Abstract: A connector position alignment assembly includes a first part and a second part coupled to each other through a connector and including a guide portion aligning a position of the connector. The guide portion is provided with a guide pin and a guide boss including portions protruding toward each other, and the guide pin and the guide boss respectively protrude further than the connector, in a direction in which the first part and the second part face each other, such that a portion of the guide pin is accommodated in the guide boss before the connectors are coupled to each other.

Abstract: An eco-friendly power source such as a battery module is provided for a transportation vehicle, including: a first sub-module and a second sub-module respectively including a cell stack in which a plurality of battery cells are stacked; and a central wall disposed between the first sub-module and the second sub-module, wherein the central wall includes a first central wall facing the first sub-module and a second central wall facing the second sub-module, wherein the first central wall has a rotationary symmetrical shape of the second central wall around a first axis.

Abstract: An eco-friendly power source, such as a battery module provided for a transportation vehicle includes a first sub-module and a second sub-module disposed in a first direction, the first sub-module and the second sub-module respectively including a plurality of battery cells stacked in a second direction, which is perpendicular to the first direction, and a lower cover coupled to the first sub-module and the second sub-module. The first sub-module and the second sub-module are disposed to be rotationally symmetrical to each other about a central axis, which is perpendicular to both the first direction and the second direction.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: The present disclosure relates to a pressure swing adsorption apparatus for hydrogen purification from decomposed ammonia gas and a hydrogen purification method using the same, and more particularly, the pressure swing adsorption apparatus of the present disclosure includes a plurality of adsorption towers including a pretreatment unit and a hydrogen purification unit wherein the adsorption towers of the pretreatment unit and the hydrogen purification unit are packed with different adsorbents, thereby achieving high purity hydrogen purification from mixed hydrogen gas produced after ammonia decomposition, making it easy to replace the adsorbent for ammonia removal, minimizing the likelihood that the lifetime of the adsorbent in the hydrogen purification unit is drastically reduced by a very small amount of ammonia, and actively responding to a large change in ammonia concentration in the raw material.

Abstract: A peripheral component interconnect express (PCIe) device includes a common function performing operations associated with a PCIe interface according to a function type, the common function being programmable to be a function type selected from a plurality function types, an access identification information controller generating first access identification information for allowing an access to the common function, and providing the first access identification information to an assigned system image to which the common function has been assigned, a data packet receiver receiving a data packet including target identification information indicating a target system image from the target system image, and an access allowance determiner determining whether or not to allow the target system image to access the common function based on the first access identification information and the target identification information.

Abstract: Provided are a plated steel sheet and a method for manufacturing same, the plated steel sheet comprising: a base steel sheet; a Zn—Mg—Al based steel sheet plating layer provided on at least one surface of the base steel sheet; and an Fe—Al based inhibition layer provided between the base steel sheet and the Zn—Mg—Al based plating layer, wherein the plating layer comprises, in wt %: 4% or more of Mg; 2.1 times or more of Mg content and 14.2% or less of Al; 0.2% or less (including 0%) of Si; 0.1% or less (including 0%) of Sn; the remainder Zn; and unavoidable impurities.

Abstract: A voltage measurement device is provided. The voltage measurement device includes a contact portion configured to contact an electric wire for transmitting an alternating current (AC) voltage and to output an induced voltage induced by the AC voltage in a surface of the electric wire, a capacitive element connected in series to the contact portion, and a controller configured to calculate amplitude of the AC voltage using the induced voltage output from the contact portion and a second voltage output from the capacitive element.

Abstract: A voltage measurement device is provided. The voltage measurement device includes a contact portion configured to contact an electric wire for transmitting an alternating current (AC) voltage and to output an induced voltage induced by the AC voltage in a surface of the electric wire, a capacitive element connected in series to the contact portion, and a controller configured to calculate amplitude of the AC voltage using the induced voltage output from the contact portion and a second voltage output from the capacitive element.

Abstract: The present invention relates to an upstream ozone contact tank for removing residual ozone. The upstream ozone contact tank includes an inlet through which purified raw water flows, at least one contact chamber, at least one reaction chamber, an upstream contact chamber, and an outlet that discharges ozone-treated raw water. Especially, the invention provides an upstream contact chamber between the reaction chamber and outlet, wherein the upstream contact chamber includes carbonaceous filter media mounted on a porous plate. An openable gate unit is installed at the lower part of a panel partitioning a final reaction chamber and the upstream contact chamber and controls flow rate. Additionally, the invention enables upstream flow of the raw water flowing into the upstream contact chamber from the final reaction chamber so that the raw water may pass through the carbonaceous filter media upwardly.

Abstract: The present invention relates to an upstream ozone contact tank for removing residual ozone. The upstream ozone contact tank comprises an inlet through which purified raw water flows, at least one contact chamber, at least one reaction chamber, an upstream contact chamber, and an outlet that discharges ozone-treated raw water. Especially, the invention provides an upstream contact chamber between the reaction chamber and outlet, wherein the upstream contact chamber includes carbonaceous filter media mounted on a porous plate. An openable gate unit is installed at the lower part of a panel partitioning a final reaction chamber and the upstream contact chamber and controls flow rate. Additionally, the invention enables upstream flow of the raw water flowing into the upstream contact chamber from the final reaction chamber so that the raw water may pass through the carbonaceous filter media upwardly.