuous production process lines of CIGS thin film solar cell in real time, and performing a production and quality management at the same time by providing a feedback to CIGS fabrication process.

Abstract: Embodiments of methods and systems according to the application can transmit voice data by using a wireless LAN and a Bluetooth. One system embodiment can include a headset, an AP, and a terminal device to communicate with the headset according to a first protocol (e.g., Bluetooth) to transmit downlink voice data to the headset and to receive uplink voice data from the headset and to communicate with the AP according to a second protocol (e.g., wireless LAN) to transmit the uplink voice data to the AP and to receive the downlink voice data from the AP. The terminal device can receive the downlink voice data from the AP after the terminal device sends a PS-Poll frame to the AP within a period during which a transmission/reception between the terminal device and the headset is not to be performed.

Abstract: Embodiments of systems (e.g., the terminal apparatus) and methods according to the application can perform a handoff from a WiBro (wireless broadband) service to a wireless LAN service or from a WIMAX (worldwide interoperability for microwave access) service to a wireless LAN service. One embodiment can perform a communication according to a WIMAX or WiBro standard and, upon entering into an area where a communication conforming to a wireless LAN standard is available, perform a communication according to the wireless LAN standard.

Abstract: Embodiments of methods and systems of the application can transmit data (e.g., voice) using a wireless LAN and a Bluetooth. One system embodiment can include a terminal device, an AP (access point) for communicating with the terminal device according to a first (e.g., wireless LAN) protocol by using a first frequency band among multiple frequency bands of a prescribed frequency band (e.g., ISM frequency band) and a headset for communicating with the terminal device according to a second (e.g., Bluetooth) protocol by using at least one frequency band of remaining frequency bands by excepting the first frequency band.

Abstract: Disclosed is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises a buffer layer having a super-lattice layer on a silicon substrate, a first conductive clad layer on the buffer layer, an active layer on the first conductive clad layer, and a second conductive clad layer on the active layer.

Abstract: In a main memory database system constituted of the dual memory architecture of PRAM and DRAM as a main memory, a method for updating data in PRAM and DRAM includes Move-When-Write, memory allocation scheme in the dual memory architecture, and a method for dividing and storing database components in the PRAM and DRAM, comprises: determining properties of database components; determining which the components have higher importance required for maintaining the consistency and integrity in a database according to the determined properties of database components; if importance of some of the database components is determined to high level, transmitting the determined high components to PRAM; storing the transmitted database components in PRAM; if importance of some of the database components is determined to low level, transmitting the determined low components to DRAM; and storing lower importance of database components to DRAM, and capturing as snapshot the stored database components by periods, thereby providi

Abstract: Methods of forming a multi-level metal line of a semiconductor device are disclosed. One example method includes subsequently stacking first and second metal layers, wherein a conductive etching stopper layer is interposed at an interface between the first and second metal layers; forming first and second metal layer pattern by patterning the first metal layer, the etching stopper layer, and the second metal layer, wherein the first metal layer pattern is formed as a lower metal line; forming a connection contact in form of a plug by selectively etching the second metal layer pattern until the etching stopper layer is exposed; forming an interlayer insulating layer to cover the connection contact and the first metal layer pattern; and exposing an upper surface of the connection contact by planarizing the interlayer insulating layer.