Patents by Inventor Sang Wook Ahn

Sang Wook Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076127
    Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.
    Type: Application
    Filed: May 23, 2023
    Publication date: March 7, 2024
    Inventors: Sang Kyung LEE, Seung Gyu KANG, Hyun Jae KANG, Young Wook KIM, Sang A BANG, Yong-Jun AHN, Min Kyun LEE, Hyun Woo LEE, Jeong Hun LIM, Jun Hyuk CHANG
  • Patent number: 10313620
    Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: June 4, 2019
    Assignee: SK hynix Inc.
    Inventors: Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Heui-Gyun Ahn
  • Patent number: 10165169
    Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: December 25, 2018
    Assignee: SK Hynix Inc.
    Inventors: Huy Chan Jung, Heui-Gyun Ahn, Sang Wook Ahn, Yong Woon Lee
  • Patent number: 9934170
    Abstract: The present invention relates to a technology enabling a normal access by controlling a read access through an arbiter in a circuit for controlling an access to memory to which clock signals are input through two ports, respectively for a read access to a single port memory. The present invention includes an arbiter that generates an internal clock signal through a state transition among a first state for generating a first clock signal, a second state for generating a second clock signal, a standby state and a neutral state when generating the internal clock signal for reading data from the memory on the basis of the first clock signal and the second clock signal, and a read end signal that is supplied from the memory.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: April 3, 2018
    Assignee: SILICONFILE TECHNOLOGIES INC.
    Inventors: Seong Jun Park, Huy Chan Jung, Sang Wook Ahn
  • Patent number: 9613881
    Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: April 4, 2017
    Assignee: SK Hynix Inc.
    Inventors: Heui Gyun Ahn, Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Sung Chun Jun
  • Publication number: 20160373629
    Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.
    Type: Application
    Filed: November 27, 2014
    Publication date: December 22, 2016
    Inventors: Huy Chan JUNG, Heui-Gyun AHN, Sang Wook AHN, Yong Woon LEE
  • Publication number: 20160321196
    Abstract: The present invention relates to a technology enabling a normal access by controlling a read access through an arbiter in a circuit for controlling an access to memory to which clock signals are input through two ports, respectively for a read access to a single port memory. The present invention includes an arbiter that generates an internal clock signal through a state transition among a first state for generating a first clock signal, a second state for generating a second clock signal, a standby state and a neutral state when generating the internal clock signal for reading data from the memory on the basis of the first clock signal and the second clock signal, and a read end signal that is supplied from the memory.
    Type: Application
    Filed: November 27, 2014
    Publication date: November 3, 2016
    Inventors: Seong Jun PARK, Huy Chan JUNG, Sang Wook AHN
  • Patent number: 9478464
    Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 25, 2016
    Assignee: SILICONFILE TECHNOLOGIES INC.
    Inventors: Heui Gyun Ahn, Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Do Young Lee
  • Publication number: 20160301888
    Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.
    Type: Application
    Filed: November 11, 2014
    Publication date: October 13, 2016
    Applicant: Siliconfile Technologies Inc.
    Inventors: Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG, Heui-Gyun AHN
  • Publication number: 20160268373
    Abstract: A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.
    Type: Application
    Filed: October 2, 2014
    Publication date: September 15, 2016
    Inventors: Min Suk KO, Kyoung Sik PARK, Gab Hwan CHO, Heui Gyun AHN, Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG
  • Publication number: 20160267946
    Abstract: The present invention provides a stack memory device and a method for operating same. The stack memory device, according to the present invention, is provided with: a first memory chip in which first type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each first type memory cell; and a second memory chip in which second type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each second type memory cell, wherein first pads are connected to the dump lines of the first type memory cells and second pads are connected to the dump lines of the second type memory cells, the first pads and the second pads having one-to-one correspondence.
    Type: Application
    Filed: October 27, 2014
    Publication date: September 15, 2016
    Inventors: Sang Wook Ahn, Huy Chan Jung, Yong Woon Lee, Heui-Gyun Ahn, Do Young Lee
  • Patent number: 9406652
    Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: August 2, 2016
    Assignee: SILICONFILE TECHNOLOGIES INC.
