Patents by Inventor Sang-Un Nam

Sang-Un Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090090942
    Abstract: A wiring structure includes a substrate, a copper oxide layer having 16˜39 at % oxygen on the substrate and a copper layer on the copper oxide layer. The copper oxide layer has a thickness of 10-1000 ? and the copper layer has a thickness of 300-8000 ?. The copper layer and the copper oxide layer further have an alloy element less than 10 wt % and the alloy element is selected from the group of Ag, Ni, Mg, Zr, N.
    Type: Application
    Filed: September 4, 2008
    Publication date: April 9, 2009
    Inventors: Kyong-Sub Kim, Sang-Un Nam, Chang-Oh Jeong, Weon-Sik Oh, Sung-Lak Choi, Soo-Im Jeong, Jae-Ho Eo