Patents by Inventor Sang Yeop Kim

Sang Yeop Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149751
    Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: Jae Wook Kim, Sang Soo Lee, Deok Soo Lim, Hyun Wook Lim, Sang Ho Lee, Sang Hark Lee, Hak Cheol Lee, Deok Ki Kim, Byeong Deok Choi, Hoe Cheon Kim, Hwa Young Mun, Seung Yeop Lee, Cheol Hwan Yoon, Jung Bin Lee, Byung Ju Kang
  • Patent number: 11976845
    Abstract: A humidifier for which the cleaning of a water tank is easy includes: a water tank which is mounted inside a housing and stores water; a humidification member which is immersed in the water stored in the water tank and performs humidification; a water container provided with an opening/closing valve which is opened and closed to supply water stored therein to the water tank; a water container support member which is detachably mounted to an upper part of the water tank and on which the water container is seated; and a water supply control member which is mounted to the water container support member and opens and closes the opening/closing valve so that the water can be supplied from the water container to the water tank.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: May 7, 2024
    Assignee: Coway Co., Ltd.
    Inventors: Do-Yeop Kim, Hyun-Jin Hong, Sang-Woo Kang, An-Ho Cho
  • Publication number: 20240071690
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop KIM, Jin Il KANG, Ji Hun LEE, Chang Hak CHOI
  • Publication number: 20240050522
    Abstract: Accordingly, the present invention relates compositions comprising synthetic HDL (sHDL) nanoparticles, methods for synthesizing such sHDL nanoparticles, as well as systems and methods utilizing such sHDL nanoparticles (e.g., in diagnostic and/or therapeutic settings). In particular, the present invention provides compositions comprising sHDL nanoparticles for purposes of preventing, attenuating, and/or treating sepsis and sepsis related disorders in a subject, conditions and symptoms caused by a viral infection (e.g., COVID-19)) in a subject, and conditions and symptoms caused by thrombosis in a subject.
    Type: Application
    Filed: December 10, 2021
    Publication date: February 15, 2024
    Inventors: Anna Schwendeman, Hongliang He, Sang Yeop Kim, Xiang-An Li
  • Patent number: 11837404
    Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
  • Publication number: 20230384770
    Abstract: According to the present disclosure, a method of extracting a feature of measurement data using a computing apparatus may include identifying measurement data obtained during a process, identifying target data related to the measurement data, performing a computation on the measurement data based on the target data, extracting a plurality of first values by applying a max pooling layer to the computed measurement data, extracting a plurality of second values by applying a min pooling layer to the computed measurement data, and extracting a plurality of third values related to a feature of the measurement data using the plurality of first values and the plurality of second values.
    Type: Application
    Filed: February 24, 2022
    Publication date: November 30, 2023
    Inventors: Sang Yeop KIM, Jin Woo PARK
  • Publication number: 20230367793
    Abstract: Provided are a method and a device for extracting a feature value of time series data, the method including receiving time series data, segmenting the time series data into one or more segments according to preset segment types, identifying a first feature group mapped to a segment type of a first segment among the one or more segments, and extracting a value of at least one item included in the first feature group from the first segment as a feature value.
    Type: Application
    Filed: February 24, 2022
    Publication date: November 16, 2023
    Inventors: Sang Yeop KIM, Jin Woo PARK, Tae Kyung HA
  • Patent number: 11721481
    Abstract: An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A?B?0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
  • Publication number: 20230212750
    Abstract: A thin film deposition apparatus includes: a chamber configured to process a plurality of substrates; a plurality of heater members disposed to correspond to the substrates to heat the substrates; a plurality of lift pins configured to be elevated through the heater members and support lower surfaces of the substrates; a plurality of support plates on which lower ends of the lift pins are configured to be seated; a plurality of support columns coupled with and supporting the heater members; and a plurality of spray ports configured to supply a process gas to the substrates, wherein the support plates are mounted on a plurality of seats formed on at least one side of the chamber, and configured to be elevated together with the heater members when the heater members are elevated.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 6, 2023
    Applicant: HANWHA CORPORATION
    Inventors: Ram WOO, Seung Jun LEE, Sang Yeop Kim, Jin Hwan LEE, Sang Bo KIM
  • Publication number: 20230154677
    Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
  • Patent number: 11587729
    Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: February 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
  • Publication number: 20230045941
    Abstract: An electronic component is disclosed. The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.
    Type: Application
    Filed: June 22, 2022
    Publication date: February 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop KIM, Kyong Nam HWANG, Eun Ji KIM, Do Hyun AN
  • Patent number: 11393624
    Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyeong Ju Song, Beom Joon Cho, Sang Yeop Kim
  • Publication number: 20220181078
    Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
    Type: Application
    Filed: September 8, 2021
    Publication date: June 9, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
  • Publication number: 20220122772
    Abstract: An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A?B?0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.
    Type: Application
    Filed: June 9, 2021
    Publication date: April 21, 2022
    Inventors: Sang Yeop KIM, Beom Joon CHO, Gyeong Ju SONG
  • Publication number: 20220093328
    Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.
    Type: Application
    Filed: May 3, 2021
    Publication date: March 24, 2022
    Inventors: Gyeong Ju SONG, Beom Joon CHO, Sang Yeop KIM
  • Patent number: 9573631
    Abstract: A locking apparatus of a side-gate in which a locker pivotably mounted to a post binds a hook when the side-gate mounted with the hook pivots to be raised, may include a knob that is located to be spaced apart from the locker and is pivotably mounted to the post, and a link bar, one end of which is connected to the locker, and another end of which is connected to the knob, wherein rotational force generated by the knob is transmitted to pivot the locker through a link bar.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: February 21, 2017
    Assignee: Hyundai Motor Company
    Inventor: Sang-Yeop Kim
  • Patent number: 9457094
    Abstract: The present invention provides: a pharmaceutical composition having a superior physical property since fimasartan and hydrochlorothiazide, which are main components of a combination preparation, have superior content uniformity; and a preparation method thereof.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: October 4, 2016
    Assignee: Boryung Pharmaceutical Co., Ltd.
    Inventors: Je Hak Kim, Kyung Wan Nam, Seo Hun Park, Ju Won Kim, Sang Yeop Kim
  • Publication number: 20160032632
    Abstract: A locking apparatus of a side-gate in which a locker pivotably mounted to a post binds a hook when the side-gate mounted with the hook pivots to be raised, may include a knob that is located to be spaced apart from the locker and is pivotably mounted to the post, and a link bar, one end of which is connected to the locker, and another end of which is connected to the knob, wherein rotational force generated by the knob is transmitted to pivot the locker through a link bar.
    Type: Application
    Filed: December 9, 2014
    Publication date: February 4, 2016
    Applicant: Hyundai Motor Company
    Inventor: Sang-Yeop KIM
  • Publication number: 20150147394
    Abstract: The present invention provides: a pharmaceutical composition having a superior physical property since fimasartan and hydrochlorothiazide, which are main components of a combination preparation, have superior content uniformity; and a preparation method thereof.
    Type: Application
    Filed: April 30, 2013
    Publication date: May 28, 2015
    Inventors: Je Hak Kim, Kyung Wan Nam, Seo Hun Park, Ju Won Kim, Sang Yeop Kim