Patents by Inventor Sang Soo Park
Sang Soo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11919688Abstract: According to an embodiment of the present disclosure, a content container is provided. The content container may include: a container part configured to accommodate a liquid content; an upper cap that is detachably coupled to the container part and includes a first accommodation part configured to accommodate a solid content and a pressing part moved by being pressed; and a lower cap that is inserted into the container part, and includes an accommodation tube forming a second accommodation part and a plurality of communication holes formed in the outside of the accommodation tube to communicate with the container part, wherein, by pressing the upper cap, the solid content is moved from the first accommodation part to the second accommodation part.Type: GrantFiled: March 18, 2021Date of Patent: March 5, 2024Assignee: KOLMAR BNH CO., LTDInventors: Chang Soo Lee, Koo Sup Ahn, Jong Hyun Park, Sang In Han, Hye Jin Jung
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Publication number: 20240067065Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.Type: ApplicationFiled: December 21, 2022Publication date: February 29, 2024Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
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Patent number: 11917818Abstract: A memory may include a first wafer, and a second wafer stacked on and bonded to the first wafer. The first wafer may include a cell structure including a memory cell array; and a first logic structure disposed under the cell structure, and including a row control circuit. The second wafer may include a second logic structure including a column control circuit.Type: GrantFiled: November 25, 2022Date of Patent: February 27, 2024Assignee: SK HYNIX INC.Inventors: Sung Lae Oh, Sang Woo Park, Dong Hyuk Chae, Ki Soo Kim
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Patent number: 11917875Abstract: A display device includes a substrate including an active area having pixels and a non-active area including a pad region. A pad electrode is disposed in the pad region and includes a first pad electrode and a second pad electrode disposed on the first pad electrode. A first insulating pattern is interposed between the first and second pad electrodes. In a plan view, the first insulating pattern is positioned inside the first pad electrode, and a portion of the second pad electrode overlapping the first insulating pattern protrudes further from the substrate in a thickness direction than a portion of the second pad electrode not overlapping the first insulating pattern. The second pad electrode directly contacts a portion of the upper surface of the first pad electrode. In a plan view, an area of the second pad electrode is greater than an area of the first pad electrode.Type: GrantFiled: December 29, 2021Date of Patent: February 27, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Ki Kyung Youk, Chan Jae Park, Min Soo Kim, Yoon A Kim, Sang Duk Lee, Chel Gou Lim
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Patent number: 11917193Abstract: According to the present invention, an image encoding apparatus comprises: a motion prediction unit which derives motion information on a current block in the form of the motion information including L0 motion information and L1 motion information; a motion compensation unit which performs a motion compensation for the current block on the basis of at least one of the L0 motion information and L1 motion information so as to generate a prediction block corresponding to the current block; and a restoration block generating unit which generates a restoration block corresponding to the current block based on the prediction block. According to the present invention, image encoding efficiency can be improved.Type: GrantFiled: February 4, 2020Date of Patent: February 27, 2024Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, University-Industry Cooperation Group of Kyung Hee UniversityInventors: Hui Yong Kim, Gwang Hoon Park, Kyung Yong Kim, Sang Min Kim, Sung Chang Lim, Jin Ho Lee, Jin Soo Choi, Jin Woong Kim
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Patent number: 11917453Abstract: Disclosed are a BS apparatus, a terminal apparatus, and a QoS control method for implementing the service flow-based QoS control without increasing complexity compared to the conventional bearer-based QoS control method.Type: GrantFiled: February 9, 2023Date of Patent: February 27, 2024Assignee: SK TELECOM CO., LTD.Inventors: Sang Soo Jeong, Jong Han Park
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Patent number: 11891273Abstract: The present invention relates to an overspeed and reverse drive preventing device for an escalator. The device has a pawl and a connection part mounted to be connected by a tension spring such that, when the pawl is inserted into gears of the ratchet and is compressed by a ratchet, the tension spring is extended and the pawl is perfectly inserted into the ratchet, thereby making it possible to apply the same to escalators having various specifications. A braking member is mounted on the inner peripheral surface of a brake arm mounted outside a ratchet part or a rotary shaft, or on the outer peripheral surface of the device facing the brake arm.Type: GrantFiled: November 29, 2021Date of Patent: February 6, 2024Inventors: Sam-Dug Yun, Sang-Soo Park
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Patent number: 11875948Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5?B/A.Type: GrantFiled: February 25, 2022Date of Patent: January 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Sang Soo Park, Chan Yoon, Woo Chul Shin, Ji Hong Jo
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Patent number: 11875931Abstract: A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.Type: GrantFiled: August 11, 2020Date of Patent: January 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Mi Yoo, Dong Hwan Lee, Hwi Dae Kim, Sang Soo Park, Chan Yoon, Dong Jin Lee
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Patent number: 11783982Abstract: A coil component includes a body; a coil portion disposed inside the body; a noise removal portion disposed to contact a surface of the body; an insulating layer disposed inside the noise removal portion; first and second external electrodes each connected to the coil portion and disposed on the insulating layer to overlap the noise removal portion; and a third external electrode disposed to be spaced apart from the first and second external electrodes and contacting the noise removal portion.Type: GrantFiled: August 6, 2020Date of Patent: October 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Dong Hwan Lee, Sang Soo Park, Chan Yoon, Dong Jin Lee, Hye Mi Yoo
