Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A?A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.

Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.

Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04?t/T?0.80.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

Abstract: An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.

Abstract: An electronic component includes a body in which external electrodes are disposed on opposing surfaces of the body in a first direction thereof, respectively; and a pair of metal frames connected to the external electrodes, respectively, wherein the metal frame includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is smaller than a length of the body in the second direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.

Abstract: To operate a memory device including a plurality of NAND strings, an unselected NAND string among a plurality of NAND strings is floated when a voltage of a selected word line is increased such that a channel voltage of the unselected NAND string is boosted. The channel voltage of the unselected NAND string may be discharged when the voltage of the selected word line is decreased. The load when the voltage of the selected word line increases may be reduced by floating the unselected NAND string to boost the channel voltage of the unselected NAND string together with the increase of the voltage of the selected word line. The load when the voltage of the selected word line is decreased may be reduced by discharging the boosted channel voltage of the unselected NAND string when the voltage of the selected word line is decreased. Through such reduction of the load of the selected word line, a voltage setup time may be reduced and an operation speed of the memory device may be enhanced.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.

Abstract: A method for fabricating a semiconductor device includes: forming a first conductive structure over a substrate; forming a multi-layer spacer including a non-conformal sacrificial spacer on both sidewalls of the first conductive structure; forming a second conductive structure adjacent to the first conductive structure with the multi-layer spacer therebetween; forming an air gap by removing the non-conformal sacrificial spacer; forming a capping layer covering the second conductive structure and the air gap; forming an opening that exposes a top surface of the second conductive structure by etching the capping layer; and forming a conductive pad coupled to the second conductive structure in the opening.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: A flash memory controller for a flash memory system includes an ECC circuit that receives first page data and second page data read from the flash memory, and respectively counts a first number of fail bits in the first page data and a second number of fail bits in the second page data, an abnormal wordline detector configured to compare the first number of fail bits and second number of fail bits to derive a fail bit change rate between the first page data and the second page data, and generate an abnormal wordline detection signal in response to the fail bit change rate, and a control unit that controls operation of the flash memory in response to the abnormal wordline detection signal.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the m first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: A memory device can include: a memory cell array including a memory cell and a word line that is connected to the memory cell; a clock generator configured to generate a first pumping clock signal from a system clock signal; a charge pump configured to provide a pumping voltage signal using a power supply voltage and the first pumping clock signal; a compensation circuit configured to compensate for variations in a first reference clock signal in accordance with variations in the power supply voltage, and provide a compensated first reference clock signal; and a pass/fail (P/F) determining circuit configured to determine whether the word line is defective by comparing the first pumping clock signal and the compensated first reference clock signal while the pumping voltage signal is provided to the word line.

Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A?A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.

Abstract: A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components.

Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are respectively disposed are stacked, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on outermost sides of the body and coil patterns disposed on an inner side thereof. The coil patterns arranged on the inner side are connected in parallel. At least one of gaps between the coil patterns arranged on the inner side is greater than a gap between other remaining coil patterns.