Patents by Inventor Sang Wuk JUN

Sang Wuk JUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having electronic components embedded therein
    Patent number: 8942004
    Abstract: Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: January 27, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Chang Hong, Bong Kyu Choi, Je Gwang Yoo, Sang Wuk Jun, Sang Kab Park, Jung Soo Byun
  • PRINTED CIRCUIT BOARD HAVING ELETRONIC COMPONENTS EMBEDDED THEREIN
    Publication number: 20120087097
    Abstract: Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.
    Type: Application
    Filed: December 17, 2010
    Publication date: April 12, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Chang HONG, Bong Kyu CHOI, Je Gwang Yoo, Sang Wuk JUN, Sang Kab PARK, Jung Soo Byun