Patents by Inventor Sang Sun Park

Sang Sun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130065469
    Abstract: Disclosed is a carbon fiber composite comprising 30 to 80 wt % of a carbon fiber textile wherein a carbon fiber tow size is 24K to 100K; 0.1 to 20 wt % of a carbon non-woven fabric whose weight per unit area is 10˜500 g/m2; and 10 to 70 wt % of a polymer resin whose viscosity at transference thereof is 0.01˜10 Pa·s. Advantageously, it is possible to obtain a molded product of the carbon fiber composite which has good surface properties and flexural properties by selectively applying the carbon non-woven fabric to a surface of the material thereof using the carbon fiber composite.
    Type: Application
    Filed: November 21, 2011
    Publication date: March 14, 2013
    Applicants: KIA MOTORS CORPORATION, HYUNDAI MOTOR COMPANY
    Inventors: Hyun Min Kang, Sang Mu Lee, Chi Hoon Choi, Cheol Choi, Sang Sun Park
  • Publication number: 20130004751
    Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.
    Type: Application
    Filed: March 15, 2011
    Publication date: January 3, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Publication number: 20130004703
    Abstract: The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.
    Type: Application
    Filed: March 30, 2011
    Publication date: January 3, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng Zhe Huang
  • Publication number: 20120231256
    Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 13, 2012
    Applicant: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Publication number: 20110070411
    Abstract: The present invention provides a plastic with improved gloss properties and a surface treatment method for plastic, which forms a nanopattern and a hardened layer on the surface of a polymer material by irradiating an argon ion beam onto the surface to change the refractive index, thus changing the gloss of the polymer variously using only the polymer/plastic material.
    Type: Application
    Filed: March 26, 2010
    Publication date: March 24, 2011
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yong Jun Jang, Ki Chun Lee, Sang Sun Park, Kwang Ryeol Lee, Myoung Woon Moon, Faruque Ahmed Sk
  • Patent number: 7521565
    Abstract: 1,2,3,9-tetrahydro-9-methyl-3-[(2-methyl-1H-imidazol-1-yl)methyl]-4H-carbazol-4-one or its salt is prepared in high yield by reacting a compound of formula 2 with a compound of formula 3 and a compound of formula 4 in the presence of an acid, an alkylsilylhalide compound or an acylhalide compound, in an solvent, and thus, such an inventive process can be favorably applied to a large-scale mass production thereof.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: April 21, 2009
    Assignee: Yuhan Corporation
    Inventors: Tai Au Lee, Sang Sun Park, Doo Byung Lee, Sang Jung Kim
  • Publication number: 20070129414
    Abstract: 1,2,3,9-tetrahydro-9-methyl-3-[(2-methyl-1H-imidazol-1-yl)methyl]-4H-carbazol-4-one or its salt is prepared in high yield by reacting a compound of formula 2 with a compound of formula 3 and a compound of formula 4 in the presence of an acid, an alkylsilylhalide compound or an acylhalide compound, in an solvent, and thus, such an inventive process can be favorably applied to a large-scale mass production thereof.
    Type: Application
    Filed: October 15, 2004
    Publication date: June 7, 2007
    Applicant: YUHAN CORPORATION
    Inventors: Tai Au Lee, Sang Sun Park, Doo Byung Lee, Sang Jung Kim
  • Publication number: 20030065057
    Abstract: A low specific gravity thermosetting resin composition of high fluidization with excellent mechanical properties, and methods for preparing the same, wherein a thermosetting resin composition for outer plastic panel of an automobile is modified in that a part of the inorganic filler is replaced with a low specific gravity filler, and the type of a filler and a thickener are altered from those compounds normally used for car panels. The are light-weight. The process prevents the degradation of the low specific gravity filler which can normally occur under a general compacting pressure. The composition has superior plasticity even when press forming under a low pressure.
    Type: Application
    Filed: February 25, 2002
    Publication date: April 3, 2003
    Inventors: Chi-Hoon Choi, Sang-Sun Park, Kye-Won Ahn, Jeong-Eek Rhee
  • Publication number: 20020042468
    Abstract: The present invention relates to a thermosetting resin composition for outer panel of automobile, more specifically to a thermosetting resin composition for outer panel of automobile, which uses unsaturated polyester resin instead of usually used thermosetting resin as substrate, comprises filler and glass fiber reinforcing agent as main component, and contains butadiene rubber, low profile agent, curing agent, curing initiator, parting agent, thickening agent and common additives, and is prepared by SMC (Sheet Molding Compounding) method to provide excellent mechanical property and surface appearance property to outer panel of automobile.
    Type: Application
    Filed: April 23, 2001
    Publication date: April 11, 2002
    Inventors: Chi Hoon Choi, Sang Sun Park, Ki Seok Kim, Yong Chul Lee, Myung Jae Lee, Sun Suk Lee