Patents by Inventor Sang-Sik Park

Sang-Sik Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128630
    Abstract: The present invention relates to a support pole assembly for mounting an antenna and, particularly, to a support pole assembly for mounting an antenna, comprising: a support pole which is formed in a hollow structure and has an antenna device mounting hole formed at the circumferential surface thereof; an antenna device which is mounted to the support pole while passing through and covering the antenna device mounting hole and the rear portion of which is placed in the inner space of the support pole. Accordingly, the present invention provides an advantage in that the protrusion amount of the antenna device with respect to the support pole is reduced and thus the space required for mounting the antenna device can be reduced.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Chi Back RYU, Min Sik PARK, Kyo Sung JI, In Ho KIM, Sang Hyo KANG, Min Soo KIM, Hee KIM, Young Ji HONG
  • Publication number: 20240128109
    Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Inventors: Ji Hun Kim, Youn Gon Oh, Woo-Ram Moon, Sang Hyuk Park, Jong Hun Lee, Kyu-Sik Jeong
  • Publication number: 20240127722
    Abstract: A wireless communication device support assembly is disclosed, including a support pole comprising a hollow interior, a first frame having a polygonal shape disposed on top of the support pole, a plurality of wireless communication devices disposed inside the first frame, at least one or more rotational advertising apparatuses controllably elevated in a direction parallel to a longitudinal direction of the support pole, a drive unit configured to elevate or lower the rotational advertising apparatus, and a plurality of lift ropes having first ends connected with tops of the rotational advertising apparatuses and second ends connected with the drive unit.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Chi Back RYU, Min Sik PARK, Kyo Sung JI, In Ho KIM, Sang Hyo KANG, Min Soo KIM, Hee KIM
  • Patent number: 11961551
    Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soo Bong Chang, Young-Il Lim, Bok-Yeon Won, Seok Jae Lee, Dong Geon Kim, Myeong Sik Ryu, In Seok Baek, Kyoung Min Kim, Sang Wook Park
  • Publication number: 20240120475
    Abstract: The present disclosure relates to a cathode active material for an all-solid-state battery with a controlled particle size and a method for preparing the same. In particular, the cathode active material includes lithium and a transition metal, wherein the cathode active material has a single peak in the range of 1 ?m to 10 ?m as a result of particle size distribution (PSD) analysis.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Inventors: Sung Woo NOH, Hong Seok MIN, Sang Heon LEE, Jeong Hyun SEO, Im Sul SEO, Chung Bum LIM, Ju Yeong SEONG, Je Sik PARK
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Patent number: 11942762
    Abstract: A surface-emitting laser device according to an embodiment comprises: a first electrode; a substrate arranged on the first electrode; a first reflection layer arranged on the substrate; an active region arranged on the first reflection layer and including a cavity; an opening region arranged on the active region and including an aperture and an insulation region; a second reflection layer arranged on the opening region; a second electrode arranged on the second reflection layer; and a delta doping layer arranged in the opening region. The thickness of the insulation region becomes thinner in the direction of the aperture, and the delta doping layer can be arranged at the aperture.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: March 26, 2024
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Jeong Sik Lee, Sang Heon Han, Keun Uk Park, Yeo Jae Yoon
  • Publication number: 20240097174
    Abstract: The present disclosure relates to a secondary battery manufacturing system having a multi-packaging unit, in which multiple packaging units of a secondary battery manufacturing facility are provided and a transfer box on which an electrode assembly is accommodated is transferred to each packaging unit by a transfer unit, wherein the secondary battery manufacturing system includes: an electrode supply unit equipped with a plurality of stacking devices for supplying an electrode assembly in which a plurality of battery cells are stacked; a tab-welding unit; at least one packaging unit; at least one temporary buffer; and a transfer unit.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
  • Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Publication number: 20240079630
    Abstract: The present disclosure relates to a secondary battery manufacturing system in which a packaging unit of a secondary battery manufacturing facility are configured to have multiple packaging units, and having a multipackaging unit such that a transfer box in which an electrode assembly is seated is transferred to each of the packaging units by a transfer unit, and including an electrode supply unit having a plurality of stacking devices supplying an electrode assembly in which a plurality of battery cells are stacked, a tab welding unit, at least one packaging unit, at least one temporary buffer, and a transfer unit.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Publication number: 20240072140
    Abstract: A semiconductor device includes, first and second source/drain patterns on an active pattern and spaced apart from each other, a first source/drain contact on the first source/drain pattern and including a first source/drain barrier film and a first source/drain filling film on the first source/drain barrier film, a second source/drain contact on the second source/drain pattern, and a gate structure on the active pattern between the first and second source/drain contacts and including a gate electrode, wherein a top surface of the first source/drain contact is lower than a top surface of the gate structure, and a height from a top surface of the active pattern to a top surface of the first source/drain barrier film is less than a height from the top surface of the active pattern to a top surface of the first source/drain filling film.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Won Hyuk Lee, Jong Chul Park, Sang Duk Park, Hong Sik Shin, Do Haing Lee
  • Patent number: D974317
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 3, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kil-Hyun Baek, Kuk-Hwan Kim, Ki-Sung Kim, Sang-Sik Park
  • Patent number: D974318
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 3, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kil-Hyun Baek, Kuk-Hwan Kim, Ki-Sung Kim, Sang-Sik Park
  • Patent number: D976860
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Seung Han, Sang-Sik Park
  • Patent number: D976886
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Seung Han, Sang-Sik Park
  • Patent number: D976250
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 24, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Hyung Lee, Sang-Sik Park
  • Patent number: D982543
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 4, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chong-Yoon Chung, Sang-Sik Park
  • Patent number: D986843
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 23, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Il Park, Ji-Hyun Ko, Sang-Sik Park