Abstract: An external material for vehicles may include a non-woven fabric having a honeycomb structure and a wheel guard including the same.

Abstract: A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semiconductor chip and the first conductive bump and electrically connects the semiconductor chip and the first conductive bump; and a buffer structure which formed to fill up a space between a side surface of the first conductive bump and one surface of the first re-distribution layer, in which the buffer structure includes a plurality of pores.

Abstract: An ultraviolet (UV) line beam sterilizer may include a UV light source unit including upper and lower light source modules and radiating UV line beams to top and bottom surfaces of personal effects being moved through a conveyor, a reflection plate unit including left and right reflection plates radiating UV line beams to left and right surfaces of the personal effects by reflecting the UV line beams from the upper and lower light source modules, and a wedge-shaped reflection plate radiating UV line beams to the front and back of the personal effects by reflecting the UV line beams, a sensor unit including sensors installed at intervals in a row on the conveyor and outputting sensing signals for moved locations of the personal effects, and a controller outputting a pulse width modulation signal and a switching control signal based on the sensing signals and user setting information.

Abstract: A semiconductor device includes a semiconductor chip including a gate structure, the semiconductor chip having a first region and a second region that surrounds sides of the first region, first solder balls on the first region of the semiconductor chip and containing a first weight percent of silver, second solder balls on the first region of the semiconductor chip and containing a second weight percent of silver greater than the first weight percent, and third solder balls on the second region of the semiconductor chip and containing a third weight percent of silver less than the first weight percent.

Abstract: A semiconductor device includes a semiconductor chip including a gate structure, the semiconductor chip having a first region and a second region that surrounds sides of the first region, first solder balls on the first region of the semiconductor chip and containing a first weight percent of silver, second solder balls on the first region of the semiconductor chip and containing a second weight percent of silver greater than the first weight percent, and third solder balls on the second region of the semiconductor chip and containing a third weight percent of silver less than the first weight percent.

Abstract: A semiconductor device including a high-reliability bump structure including a pillar structure is provided. The semiconductor device includes a substrate, a connection pad on the substrate, and a bump structure on the connection pad, wherein the bump structure includes a pillar structure having a side wall and an upper surface, a metal protection film including a first portion extending along the side wall of the pillar structure and a second portion extending along the upper surface of the pillar structure, and a solder layer on the second portion of the metal protection film.

Abstract: A method includes performing a check-out process of fetching a program to be modified from an operating space to a development space, performing a modification task on the checked-out program in the development space, selecting a target program of the operating space having a fetch relationship with the modified program when the modification task is completed, changing the selected target program so that the selected target program is fetched, performing simulations on the modified program through an association between the modified program and the target program, and performing a check-in process of updating contents of the modified program by incorporating the contents of the modified program into the operating space when program development is completed.

Abstract: A method for monitoring resistance welding is provided, which includes receiving an input of waveform data obtained by converting current or voltage applied to a transformer welding gun into a digital signal through a teaching group filter; comparing the input waveform data with acceptance waveform data of current or voltage that is accumulatively stored through a destructive test; determining acceptance of a quality of a corresponding welding product if the input waveform data and the acceptance waveform data are equal or similar to each other within a predetermined error range, and determining rejection of the quality of the corresponding welding product if the input waveform data and the acceptance waveform data are different from each other; and outputting an acceptance or rejection message depending on the result of the determination.