    Inventors: Sang Wook Ahn, Huy Chan Jung, Yong Woon Lee, Do Young Lee, Heui-Gyun Ahn
  • Patent number: 9386788
    Abstract: The present application relates to novel isomaltooligosaccharide (IMO) compositions containing isomaltulose, methods for preparing the same and uses thereof. Specifically, the IMO compositions according to the present application containing isomaltulose, which is a sugar component not contained in currently available isomaltooligosaccharide products, have a quality of sweetness and degree of sweetness differentiated from the existing isomaltooligosaccharide products and thus can be used as sweeteners for more various applications.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: July 12, 2016
    Assignee: Corn Products Development, Inc.
    Inventor: Sang-Wook Ahn
  • Publication number: 20160163595
    Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.
    Type: Application
    Filed: April 30, 2014
    Publication date: June 9, 2016
    Inventors: Heui Gyun AHN, Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG, Do Young LEE
  • Publication number: 20160133603
    Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.
    Type: Application
    Filed: May 12, 2014
    Publication date: May 12, 2016
    Inventors: Sang Wook AHN, Huy Chan JUNG, Yong Woon LEE, Do Young LEE
  • Publication number: 20160081382
    Abstract: The present application relates to novel isomaltooligosaccharide (IMO) compositions containing isomaltulose, methods for preparing the same and uses thereof. Specifically, the IMO compositions according to the present application containing isomaltulose, which is a sugar component not contained in currently available isomaltooligosaccharide products, have a quality of sweetness and degree of sweetness differentiated from the existing isomaltooligosaccharide products and thus can be used as sweeteners for more various applications.
    Type: Application
    Filed: May 20, 2014
    Publication date: March 24, 2016
    Applicant: CORN PRODUCTS DEVELOPMENT, INC.
    Inventor: Sang Wook Ahn
  • Publication number: 20160086869
    Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.
    Type: Application
    Filed: May 9, 2014
    Publication date: March 24, 2016
    Inventors: Heui Gyun AHN, Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG, Sung Chun JUN
  • Publication number: 20130136840
    Abstract: The present invention relates to methods for preparing high purity gentiooligosaccharides, high purity gentiooligosaccharides obtained therefrom, and uses thereof. The methods of the present invention involve: adding a low purity gentiooligosaccharide to a liquid medium; subjecting the liquid medium to inoculation with a microorganism, followed by incubation and fermentation to consume glucose that is contained in the low purity gentiooligosaccharide; and subjecting the resulting fermentation broth to filtration and purification. According to the method of the present invention, high purity gentiooligosaccharides having a purity of at least 90% that can be used as alternatives to foods such as cocoa, chocolate, coffee, beer, tea, bread or confectionery product, and beverage or the main ingredients thereof.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 30, 2013
    Applicant: CORN PRODUCTS DEVELOPMENT, INC.
    Inventors: JAE Ho LEE, Sang Wook Ahn, Sang Jae Park, Kyeong Hee Kim
  • Patent number: 7766036
    Abstract: A discharge valve (100) of a compressor is disclosed. The discharge valve (100) contains a spring-loaded valve body (120). Valve body (120) is preferably made of nonferrous metal like aluminum or magnesium and is coated by a covering (110) of uniform thickness, the covering (110) being preferably made of plastic material like polyetheretherketone (PEEK) by insertion molding. By that way a wear resistant and light-weight discharge valve is produced.
    Type: Grant
    Filed: November 11, 2005
    Date of Patent: August 3, 2010
    Assignee: LG Electronics Inc.
    Inventors: Jong-Yoon Choi, Sang-Wook Ahn, Bon-Cheol Ku, Hyung-Pyo Yoon, Hyo-Jae Lee, Seong-Yeol Hyeon
  • Patent number: RE49957
    Abstract: Provided are a method and apparatus for providing and using content advisory (CA) information on Internet contents. A method of providing CA information by using a CA information server, includes receiving a request for the CA information on a content, from an Internet Protocol television (IPTV); searching for CA information on the content; and transmitting the found CA information to the IPTV. A method of using CA information when an IPTV reproduces a content not having the CA information, according to the present invention, includes transmitting a request for CA information, to a CA information server; receiving the CA information from the CA information server; analyzing the CA information; and applying the CA information.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-shin Park, Kwang-hyuk Kim, Sung-wook Ahn, Sung-wook Byun, Sang-woong Lee, Eun-Hee Rhim, O-hoon Kwon, Sung-jin Park, In-chul Hwang, Mun-jo Kim