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Patent number: 11769633Abstract: An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc?1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.Type: GrantFiled: June 16, 2021Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gu Won Ji, Heung Kil Park, Sang Soo Park, Young Ghyu Ahn
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Patent number: 11763986Abstract: An electronic component includes a capacitor body including a dielectric layer and first and second internal electrodes, and a first to sixth surfaces, the first and the second internal electrodes being exposed through the third and the fourth surfaces, respectively; first and second external electrodes respectively extending from the third and fourth surfaces of the body to a portion of the first surface and respectively connected to the first and second internal electrodes; a shielding layer comprising a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A lower portion of the capacitor body is exposed from the insulating layer and the shielding layer.Type: GrantFiled: September 22, 2021Date of Patent: September 19, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chan Yoon, Sang Soo Park, Hwi Dae Kim, Woo Chul Shin, Ji Hong Jo
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Patent number: 11749462Abstract: A multilayer ceramic electronic component includes a multilayer capacitor including a capacitor body, and first and second external electrodes disposed on both side surfaces of the capacitor body, respectively; first and second metal frames disposed on both side surfaces and upper and lower surfaces of the multilayer capacitor; and an exterior insulating portion disposed to surround upper surfaces of the multilayer capacitor and the first and second metal frames. A shortest distance from an upper end of the exterior insulating portion to the external electrodes is defined as G1, a shortest distance from a lower end of the exterior insulating portion to the external electrodes is defined as G2, a maximum distance from upper ends of the external electrodes to lower ends is defined as T, and G1, G2, and T satisfy G1?G2?T/2.Type: GrantFiled: November 30, 2021Date of Patent: September 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Sang Soo Park
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Patent number: 11728089Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.Type: GrantFiled: August 4, 2020Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Lee, Dong Hwan Lee, Chan Yoon, Sang Soo Park, Hye Mi Yoo, Hwi Dae Kim
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Publication number: 20230245822Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.Type: ApplicationFiled: April 11, 2023Publication date: August 3, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae KIM, Ji Hong JO, Woo Chul SHIN, Sang Soo PARK, Chan YOON
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Publication number: 20230240076Abstract: Disclosed are semiconductor devices and semiconductor packages. The semiconductor device comprises a semiconductor substrate that includes a stack region and a pad region, a peripheral circuit structure that includes a plurality of peripheral circuits on the semiconductor substrate, a cell array structure on the peripheral circuit structure, and a redistribution layer on the cell array structure and including a redistribution dielectric layer and a redistribution pattern on the redistribution dielectric layer. The redistribution dielectric layer covers an uppermost conductive pattern of the cell array structure. The redistribution pattern is connected to the uppermost conductive pattern. A thickness in a vertical direction of the redistribution layer on the pad region is greater than that of the redistribution layer on the stack region.Type: ApplicationFiled: November 11, 2022Publication date: July 27, 2023Inventors: SANG-LOK KIM, SANG SOO PARK, JUNG-JUNE PARK, SU CHANG JEON, SUNG-MIN JOE
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Patent number: 11694848Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.Type: GrantFiled: April 14, 2022Date of Patent: July 4, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Ghyu Ahn, Sang Soo Park, Min Cheol Park, Byoung Hwa Lee
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Patent number: 11676759Abstract: A coil component includes a body, a support substrate disposed within the body, a coil portion disposed on the support substrate and having first and second lead-out portions exposed to respective surfaces of the body, a noise removal portion disposed within the body and spaced apart from the coil portion, and including a pattern portion forming an open loop and having a slit between one end portion thereof and another end portion thereof spaced apart from each other. The noise removal portion also includes a third lead-out portion connected to the pattern portion and having one surface exposed to a side surface of the body. An insulating layer is disposed between the coil portion and the noise removal portion, and first to third external electrodes are disposed on respective surfaces of the body and connected to the first to third lead-out portions, respectively.Type: GrantFiled: August 11, 2020Date of Patent: June 13, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Sang Soo Park, Hwi Dae Kim, Dong Jin Lee, Hye Mi Yoo
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Patent number: 11670451Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminated in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.Type: GrantFiled: February 18, 2022Date of Patent: June 6, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Ji Hong Jo, Woo Chul Shin, Sang Soo Park, Chan Yoon
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Publication number: 20230170299Abstract: A memory device includes a substrate, a first cell string, second cell string, and third cell string, each connected to a first bit line and formed in a direction perpendicular to a top surface of the substrate, a first upper ground selection line connected to the first cell string, a second upper ground selection line separated from the first upper ground selection line and connected to the second and third cell strings, a first lower ground selection line connected to the first and second cell strings, and a second lower ground selection line separated from the first lower ground selection line and connected to the third cell string.Type: ApplicationFiled: November 2, 2022Publication date: June 1, 2023Inventors: SUNG-MIN JOE, SANG SOO PARK, CHUNG-HO YU