Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a refresh control circuit, a scrubbing control circuit and a control logic circuit. The refresh control circuit generates refresh row addresses for refreshing a memory region on memory cell rows in response to a first command received from a memory controller. The scrubbing control circuit counts the refresh row addresses and generates a scrubbing address for performing a scrubbing operation on a first memory cell row of the memory cell rows whenever the scrubbing control circuit counts N refresh row addresses of the refresh row addresses. The ECC engine reads first data corresponding to a first codeword, from at least one sub-page in the first memory cell row, corrects at least one error bit in the first codeword and writes back the corrected first codeword in a corresponding memory location.

Abstract: A semiconductor memory device includes an error correction code (ECC) engine, a memory cell array, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes a normal cell region configured to store main data and a parity cell region configured to selectively store parity data which the ECC engine generates based on the main data, and sub data received from outside of the semiconductor memory device. The control logic circuit controls the ECC engine to selectively perform an ECC encoding and an ECC decoding on the main data and controls the I/O gating circuit to store the sub data in at least a portion of the parity cell region.

Abstract: An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Abstract: A method of operating a semiconductor memory device can include receiving data, from a memory controller, at an Error Correction Code (ECC) engine included in the semiconductor memory device, the data including at least one predetermined error. Predetermined parity can be received at the ECC engine, where the predetermined parity is configured to correspond to the data without the at least one predetermined error. A determination can be made whether a number of errors in the data is correctable by the ECC engine using the data including the at least one predetermined error and the predetermined parity.

Abstract: Semiconductor memory device includes a memory cell array and an interface circuit including an ECC engine. The memory cell array includes a normal cell region and a parity cell region including a first sub parity region and a second sub parity region. The interface circuit receives main data and sub data comprising external parity or a data mask signal, generates a flag signal based on mask bits of the data mask signal, performs ECC encoding operation on the main data in response to an operation mode and the flag signal, stores the main data in the normal cell region, stores either the external parity or the flag signal in the second sub parity region in response to the operation mode, performs an ECC decoding operation on the main data read from the normal cell region in response to the operation mode and the flag signal.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a refresh control circuit, a scrubbing control circuit and a control logic circuit. The refresh control circuit generates refresh row addresses for refreshing a memory region on memory cell rows in response to a first command received from a memory controller. The scrubbing control circuit counts the refresh row addresses and generates a scrubbing address for performing a scrubbing operation on a first memory cell row of the memory cell rows whenever the scrubbing control circuit counts N refresh row addresses of the refresh row addresses. The ECC engine reads first data corresponding to a first codeword, from at least one sub-page in the first memory cell row, corrects at least one error bit in the first codeword and writes back the corrected first codeword in a corresponding memory location.

Abstract: Disclosed are a semiconductor memory device and a memory system including the same. The semiconductor memory device includes a memory cell array having a plurality of memory cells and includes an error correcting code (ECC) decoder configured to receive first data and a first parity for the first data from selected memory cells of the memory cell array, generate a second parity for the first data using an H-matrix and the first data, compare the first parity to the second parity to generate a first syndrome, and generate a decoding status flag (DSF) with different states on the basis of a number of “0” or “1” bits included in the first syndrome.

Abstract: A semiconductor memory device is provided. The device includes a memory cell array including a plurality of dynamic memory cells; an error correction code (ECC) engine; an input/output (I/O) gating circuit connected between the ECC engine and the memory cell array; an error information register configured to store an error address and a first syndrome, the error address and the first syndrome being associated with a first error bit in a first codeword stored in a first page of the memory cell array; and a control logic configured to, based on the first codeword being read again and including a second error bit which is different from the first error bit, recover a second syndrome associated with the second error bit by using the first syndrome stored in the error information register and sequentially correct the first error bit and the second error bit.

Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, an input/output (I/O) gating circuit, and a control logic circuit. The memory cell array includes a plurality of bank arrays, and each of the bank arrays includes dynamic memory cells. The control logic circuit generates a first control signal to control the I/O gating circuit and a second control signal to control the ECC engine, in response to an access address and a command. The control logic circuit controls the ECC engine to perform s-bit ECC encoding on a write data to be stored in a first page of at least one bank array, in response to a first command, and controls the ECC engine to perform t-bit ECC decoding on a first codeword read from the first page, in response to a second command.

Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

Abstract: A semiconductor memory device is provided. The device includes a memory cell array including a plurality of dynamic memory cells; an error correction code (ECC) engine; an input/output (I/O) gating circuit connected between the ECC engine and the memory cell array; an error information register configured to store an error address and a first syndrome, the error address and the first syndrome being associated with a first error bit in a first codeword stored in a first page of the memory cell array; and a control logic configured to, based on the first codeword being read again and including a second error bit which is different from the first error bit, recover a second syndrome associated with the second error bit by using the first syndrome stored in the error information register and sequentially correct the first error bit and the second error bit.

Abstract: A scrubbing controller of a semiconductor memory device includes a scrubbing address generator and a weak codeword address generator. The scrubbing address generator generates a scrubbing address for all codewords in a first bank array of a plurality of bank arrays in a first scrubbing mode. The scrubbing address is associated with a normal scrubbing operation and changes in response to an internal scrubbing signal and a scrubbing command. The weak codeword address generator generates a weak codeword address for weak codewords in the first bank array in a second scrubbing mode. The weak codeword address is associated with a weak scrubbing operation and is generated in response to the internal scrubbing signal.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, a refresh control circuit, a scrubbing control circuit and a control logic circuit. The refresh control circuit generates refresh row addresses for refreshing a memory region on memory cell rows in response to a first command received from a memory controller. The scrubbing control circuit counts the refresh row addresses and generates a scrubbing address for performing a scrubbing operation on a first memory cell row of the memory cell rows whenever the scrubbing control circuit counts N refresh row addresses of the refresh row addresses. The ECC engine reads first data corresponding to a first codeword, from at least one sub-page in the first memory cell row, corrects at least one error bit in the first codeword and writes back the corrected first codeword in a corresponding memory location.

Abstract: An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first ig,DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Abstract: Disclosed are a semiconductor memory device and a memory system including the same. The semiconductor memory device includes a memory cell array having a plurality of memory cells and includes an error correcting code (ECC) decoder configured to receive first data and a first parity for the first data from selected memory cells of the memory cell array, generate a second parity for the first data using an H-matrix and the first data, compare the first parity to the second parity to generate a first syndrome, and generate a decoding status flag (DSF) with different states on the basis of a number of “0” or “1” bits included in the first syndrome.

Abstract: Semiconductor memory device includes a memory cell array and an interface circuit including an ECC engine. The memory cell array includes a normal cell region and a parity cell region including a first sub parity region and a second sub parity region. The interface circuit receives main data and sub data comprising external parity or a data mask signal, generates a flag signal based on mask bits of the data mask signal, performs ECC encoding operation on the main data in response to an operation mode and the flag signal, stores the main data in the normal cell region, stores either the external parity or the flag signal in the second sub parity region in response to the operation mode, performs an ECC decoding operation on the main data read from the normal cell region in response to the operation mode and the flag signal.

Abstract: An error correction circuit of a semiconductor memory device including a memory cell array includes an error correction code (ECC) memory that stores an ECC and an ECC engine. The ECC is represented by a generation matrix. The ECC engine generates first parity data based on main data using the ECC, and corrects at least one error bit in the main data read from the memory cell array using the first parity data. The main data includes a plurality of data bits divided into a plurality of sub codeword groups. The ECC includes a plurality of column vectors divided into a plurality of code groups corresponding to the sub codeword groups. The column vectors have elements configured to restrict a location of a sub codeword group in which a mis-corrected bit occurs, in which the mis-corrected bit is generated due to error bits in the main data.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, an input/output (I/O) gating circuit, and a control logic circuit. The memory cell array includes a plurality of bank arrays, and each of the bank arrays includes dynamic memory cells. The control logic circuit generates a first control signal to control the I/O gating circuit and a second control signal to control the ECC engine, in response to an access address and a command. The control logic circuit controls the ECC engine to perform s-bit ECC encoding on a write data to be stored in a first page of at least one bank array, in response to a first command, and controls the ECC engine to perform t-bit ECC decoding on a first codeword read from the first page, in response to a second command.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of dynamic memory cells, an ECC engine configured to correct at least one error in a read data from the memory cell array, and a test circuit which performs a test on the memory cell array in a test mode of the semiconductor memory device by writing a test pattern data in the memory cell array and by reading, from the memory cell array, test result data corresponding to the test pattern data. When the test result data includes at least one error bit, the test circuit subtracts a second number from a first number of the at least one error bit and is configured to output the subtracted result to an outside of the semiconductor memory device. The second number corresponds to a number of error bits that the ECC engine is capable of correcting.